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54ACT11181FK

Texas Instruments

54ACT11181FK by Texas Instruments

54ACT11181FK by Texas Instruments is a digital arithmetic circuit with 4 bits, operating at a supply voltage of 5V. Featuring a propagation delay of 25.4ns, it is ideal for military-grade applications requiring fast calculations in a compact chip carrier package. With surface mount capability and CMOS technology, this device offers reliable performance in extreme temperatures from -55°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,883 parts In-Stock

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Digiode

USA . 3,603 parts In-Stock

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3,603

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Distributors (Availability)

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Andel Nordic

Denmark . 52 parts In-Stock

1+ parts

$6.838

100+ parts

-

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$6.564

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$6.564

52

$6.838

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$6.564

$6.564

AZTECH Wire

Italy . 459 parts In-Stock

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$11.729

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459

$11.729

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Parana Technologies

USA . 1,787 parts In-Stock

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$20.001

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$19.936

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1,787

$20.001

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$19.936

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ChromeModa Solutions

Germany . 1,827 parts In-Stock

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$22.473

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$18.428

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1,827

$22.473

$18.428

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IDEA Electronic Components Group

UK . 51 parts In-Stock

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$22.473

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$21.349

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$20.226

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51

$22.473

$21.349

$20.226

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One Stop Electronics

USA . 738 parts In-Stock

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$50.000

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738

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Corphita

USA . 1,816 parts In-Stock

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Northwest PG Solutions

USA . 1,584 parts In-Stock

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Native Components

USA . 266 parts In-Stock

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DigiPath Technology Company

USA . 73 parts In-Stock

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$20.262

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$20.262

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Overview

Experience unparalleled performance and reliability with the 54ACT11181FK by Texas Instruments, a leading manufacturer in digital arithmetic circuits. This cutting-edge product offers exceptional value and benefits to customers in various applications. With its advanced technology and high-quality construction, this chip carrier package ensures optimal functionality and efficiency. Trust Texas Instruments to deliver top-notch solutions for your electronic needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material provides durability and reliability for the product, ensuring long-term performance.

No. of Bits: 4

Having 4 bits allows for a moderate level of precision in digital arithmetic calculations, making it suitable for various applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making integration into existing systems easy.

No. of Terminals: 28

With 28 terminals, this product offers flexibility in connectivity options, allowing for versatile circuit configurations.

Propagation Delay (tpd): 25.4 ns

The low propagation delay of 25.4 ns ensures fast processing speeds, making this product suitable for time-sensitive applications.

Temperature Grade: MILITARY

Designed to meet military-grade standards, this product offers high reliability and performance in harsh environmental conditions.

Technology: CMOS

Being based on CMOS technology provides low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Digital Arithmetic Circuits 54ACT11181FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS

Family:

ACT

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Propagation Delay (tpd):

25.4 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.43 mm

Trade Compliance

54ACT11181FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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