Loading...

ZPSD211R-B-70J

STMicroelectronics

ZPSD211R-B-70J by STMicroelectronics

ZPSD211R-B-70J by STMicroelectronics is a versatile parallel I/O port with a max supply voltage of 5.5V and 19 I/O lines. It operates in temperatures from 0 °C to 70°C, making it ideal for commercial applications. Its compact chip carrier design ensures efficient integration in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,487 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,487

-

-

-

-

Digiode

USA . 2,732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,732

-

-

-

-

Anansix

USA . 1,907 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,907

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,702 parts In-Stock

1+ parts

$25.380

100+ parts

-

1k+ parts

$22.842

10k+ parts

-

1,702

$25.380

-

$22.842

-

Corohmni

South Africa . 174 parts In-Stock

1+ parts

$45.468

100+ parts

-

1k+ parts

-

10k+ parts

-

174

$45.468

-

-

-

MKK Technologies

India . 669 parts In-Stock

1+ parts

$47.726

100+ parts

-

1k+ parts

-

10k+ parts

-

669

$47.726

-

-

-

DigiPath Technology Company

USA . 669 parts In-Stock

1+ parts

$47.726

100+ parts

-

1k+ parts

-

10k+ parts

-

669

$47.726

-

-

-

Corphita

USA . 3,156 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,156

-

-

-

-

Parana Technologies

USA . 1,372 parts In-Stock

1+ parts

-

100+ parts

$30.346

1k+ parts

-

10k+ parts

-

1,372

-

$30.346

-

-

Overview

Unlock the potential of your projects with the ZPSD211R-B-70J from STMicroelectronics, a leader in innovative semiconductor solutions. This versatile parallel I/O port enhances connectivity and flexibility, making it perfect for a wide range of applications—from consumer electronics to industrial automation. Its robust design ensures reliability, while its compact package offers seamless integration into your systems. Choose ZPSD211R-B-70J for quality you can trust and performance that elevates your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body enhances durability and protects the internal components from environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for a more compact design, saving space on PCBs and facilitating automated assembly processes.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for versatility in integration with various systems while ensuring stable performance.

Package Shape: SQUARE

The square package shape provides uniform heat dissipation and simplifies layout design on PCBs.

Power Supplies (V): 5

A nominal power supply of 5V is standard in many digital systems, ensuring compatibility with a wide range of devices and reducing power management issues.

No. of Terminals: 44

With 44 terminals, this product can support extensive connectivity options, allowing for more peripherals and signals.

Package Style (Meter): CHIP CARRIER

The chip carrier style enables more effective thermal management and is ideal for high-density packaging.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5V ensures that the device can operate under a range of supply conditions, enhancing reliability.

Maximum Operating Temperature: 70 °C

The operational temperature range of up to 70 °C makes this product suitable for commercial applications where moderate heat is a factor.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C allows this device to function in a variety of environments, making it versatile across applications.

Terminal Finish: TIN LEAD

The tin-lead terminal finish enhances solderability, ensuring reliable connections during assembly.

Ultraviolet Erasable: N

Not being ultraviolet erasable simplifies the design, as it eliminates the need for complex erasing mechanisms, focusing on reliability.

Terminal Position: QUAD

Quad terminal positioning allows for efficient routing and minimizes the space required for layout, enabling better PCB design.

No. of Ports: 3

Having 3 ports increases the capability to connect multiple devices, which is beneficial for applications that require parallel communications.

Maximum Seated Height: 4.57 mm

A low seated height ensures a compact footprint on the PCB, making it easier to fit into space-constrained designs.

Width: 16.5862 mm

A width of approximately 16.59 mm balances component size with connectivity, providing flexibility for PCB layout.

Length: 16.5862 mm

This standardized length complements the chip's width, facilitating efficient placement and interconnectivity.

Temperature Grade: COMMERCIAL

Commercial grade temperature ratings ensure that the device can function reliably in typical operating environments encountered in consumer electronics.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

As a general-purpose parallel I/O port, this IC is versatile and suited for a variety of digital interfacing needs.

ROM Bits Size: 262144 Bits

With 262144 bits of ROM, it provides adequate memory for customizable functions in embedded applications.

Technology: CMOS

CMOS technology improves power efficiency and reduces heat generation, extending the lifespan of the component.

Terminal Form: J BEND

J bend terminals facilitate easy handling and insertion into PCBs, enhancing assembly efficiency.

Nominal Supply Voltage: 5 V

Offering a nominal supply voltage of 5V aligns with common digital logic levels, making integration straightforward.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for a compact arrangement while ensuring ease of soldering and accessibility.

Maximum Standby Current: 0.00002 Amp

With a very low standby current, this product is energy-efficient, making it ideal for battery-powered applications.

Maximum Access Time: 0.00000007 ns

A very fast access time of 70 picoseconds ensures high-speed performance, critical for applications requiring rapid data processing.

No. of I/O Lines: 19

Having 19 I/O lines enhances data throughput and enables connection to multiple components, increasing overall functionality.

Technical Specifications

Parallel I/O Ports ZPSD211R-B-70J attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

Maximum Access Time:

.00000007 ns

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e0

Length:

16.5862 mm

No. of I/O Lines:

19

No. of Ports:

3

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

ROM Bits Size:

262144 Bits

Maximum Seated Height:

4.57 mm

Maximum Standby Current:

.00002 Amp

Sub-Category:

Other Microprocessor ICs

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Ultraviolet Erasable:

N

Width:

16.5862 mm

Peripheral IC Type:

Trade Compliance

ZPSD211R-B-70J Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19