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ZPSD211RV-B-20JI

STMicroelectronics

ZPSD211RV-B-20JI by STMicroelectronics

ZPSD211RV-B-20JI by STMicroelectronics is a versatile parallel I/O port with a max supply voltage of 5.5V and operates in industrial temperatures from -40 °C to 85°C. It features 19 I/O lines and a compact chip carrier design. Ideal for general-purpose applications, it ensures efficient data handling in embedded systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,967 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,967

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-

-

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Vyrian

USA . 1,433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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1,433

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Anansix

USA . 433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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433

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 138 parts In-Stock

1+ parts

$30.630

100+ parts

-

1k+ parts

$27.567

10k+ parts

-

138

$30.630

-

$27.567

-

MKK Technologies

India . 1,985 parts In-Stock

1+ parts

$57.599

100+ parts

-

1k+ parts

-

10k+ parts

-

1,985

$57.599

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-

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DigiPath Technology Company

USA . 1,985 parts In-Stock

1+ parts

$57.599

100+ parts

-

1k+ parts

-

10k+ parts

-

1,985

$57.599

-

-

-

Corohmni

South Africa . 923 parts In-Stock

1+ parts

$60.501

100+ parts

-

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923

$60.501

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Corphita

USA . 4,635 parts In-Stock

1+ parts

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4,635

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Parana Technologies

USA . 392 parts In-Stock

1+ parts

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100+ parts

$36.623

1k+ parts

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10k+ parts

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392

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$36.623

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Overview

Unlock unparalleled performance and versatility with the ZPSD211RV-B-20JI from STMicroelectronics, a leader in cutting-edge technology. Engineered for reliability in industrial applications, this parallel I/O port excels in demanding environments, ensuring efficient data management with minimal power consumption. Benefit from its robust design and superior quality that promise longevity and seamless integration into your systems, elevating your projects to new heights of innovation and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures reliable performance and longevity in various environments.

Surface Mount: YES

Surface mount technology allows for a compact design, saving space on the PCB and facilitating automated assembly.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for various power supply configurations.

Package Shape: SQUARE

The square package shape is efficient for symmetrical placement on PCBs, optimizing layout and thermal performance.

Power Supplies (V): 3

The product operates with a three-volt power supply, which is common and facilitates compatibility with various systems.

No. of Terminals: 44

With 44 terminals, this product can handle multiple connections, providing versatility for complex applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is suitable for high-density applications and improves thermal and electrical performance.

Minimum Supply Voltage: 2.7 V

A minimum supply voltage of 2.7 V allows it to function efficiently in lower power scenarios, enhancing battery life.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in industrial environments where heat may be a concern.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, it is capable of functioning in extreme conditions, making it suitable for outdoor and harsh environments.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and reliability during assembly and operation.

Ultraviolet Erasable: N

Not being ultraviolet erasable indicates a traditional memory approach, which can lead to improved stability for applications where reprogramming is not needed.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing on PCBs, resulting in enhanced design flexibility.

No. of Ports: 3

Having three ports allows for multiple parallel connections, facilitating communication with various peripherals.

Maximum Seated Height: 4.57 mm

The low seated height contributes to a slim profile, which is beneficial in space-constrained designs.

Width: 16.5862 mm

The compact width maximizes board space utility, making it easier to design densely packed circuit layouts.

Length: 16.5862 mm

The matched length to width ensures a square form factor which can be advantageous for layout symmetry.

Temperature Grade: INDUSTRIAL

The industrial temperature grade guarantees robustness and reliability, suited for demanding applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose parallel I/O port IC makes it versatile for a wide range of electronic applications.

ROM Bits Size: 262144 Bits

A significant ROM size of 262144 bits enables complex data storage and processing, beneficial for advanced applications.

Technology: CMOS

The use of CMOS technology enhances power efficiency and performance, making it a suitable choice for low-power applications.

Terminal Form: J BEND

J bend terminals provide a reliable connection point, facilitating secure soldering and enhancing PCB integrity.

Nominal Supply Voltage: 3 V

Operating nominally at 3 V strikes a balance between power efficiency and performance, making it suitable for various devices.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for closer component placement, ideal for reducing PCB size while maintaining functionality.

Maximum Standby Current: 0.000005 Amp

An extremely low standby current helps in conserving power, which is crucial for battery-operated devices.

Maximum Access Time: 0.0000002 ns

Fast access time ensures high-speed data retrieval and responsiveness, critical for performance-sensitive applications.

No. of I/O Lines: 19

With 19 I/O lines, this product supports multiple input/output connections, making it versatile for various interfacing needs.

Technical Specifications

Parallel I/O Ports ZPSD211RV-B-20JI attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.0000002 ns

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

Length:

16.5862 mm

No. of I/O Lines:

19

No. of Ports:

3

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3

Qualification:

Not Qualified

ROM Bits Size:

262144 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.000005 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

ZPSD211RV-B-20JI Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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