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ZPSD211R-B-70M

STMicroelectronics

ZPSD211R-B-70M by STMicroelectronics

ZPSD211R-B-70M by STMicroelectronics is a versatile parallel I/O port with 19 I/O lines and operates at a nominal voltage of 5V. It features a compact flatpack design, ideal for space-constrained applications. With a max access time of just 70 ns, it ensures efficient data handling.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,882 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,882

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Digiode

USA . 2,643 parts In-Stock

1+ parts

-

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-

1k+ parts

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2,643

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Anansix

USA . 1,502 parts In-Stock

1+ parts

-

100+ parts

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1,502

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 209 parts In-Stock

1+ parts

$18.676

100+ parts

-

1k+ parts

$16.808

10k+ parts

-

209

$18.676

-

$16.808

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MKK Technologies

India . 1,371 parts In-Stock

1+ parts

$35.119

100+ parts

-

1k+ parts

-

10k+ parts

-

1,371

$35.119

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DigiPath Technology Company

USA . 1,371 parts In-Stock

1+ parts

$35.119

100+ parts

-

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-

10k+ parts

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1,371

$35.119

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-

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Corohmni

South Africa . 2,059 parts In-Stock

1+ parts

$72.232

100+ parts

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2,059

$72.232

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Corphita

USA . 2,252 parts In-Stock

1+ parts

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2,252

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Parana Technologies

USA . 831 parts In-Stock

1+ parts

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100+ parts

$22.330

1k+ parts

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831

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$22.330

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Overview

Unlock the potential of your designs with the ZPSD211R-B-70M from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile Parallel I/O Port device provides unmatched quality and reliability, perfect for a range of applications such as embedded systems and consumer electronics. With its compact flatpack design and efficient power management, it offers seamless integration, ensuring your projects stand out while benefiting from superior performance and durability. Experience excellence with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy makes the product lightweight and suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a more compact design and facilitates automated assembly.

Maximum Supply Voltage: 5.5 V

With a maximum supply voltage of 5.5 V, this product can operate safely within a range that is widely compatible with existing systems.

Package Shape: SQUARE

The square package shape aids in efficient PCB layout and space utilization.

Power Supplies (V): 5

The nominal power supply requirement of 5V aligns with common digital electronics, ensuring easy integration.

No. of Terminals: 44

With 44 terminals, the device offers rich connectivity options, making it versatile for various applications.

Package Style (Meter): FLATPACK

Flatpack packaging is beneficial for low-profile designs and effective heat dissipation.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures compatibility with a variety of power sources.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C makes the product reliable for use in moderately high-temperature environments.

Minimum Operating Temperature: 0 °C

The ability to function from 0 °C allows for applications in cooler environments.

Terminal Finish: TIN LEAD

Tin-lead finish enhances the solderability and reliability of the connections.

Terminal Position: QUAD

Quad terminal positions facilitate easier routing on the PCB, optimizing layout and performance.

No. of Ports: 3

Three ports provide flexibility for simultaneous connections and data transfer.

Maximum Seated Height: 2.35 mm

A low height specification allows for a slim profile design, beneficial in compact devices.

Width: 10 mm

With a width of 10 mm, it is compact enough for tight layouts without compromising functionality.

Length: 10 mm

The 10 mm length supports efficient space usage while providing ample connection options.

Temperature Grade: COMMERCIAL

Designed for commercial applications, ensuring good performance under typical operating conditions.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose IO port, it supports a wide range of applications, enhancing versatility.

ROM Bits Size: 262144 Bits

A ROM size of 262144 bits makes it suitable for applications requiring significant data storage.

Technology: CMOS

CMOS technology contributes to low power consumption and high speed, making it energy-efficient.

Terminal Form: GULL WING

Gull wing terminal form allows for easy automated assembly and improved mechanical strength.

Nominal Supply Voltage: 5 V

The standard nominal voltage of 5V is advantageous for compatibility with most digital circuits.

Terminal Pitch: 0.8 mm

With a 0.8 mm terminal pitch, it is suitable for high-density PCB designs.

Maximum Standby Current: 0.00002 Amp

A low standby current minimizes power consumption when the device is not actively in use.

Maximum Access Time: 0.00000007 ns

Fast access time ensures that the product meets the demands of high-speed applications.

No. of I/O Lines: 19

Nineteen I/O lines provide substantial interfacing capabilities, supporting various data transfers.

Technical Specifications

Parallel I/O Ports ZPSD211R-B-70M attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e0

Length:

10 mm

No. of I/O Lines:

19

No. of Ports:

3

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP44,.5SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

262144 Bits

Maximum Seated Height:

2.35 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ZPSD211R-B-70M Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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