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ZPSD211R-B-15L

STMicroelectronics

ZPSD211R-B-15L by STMicroelectronics

ZPSD211R-B-15L by STMicroelectronics is a versatile parallel I/O port with a max supply voltage of 5.5V and operates in temperatures from 0 °C to 70°C. It features 19 I/O lines, making it ideal for general-purpose applications. Its ceramic, metal-sealed package ensures durability and reliability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,776 parts In-Stock

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3,776

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Digiode

USA . 3,088 parts In-Stock

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3,088

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Anansix

USA . 2,331 parts In-Stock

1+ parts

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2,331

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Prism Electronics

USA . 24 parts In-Stock

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24

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 819 parts In-Stock

1+ parts

$22.105

100+ parts

-

1k+ parts

$19.894

10k+ parts

-

819

$22.105

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$19.894

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MKK Technologies

India . 114 parts In-Stock

1+ parts

$41.567

100+ parts

-

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114

$41.567

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DigiPath Technology Company

USA . 114 parts In-Stock

1+ parts

$41.567

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114

$41.567

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Corphita

USA . 3,294 parts In-Stock

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3,294

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Parana Technologies

USA . 2,168 parts In-Stock

1+ parts

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$26.430

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2,168

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$26.430

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Perfect Parts

USA . 27 parts In-Stock

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Overview

Unlock unmatched performance and versatility with the ZPSD211R-B-15L from STMicroelectronics, a leader in innovative semiconductor solutions. This high-quality parallel I/O port is designed for reliability and efficiency, making it ideal for a variety of applications, from industrial automation to consumer electronics. Experience the advantages of its robust construction and advanced technology, ensuring seamless integration and exceptional functionality in your projects. Elevate your designs with STMicroelectronics—where quality meets innovation!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired construction provides excellent protection against environmental factors, ensuring reliability in demanding applications.

Surface Mount: YES

Surface mount technology allows for compact designs and easier integration into modern electronic circuits, making it a convenient choice for designers.

Maximum Supply Voltage: 5.5 V

The 5.5 V maximum supply voltage offers flexibility in power supply choices while ensuring safe operation within the specified range.

Package Shape: SQUARE

The square package shape provides uniformity in layout and routing on PCBs, facilitating easier design and assembly.

Power Supplies (V): 5

A standard 5 V power supply is commonly used in many applications, ensuring compatibility with a wide range of systems.

No. of Terminals: 44

Having 44 terminals allows for extensive connectivity options, suitable for complex applications that require many ports.

Package Style (Meter): CHIP CARRIER

The chip carrier style is ideal for high-density mounting, optimizing space on PCBs and enhancing performance in parallel I/O operations.

Minimum Supply Voltage: 4.5 V

This product can operate efficiently with a minimum supply voltage of 4.5 V, ensuring energy efficiency in lower power applications.

Maximum Operating Temperature: 70 °C

The ability to function at a maximum of 70 °C makes this component suitable for various commercial and industrial environments.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this product is suitable for a wide range of operational environments.

Terminal Finish: TIN LEAD

Tin-lead terminal finish ensures excellent solderability and corrosion resistance, promoting durability in connections.

Ultraviolet Erasable: Y

The ability to be erased using ultraviolet light adds versatility, allowing for reprogramming in certain applications.

Terminal Position: QUAD

Quad terminal position arrangement optimizes space and enhances connectivity options in compact PCB designs.

No. of Ports: 3

Three ports provide ample connectivity for multiple devices, making this parallel I/O port suitable for various applications.

Maximum Seated Height: 4.57 mm

A low maximum seated height allows for designs where space is at a premium, fitting easily into constrained environments.

Width: 16.51 mm

The compact width facilitates integration into small form-factor designs without compromising functionality.

Length: 16.51 mm

Similar to the width, the length ensures that this product can fit into tight spaces while maintaining high performance.

Temperature Grade: COMMERCIAL

Being commercially graded indicates suitability for broader usage, making this component ideal for consumer and industrial applications.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

This versatility allows it to be used in a variety of applications, enhancing its relevance across different industries.

ROM Bits Size: 262144 Bits

A substantial ROM bit size ensures sufficient storage capacity for complex data operations, making it suitable for advanced applications.

Technology: CMOS

CMOS technology ensures efficient power consumption and high-speed operation, crucial for modern electronic devices.

Terminal Form: J BEND

J bend terminals simplify assembly processes, promoting ease of use in manufacturing.

Nominal Supply Voltage: 5 V

Standard nominal supply voltage ensures compatibility with mainstream electronic systems, simplifying integration.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for high-density connections without compromising performance or reliability.

Maximum Standby Current: 0.00002 Amp

Very low standby current enhances energy efficiency, minimizing power consumption during idle times.

Maximum Access Time: 0.00000015 ns

Remarkably fast access time ensures rapid data processing, essential for performance-critical applications.

No. of I/O Lines: 19

With 19 I/O lines, this product is capable of handling multiple signals concurrently, improving throughput for parallel data tasks.

Technical Specifications

Parallel I/O Ports ZPSD211R-B-15L attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000015 ns

JESD-30 Code:

S-CQCC-J44

JESD-609 Code:

e0

Length:

16.51 mm

No. of I/O Lines:

19

No. of Ports:

3

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

262144 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

Y

Width:

16.51 mm

Peripheral IC Type:

Trade Compliance

ZPSD211R-B-15L Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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