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ZPSD211RV-B-20L

STMicroelectronics

ZPSD211RV-B-20L by STMicroelectronics

ZPSD211RV-B-20L by STMicroelectronics is a versatile parallel I/O port with a max supply voltage of 5.5V and operates in temperatures up to 70 °C. It features 19 I/O lines, 262144 bits ROM, and is ideal for general-purpose applications. Its compact ceramic package ensures reliable performance in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,726 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,726

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-

-

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Vyrian

USA . 3,821 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,821

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Anansix

USA . 2,856 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,856

-

-

-

-

DF Sales Co.

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6

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-

-

-

DF Sales Co.

USA . 6 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1,092 parts In-Stock

1+ parts

$44.958

100+ parts

-

1k+ parts

-

10k+ parts

-

1,092

$44.958

-

-

-

IDEA Electronic Components Group

UK . 1,840 parts In-Stock

1+ parts

$49.470

100+ parts

-

1k+ parts

$44.523

10k+ parts

-

1,840

$49.470

-

$44.523

-

MKK Technologies

India . 1,898 parts In-Stock

1+ parts

$93.026

100+ parts

-

1k+ parts

-

10k+ parts

-

1,898

$93.026

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-

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DigiPath Technology Company

USA . 1,898 parts In-Stock

1+ parts

$93.026

100+ parts

-

1k+ parts

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10k+ parts

-

1,898

$93.026

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Parana Technologies

USA . 2,237 parts In-Stock

1+ parts

-

100+ parts

$59.149

1k+ parts

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10k+ parts

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2,237

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$59.149

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Corphita

USA . 1,187 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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1,187

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Overview

Unlock the potential of your projects with the ZPSD211RV-B-20L from STMicroelectronics. Renowned for its exceptional quality and reliability, this versatile parallel I/O port is perfect for a range of applications, from consumer electronics to industrial automation. Its compact design ensures seamless integration while delivering robust performance under various conditions. Choose STMicroelectronics for trusted innovation that enhances efficiency, reduces costs, and elevates your product's capabilities!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed construction ensures enhanced reliability and protection against environmental factors, making this product suitable for demanding applications.

Surface Mount: YES

The surface mount capability allows for easy integration onto printed circuit boards, saving space and improving assembly efficiency.

Maximum Supply Voltage: 5.5 V

A maximum supply voltage of 5.5V provides flexibility in application design while protecting the device from over-voltage situations.

Package Shape: SQUARE

The square shape facilitates compact layout designs and efficient use of board space.

Power Supplies (V): 3

Utilizing multiple power supplies improves versatility in application settings, supporting a range of system requirements.

No. of Terminals: 44

Having 44 terminals increases connectivity options and expands functionality for diverse applications.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances heat dissipation, improving performance and reliability in high-performance environments.

Minimum Supply Voltage: 2.7 V

The lower minimum supply voltage allows for operation in low-power environments, optimizing energy efficiency.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is suitable for industrial applications that may experience elevated temperatures.

Minimum Operating Temperature: 0 °C

Operational from 0 °C ensures reliability in a variety of temperatures, making it suitable for diverse applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish provides excellent solderability and reliability for longer-lasting connections.

Ultraviolet Erasable: Y

The ability to be UV erasable adds convenience for reprogramming and debugging, enhancing user experience.

Terminal Position: QUAD

Quad terminal positioning improves connectivity and integration options with other devices on the PCB.

No. of Ports: 3

Three ports provide increased data handling capacity, allowing simultaneous connections and improving throughput.

Maximum Seated Height: 4.57 mm

The low seated height contributes to compact design possibilities, making it an ideal choice for space-constrained applications.

Width: 16.51 mm

A compact width enhances design flexibility and fits within tighter layouts on PCBs.

Length: 16.51 mm

A matching length of 16.51 mm allows for efficient integration and uniformity in packaging design.

Temperature Grade: COMMERCIAL

Classified as commercial grade, this product is suitable for a wide range of everyday applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

This IC type provides versatility, making it useful for various applications that require parallel data transfer.

ROM Bits Size: 262144 Bits

With a ROM size of 262,144 bits, it offers adequate memory capacity for typical applications.

Technology: CMOS

The CMOS technology used ensures low power consumption and high-speed operation, thus enhancing overall efficiency.

Terminal Form: J BEND

J-bend terminal forms facilitate secure mounting and improved stability on PCBs.

Nominal Supply Voltage: 3 V

Running at a nominal voltage of 3V is beneficial for low-power applications and extends battery life.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between compactness and ease of soldering.

Maximum Standby Current: 0.000005 Amp

The very low standby current minimizes power consumption, making it suitable for energy-efficient designs.

Maximum Access Time: 0.0000002 ns

Ultra-fast access time enables high-speed data transfer, improving overall system performance.

No. of I/O Lines: 19

With 19 I/O lines, this product can accommodate multiple data paths, increasing its usability in diverse applications.

Technical Specifications

Parallel I/O Ports ZPSD211RV-B-20L attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.0000002 ns

JESD-30 Code:

S-CQCC-J44

JESD-609 Code:

e0

Length:

16.51 mm

No. of I/O Lines:

19

No. of Ports:

3

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

3

Qualification:

Not Qualified

ROM Bits Size:

262144 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.000005 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

16.51 mm

Peripheral IC Type:

Trade Compliance

ZPSD211RV-B-20L Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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