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ZPSD211R-B-90JI

STMicroelectronics

ZPSD211R-B-90JI by STMicroelectronics

ZPSD211R-B-90JI by STMicroelectronics is a versatile parallel I/O port with a max supply voltage of 5.5V and operates in industrial temperatures from -40 °C to 85°C. It features 19 I/O lines and a compact chip carrier design, ideal for embedded applications. This CMOS device ensures efficient performance with minimal standby current.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,300 parts In-Stock

1+ parts

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2,300

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Digiode

USA . 2,165 parts In-Stock

1+ parts

-

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-

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2,165

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Anansix

USA . 644 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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644

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PC Components Company LLC

USA . 18 parts In-Stock

1+ parts

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-

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18

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Bristol Electronics

USA . 18 parts In-Stock

1+ parts

-

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18

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 822 parts In-Stock

1+ parts

$27.752

100+ parts

-

1k+ parts

-

10k+ parts

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822

$27.752

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-

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IDEA Electronic Components Group

UK . 1,323 parts In-Stock

1+ parts

$42.580

100+ parts

-

1k+ parts

$38.322

10k+ parts

-

1,323

$42.580

-

$38.322

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MKK Technologies

India . 944 parts In-Stock

1+ parts

$80.070

100+ parts

-

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944

$80.070

-

-

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DigiPath Technology Company

USA . 944 parts In-Stock

1+ parts

$80.070

100+ parts

-

1k+ parts

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944

$80.070

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Corphita

USA . 3,346 parts In-Stock

1+ parts

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3,346

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Parana Technologies

USA . 1,022 parts In-Stock

1+ parts

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100+ parts

$50.911

1k+ parts

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1,022

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$50.911

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Overview

Unlock the full potential of your applications with the ZPSD211R-B-90JI from STMicroelectronics, a trusted leader in innovative technology. This high-quality parallel I/O port solution is designed for versatility and reliability, ensuring seamless integration into various industrial systems. With its robust performance and efficient power management, it not only enhances operational efficiency but also boosts product longevity. Experience unmatched value and performance that drives your projects to success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, this material ensures effective insulation and protection, making it suitable for various industrial applications.

Surface Mount: YES

Surface mount technology allows for a compact design, facilitating high-density circuit board layouts and enhancing space efficiency.

Maximum Supply Voltage: 5.5 V

The flexibility in supply voltage makes it compatible with a wide range of electronic systems, ensuring versatile integration.

Package Shape: SQUARE

A square package shape optimizes layout space on a PCB, allowing for a more efficient arrangement of components.

Power Supplies (V): 5

Standard 5V operation aligns with common power supply requirements in many electronic devices, simplifying system design.

No. of Terminals: 44

A higher number of terminals allows for greater connectivity options, providing flexibility in design and functionality.

Package Style (Meter): CHIP CARRIER

Chip carriers are designed for enhanced thermal dissipation and better performance in high-frequency applications.

Minimum Supply Voltage: 4.5 V

This lower supply voltage ensures compatibility with extended battery life applications and energy-efficient designs.

Maximum Operating Temperature: 85 °C

Withstand high temperatures for reliable operation in various industrial environments, making it suitable for demanding applications.

Minimum Operating Temperature: -40 °C

Able to function in extreme cold, enhancing reliability in diverse climates and harsh environments.

Terminal Finish: TIN LEAD

Tin-lead finishes provide good solderability, ensuring reliable connections vital for long-term performance.

Ultraviolet Erasable: N

The absence of ultraviolet erasability indicates a focus on stability and endurance, making it ideal for permanent applications.

Terminal Position: QUAD

Quad terminal positioning offers improved electrical performance and reduces parasitic inductance.

No. of Ports: 3

Multiple ports enhance data handling capabilities, suitable for applications requiring parallel communications.

Maximum Seated Height: 4.57 mm

A low profile minimizes space usage on a motherboard, enabling more compact device designs.

Width: 16.5862 mm

Compact width supports space-efficient design, particularly beneficial in high-density applications.

Length: 16.5862 mm

The square dimensions contribute to ease of integration and uniform layout planning on PCBs.

Temperature Grade: INDUSTRIAL

Designed to meet industrial standards, ensuring reliability and performance in challenging conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Versatile peripheral type allows for diverse applications, from simple control tasks to complex data communications.

ROM Bits Size: 262144 Bits

Large ROM size provides substantial memory for data handling, enhancing the product's functionality in storage applications.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed operation, making the device energy-efficient and ideal for portable devices.

Terminal Form: J BEND

J bend terminals facilitate easy mounting and soldering, ensuring stability in various PCB configurations.

Nominal Supply Voltage: 5 V

Aligning with standard voltage requirements, this product ensures compatibility with most existing hardware.

Terminal Pitch: 1.27 mm

A standard pitch allows for compatibility with many PCB layouts, simplifying integration into existing systems.

Maximum Standby Current: 0.00002 Amp

Extremely low standby current enhances energy efficiency, making it ideal for battery-operated devices.

Maximum Access Time: 0.00000009 ns

High-speed access time maximizes performance, ensuring rapid data processing and communication.

No. of I/O Lines: 19

A generous number of I/O lines allows for comprehensive data exchange capabilities, facilitating complex applications.

Technical Specifications

Parallel I/O Ports ZPSD211R-B-90JI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000009 ns

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

Length:

16.5862 mm

No. of I/O Lines:

19

No. of Ports:

3

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

262144 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

ZPSD211R-B-90JI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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