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ZPSD211R-B-15M

STMicroelectronics

ZPSD211R-B-15M by STMicroelectronics

ZPSD211R-B-15M by STMicroelectronics is a versatile parallel I/O port IC with 19 I/O lines and operates at a nominal voltage of 5V. It features a compact flatpack design, ideal for space-constrained applications. With a max access time of 150 ns, it ensures efficient data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,803 parts In-Stock

1+ parts

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2,803

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Anansix

USA . 2,010 parts In-Stock

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2,010

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Digiode

USA . 226 parts In-Stock

1+ parts

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226

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 4,952 parts In-Stock

1+ parts

$31.137

100+ parts

-

1k+ parts

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10k+ parts

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4,952

$31.137

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IDEA Electronic Components Group

UK . 635 parts In-Stock

1+ parts

$35.357

100+ parts

-

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$31.821

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635

$35.357

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$31.821

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MKK Technologies

India . 717 parts In-Stock

1+ parts

$66.486

100+ parts

-

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717

$66.486

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DigiPath Technology Company

USA . 717 parts In-Stock

1+ parts

$66.486

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717

$66.486

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Corphita

USA . 4,352 parts In-Stock

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4,352

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Parana Technologies

USA . 1,266 parts In-Stock

1+ parts

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$42.274

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1,266

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$42.274

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Overview

Unlock endless possibilities with the ZPSD211R-B-15M from STMicroelectronics. Renowned for exceptional quality and innovation, STMicroelectronics delivers a versatile parallel I/O port solution that enhances your designs with reliable performance and low power consumption. Perfect for embedded systems, industrial controls, and consumer electronics, this product ensures efficiency and longevity, empowering you to stay ahead in today’s competitive market. Experience the excellence that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy ensures reliability and longevity, making this product well-suited for various applications.

Surface Mount: YES

Surface mount technology enables compact design and efficient production, ideal for modern circuit board designs.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V allows it to work well within common low-voltage systems, enhancing compatibility.

Package Shape: SQUARE

The square package shape optimizes space on PCB layouts, facilitating easier component placement and assembly.

Power Supplies (V): 5

Operating on a standard 5V supply voltage simplifies integration with widely used electronic components.

No. of Terminals: 44

A high number of terminals (44) provides extensive connectivity options for versatile applications.

Package Style (Meter): FLATPACK

The flatpack style contributes to lower profile designs, making it suitable for space-constrained applications.

Minimum Supply Voltage: 4.5 V

The minimum supply voltage of 4.5V ensures reliable operation across a range of power scenarios.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is reliable in moderately high-temperature environments.

Minimum Operating Temperature: 0 °C

The ability to operate at 0 °C expands its usability in various environmental conditions.

Terminal Finish: TIN LEAD

Tin-lead terminal finish enhances solderability and ensures reliable electrical connections.

Terminal Position: QUAD

The quad terminal position allows for efficient routing on circuit boards, improving design flexibility.

No. of Ports: 3

With 3 ports, this product allows for multiple data channels, enhancing overall functionality.

Maximum Seated Height: 2.35 mm

A low seated height contributes to space efficiency on PCB boards, promoting compact designs.

Width: 10 mm

A width of 10mm offers a balanced size for compact devices while maintaining stability in mounting.

Length: 10 mm

A uniform length of 10mm facilitates easy integration into design layouts, ensuring compatibility.

Temperature Grade: COMMERCIAL

Commercial temperature grades indicate suitability for general consumer applications, ensuring a broad market appeal.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

This versatile design as a general purpose parallel I/O port supports various applications, enhancing its utility.

ROM Bits Size: 262144 Bits

A ROM size of 262144 bits provides substantial memory capacity for data storage needs.

Technology: CMOS

CMOS technology ensures low power consumption and high-speed performance, making it ideal for efficient designs.

Terminal Form: GULL WING

The gull-wing terminal form aids in surface mounting and enhances the strength of the solder joint.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V is standard in digital electronics, facilitating easy integration.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch aligns well with modern PCB design practices, promoting effective layout strategies.

Maximum Standby Current: 0.00002 Amp

A very low maximum standby current helps in minimizing power consumption, making it energy-efficient.

Maximum Access Time: 0.00000015 ns

A rapid access time of 0.15 ns ensures high-speed data retrieval and processing capabilities.

No. of I/O Lines: 19

Having 19 I/O lines allows for extensive data communication capabilities, catering to complex applications.

Technical Specifications

Parallel I/O Ports ZPSD211R-B-15M attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e0

Length:

10 mm

No. of I/O Lines:

19

No. of Ports:

3

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.5SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

262144 Bits

Maximum Seated Height:

2.35 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ZPSD211R-B-15M Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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