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54AC11181FK

Texas Instruments

54AC11181FK by Texas Instruments

The Texas Instruments 54AC11181FK is a CMOS digital arithmetic circuit with 4 bits, operating at supply voltages of 3.3V to 5V. With a propagation delay of 21ns, it is ideal for military-grade applications requiring fast calculations in a square chip carrier package. The device features surface mount capability and operates within a wide temperature range from -55°C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,684 parts In-Stock

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6,684

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Digiode

USA . 2,052 parts In-Stock

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2,052

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 163 parts In-Stock

1+ parts

$0.548

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163

$0.548

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Northwest PG Solutions

USA . 371 parts In-Stock

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$0.602

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371

$0.602

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Andel Nordic

Denmark . 313 parts In-Stock

1+ parts

$3.900

100+ parts

-

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$3.744

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$3.744

313

$3.900

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$3.744

$3.744

One Stop Electronics

USA . 495 parts In-Stock

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$10.000

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495

$10.000

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AZTECH Wire

Italy . 652 parts In-Stock

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$18.896

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652

$18.896

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Parana Technologies

USA . 1,767 parts In-Stock

1+ parts

$25.218

100+ parts

$2,341.888

1k+ parts

$22.696

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1,767

$25.218

$2,341.888

$22.696

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DigiPath Technology Company

USA . 1,532 parts In-Stock

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$27.768

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1,532

$27.768

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ChromeModa Solutions

Germany . 769 parts In-Stock

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$28.335

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$23.235

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769

$28.335

$23.235

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IDEA Electronic Components Group

UK . 333 parts In-Stock

1+ parts

$28.335

100+ parts

$26.918

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$25.502

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333

$28.335

$26.918

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Corphita

USA . 2,191 parts In-Stock

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Overview

Enhance your digital arithmetic circuits with the reliable and high-quality 54AC11181FK by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products that guarantee optimal performance and durability. Ideal for various applications, this square chip carrier offers customers unmatched value and benefits. Upgrade your projects with ease and efficiency using this innovative solution that will take your digital arithmetic circuits to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed cofired package body material ensures durability and reliability, making this product suitable for a wide range of applications.

No. of Bits: 4

With a 4-bit design, this digital arithmetic circuit is capable of processing a moderate amount of data efficiently.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power systems and offers stable performance.

Propagation Delay (tpd): 21 ns

The low propagation delay of 21 ns ensures fast processing speed, making this circuit ideal for applications requiring quick responses.

Temperature Grade: MILITARY

Designed for military-grade applications, this circuit can withstand extreme temperature conditions, ensuring reliable operation in harsh environments.

Technical Specifications

Digital Arithmetic Circuits 54AC11181FK attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

Additional Features:

CAPABLE OF 16 LOGIC & ARITHMETIC OPERATIONS

Family:

AC

JESD-30 Code:

S-CQCC-N28

Length:

11.43 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3/5

Propagation Delay (tpd):

21 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.03 mm

Sub-Category:

Arithmetic Circuits

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

11.43 mm

Trade Compliance

54AC11181FK Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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