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ZPSD301-70M

STMicroelectronics

ZPSD301-70M by STMicroelectronics

ZPSD301-70M by STMicroelectronics is a CMOS parallel I/O port with 19 I/O lines, operating b/w 4.5V and 5.5V. It features a compact flatpack design with 44 terminals and operates at temperatures up to 70 °C. Ideal for general-purpose applications in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,193 parts In-Stock

1+ parts

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2,193

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Digiode

USA . 1,856 parts In-Stock

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1,856

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Anansix

USA . 1,792 parts In-Stock

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1,792

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 417 parts In-Stock

1+ parts

$63.293

100+ parts

-

1k+ parts

$56.964

10k+ parts

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417

$63.293

-

$56.964

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Corohmni

South Africa . 2,508 parts In-Stock

1+ parts

$73.099

100+ parts

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2,508

$73.099

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MKK Technologies

India . 1,237 parts In-Stock

1+ parts

$119.019

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1,237

$119.019

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DigiPath Technology Company

USA . 1,237 parts In-Stock

1+ parts

$119.019

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1,237

$119.019

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Corphita

USA . 1,965 parts In-Stock

1+ parts

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1,965

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Parana Technologies

USA . 1,407 parts In-Stock

1+ parts

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100+ parts

$75.677

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1,407

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$75.677

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Overview

Unlock the potential of your electronic designs with the ZPSD301-70M from STMicroelectronics, a leader in innovation and quality. This versatile parallel I/O port enhances connectivity and flexibility, making it ideal for diverse applications, from industrial automation to consumer electronics. With a robust design and reliable performance, you can trust STMicroelectronics to deliver exceptional value, ensuring your projects are efficient, scalable, and future-ready. Upgrade your systems today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material enhances durability and reliability, making the product suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for compact designs and efficient space utilization on PCBs.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage provides flexibility in power supply options and enhances device compatibility.

Package Shape: SQUARE

The square package shape promotes uniformity in design and eases integration into various layouts.

No. of Terminals: 44

With 44 terminals, this product offers ample connectivity options for diverse applications.

Package Style (Meter): FLATPACK

The flatpack design facilitates easier soldering and assembly processes, making it user-friendly.

Minimum Supply Voltage: 4.5 V

This range of minimum supply voltage ensures stability while allowing for battery-operated applications.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliability in moderate to high-temperature environments.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, it is suitable for a wide range of operating conditions.

Terminal Finish: TIN

Tin terminal finish provides excellent solderability and corrosion resistance, ensuring long-lasting performance.

Terminal Position: QUAD

The quad terminal position facilitates easier routing and connections in circuit designs.

No. of Ports: 3

Three ports provide multifunctionality, allowing for versatile communication in parallel I/O applications.

Maximum Seated Height: 2.35 mm

A low seated height of 2.35 mm allows for slim design profiles, ideal for space-constrained devices.

Width: 10 mm

The compact 10 mm width makes it suitable for miniaturized electronic devices and circuit boards.

Length: 10 mm

The 10 mm length matches the width, promoting a square footprint for efficient space usage.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates suitability for general-purpose applications without extreme conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, it can handle various tasks, enhancing its applicability in different projects.

Technology: CMOS

CMOS technology offers low power consumption and high-speed performance, making it a modern choice for I/O applications.

Terminal Form: GULL WING

Gull wing terminals simplify the soldering process, improving assembly efficiency and reliability.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5 V aligns with standard electronic systems, easing integration.

Terminal Pitch: 0.8 mm

The smaller terminal pitch allows for higher density designs, accommodating compact circuit layouts.

No. of I/O Lines: 19

Nineteen I/O lines provide extensive interfacing capabilities, suitable for complex applications.

Technical Specifications

Parallel I/O Ports ZPSD301-70M attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

No. of I/O Lines:

19

No. of Ports:

3

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ZPSD301-70M Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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