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54AC11280J

Texas Instruments

54AC11280J by Texas Instruments

The Texas Instruments 54AC11280J is a CMOS digital arithmetic circuit with 9 bits, operating at supply voltages of 3.3V to 5V. It features a propagation delay of 16.2ns and operates in temperatures ranging from -55°C to 125°C. This component is commonly used in military-grade applications requiring high-speed arithmetic operations.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,871 parts In-Stock

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2,871

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Digiode

USA . 744 parts In-Stock

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744

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Distributors (Availability)

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Andel Nordic

Denmark . 405 parts In-Stock

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$5.566

100+ parts

-

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$5.343

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$5.343

405

$5.566

-

$5.343

$5.343

AZTECH Wire

Italy . 694 parts In-Stock

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$8.157

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694

$8.157

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Parana Technologies

USA . 1,899 parts In-Stock

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$23.132

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$23.770

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$23.132

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$23.770

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ChromeModa Solutions

Germany . 1,672 parts In-Stock

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$25.991

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$21.313

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$25.991

$21.313

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IDEA Electronic Components Group

UK . 771 parts In-Stock

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$25.991

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$24.691

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$23.392

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771

$25.991

$24.691

$23.392

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One Stop Electronics

USA . 1,529 parts In-Stock

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$29.000

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1,529

$29.000

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Native Components

USA . 18 parts In-Stock

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$82.820

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$79.507

18

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Northwest PG Solutions

USA . 229 parts In-Stock

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$91.102

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Corphita

USA . 1,641 parts In-Stock

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DigiPath Technology Company

USA . 628 parts In-Stock

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$23.433

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Overview

Experience superior performance and reliability with the 54AC11280J by Texas Instruments, a leading manufacturer in digital arithmetic circuits. Ideal for a wide range of applications, this product offers seamless integration and precise calculations, making it a valuable asset for your projects. With its high-quality materials and advanced technology, you can trust in the efficiency and accuracy of this component. Upgrade your systems with the 54AC11280J and unlock a world of possibilities.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides high durability and protection, making the product suitable for harsh environments.

No. of Bits: 9

With 9 bits, this product offers a moderate level of precision and accuracy in arithmetic calculations.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures consistent and reliable performance.

Propagation Delay (tpd): 16.2 ns

The low propagation delay results in fast computation speeds, ideal for applications requiring quick arithmetic operations.

Temperature Grade: MILITARY

Designed to withstand extreme temperatures, this product is suitable for military and industrial applications.

Technical Specifications

Digital Arithmetic Circuits 54AC11280J attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

ODD/EVEN PARITY GENERATOR

Family:

AC

JESD-30 Code:

R-GDIP-T14

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

9

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay (tpd):

16.2 ns

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

54AC11280J Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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