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SN74L85JP4

Texas Instruments

SN74L85JP4 by Texas Instruments

SN74L85JP4 by Texas Instruments is a TTL digital arithmetic circuit with 14 terminals in an in-line rectangular ceramic package. It operates b/w 0°C to 70°C, making it suitable for commercial applications requiring precise calculations and logic operations. With a terminal pitch of 2.54mm, this component is ideal for through-hole mounting in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,176 parts In-Stock

1+ parts

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5,176

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Digiode

USA . 411 parts In-Stock

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411

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Distributors (Availability)

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AZTECH Wire

Italy . 800 parts In-Stock

1+ parts

$5.096

100+ parts

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800

$5.096

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Parana Technologies

USA . 49 parts In-Stock

1+ parts

$29.454

100+ parts

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1k+ parts

$59.552

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49

$29.454

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$59.552

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DigiPath Technology Company

USA . 1,110 parts In-Stock

1+ parts

$32.432

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1,110

$32.432

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ChromeModa Solutions

Germany . 2,762 parts In-Stock

1+ parts

$33.094

100+ parts

$27.137

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2,762

$33.094

$27.137

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IDEA Electronic Components Group

UK . 1,053 parts In-Stock

1+ parts

$33.094

100+ parts

$31.439

1k+ parts

$29.785

10k+ parts

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1,053

$33.094

$31.439

$29.785

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Andel Nordic

Denmark . 1,854 parts In-Stock

1+ parts

$41.095

100+ parts

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$39.451

10k+ parts

$39.451

1,854

$41.095

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$39.451

$39.451

One Stop Electronics

USA . 421 parts In-Stock

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$48.000

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421

$48.000

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Corphita

USA . 2,973 parts In-Stock

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2,973

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Overview

Unleash the power of cutting-edge technology with the SN74L85JP4 by Texas Instruments. Crafted with precision and expertise, this digital arithmetic circuit offers unparalleled performance and reliability. Whether you're designing complex systems or simplifying everyday tasks, this product is the perfect solution. With a wide range of applications in various industries, the SN74L85JP4 provides value, efficiency, and innovation to customers looking to stay ahead of the curve. Trust in Texas Instruments to deliver quality products that exceed expectations and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic material provides excellent thermal resistance and shock resistance, making this product suitable for high temperature environments.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration and efficient use of space in circuit board design.

No. of Terminals: 14

Having 14 terminals allows for versatile connectivity options and compatibility with various circuit configurations.

Package Style (Meter): IN-LINE

In-line package style offers easy installation and connection in a linear layout, simplifying circuit assembly.

Maximum Operating Temperature: 70 °C

High maximum operating temperature ensures reliability and stability in demanding operating conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in a wide range of environments, from cold to hot.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved signal integrity, reducing the risk of signal loss or interference.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates that this product is suitable for standard commercial applications, offering reliable performance in typical operating conditions.

Technology: TTL

TTL technology ensures fast and efficient digital signal processing, making this product ideal for high-speed arithmetic calculations.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy soldering and connection to the circuit board, ensuring secure and stable mounting.

Terminal Pitch: 2.54 mm

With a terminal pitch of 2.54 mm, this product offers compatibility with standard spacing on circuit boards, simplifying integration into various designs.

Technical Specifications

Digital Arithmetic Circuits SN74L85JP4 attributes and parameters. Explore more Digital Arithmetic Circuits devices from Texas Instruments

Specs

JESD-30 Code:

R-XDIP-T14

Logic IC Type:

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Sub-Category:

Arithmetic Circuits

Surface Mount:

NO

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

SN74L85JP4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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