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ZPSD301-15LMB

STMicroelectronics

ZPSD301-15LMB by STMicroelectronics

ZPSD301-15LMB by STMicroelectronics is a military-grade CMOS parallel I/O port with 19 I/O lines, operating b/w -55 °C and 125°C. It features a ceramic, metal-sealed package and supports a supply voltage of 4.5V to 5.5V. Ideal for general-purpose applications in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,524 parts In-Stock

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4,524

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Anansix

USA . 1,983 parts In-Stock

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1,983

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Vyrian

USA . 1,014 parts In-Stock

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1,014

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,931 parts In-Stock

1+ parts

$34.464

100+ parts

-

1k+ parts

$31.018

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1,931

$34.464

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$31.018

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MKK Technologies

India . 554 parts In-Stock

1+ parts

$64.808

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554

$64.808

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DigiPath Technology Company

USA . 554 parts In-Stock

1+ parts

$64.808

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554

$64.808

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Corphita

USA . 1,820 parts In-Stock

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1,820

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Parana Technologies

USA . 771 parts In-Stock

1+ parts

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$41.207

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771

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$41.207

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Overview

Elevate your designs with the ZPSD301-15LMB by STMicroelectronics, a top-tier solution for parallel I/O applications. Renowned for their excellence and innovation, STMicroelectronics delivers unmatched reliability in every component. This robust chip thrives in extreme temperatures, ensuring durability in military and industrial contexts. Benefit from its advanced functionality and ease of integration, making it the ideal choice for demanding projects that require precision and performance.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired construction enhances reliability, making it ideal for harsh environments.

Surface Mount: YES

Surface mount capability allows for efficient space utilization on PCBs, facilitating compact design.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, it offers flexibility in power supply configurations.

Package Shape: SQUARE

The square package shape allows for uniform placement and optimal thermal management on the PCB.

No. of Terminals: 44

The 44 terminals provide ample connectivity options, accommodating more I/O operations.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier design improves accessibility for testing and enhances the overall performance of the device.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures compatibility with standard systems while maintaining performance.

Maximum Operating Temperature: 125 °C

Rated for high temperatures up to 125 °C, it is suitable for demanding industrial applications.

Minimum Operating Temperature: -55 °C

Its operation down to -55 °C makes this product ideal for extreme environments, such as aerospace and military applications.

Terminal Finish: GOLD

Gold terminal finish provides excellent conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: QUAD

The quad terminal position facilitates efficient layout and connection in high-density applications.

No. of Ports: 3

Three ports increase the versatility and expand functionality for various parallel I/O needs.

Maximum Seated Height: 4.57 mm

A low seated height helps reduce the overall profile of the device, fitting well in space-constrained designs.

Width: 16.51 mm

A compact width enhances design flexibility and allows for denser PCB layouts.

Length: 16.51 mm

The standardized length makes integration into existing systems easier and ensures compatibility with PCB designs.

Temperature Grade: MILITARY

Military-grade specifications ensure high reliability and robustness, essential for mission-critical applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Ideal for general-purpose applications, making this component versatile for various uses in electronic projects.

Technology: CMOS

The CMOS technology provides low power consumption while maintaining high performance for data processing tasks.

Terminal Form: J BEND

J bend terminals simplify the soldering process and improve the mechanical stability of the connections.

Nominal Supply Voltage: 5 V

With a nominal supply voltage of 5 V, this product aligns with many standard digital logic levels for easy integration.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for a compact and organized layout on printed circuit boards.

No. of I/O Lines: 19

Having 19 I/O lines provides substantial data transfer capabilities, catering to complex operations.

Technical Specifications

Parallel I/O Ports ZPSD301-15LMB attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

JESD-30 Code:

S-CQCC-J44

JESD-609 Code:

e4

Length:

16.51 mm

No. of I/O Lines:

19

No. of Ports:

3

No. of Terminals:

44

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Qualification:

Not Qualified

Maximum Seated Height:

4.57 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

16.51 mm

Peripheral IC Type:

Trade Compliance

ZPSD301-15LMB Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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