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ZPSD301-15M

STMicroelectronics

ZPSD301-15M by STMicroelectronics

ZPSD301-15M by STMicroelectronics is a CMOS parallel I/O port with 19 I/O lines, operating b/w 4.5V and 5.5V. It features a compact flatpack design with 44 terminals and supports temperatures up to 70 °C. Ideal for general-purpose applications in commercial environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,920 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,920

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Digiode

USA . 3,656 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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3,656

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Anansix

USA . 1,014 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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1,014

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,399 parts In-Stock

1+ parts

$29.514

100+ parts

-

1k+ parts

$26.562

10k+ parts

-

1,399

$29.514

-

$26.562

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MKK Technologies

India . 1,657 parts In-Stock

1+ parts

$55.498

100+ parts

-

1k+ parts

-

10k+ parts

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1,657

$55.498

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DigiPath Technology Company

USA . 1,657 parts In-Stock

1+ parts

$55.498

100+ parts

-

1k+ parts

-

10k+ parts

-

1,657

$55.498

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-

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Corohmni

South Africa . 642 parts In-Stock

1+ parts

$76.277

100+ parts

-

1k+ parts

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10k+ parts

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642

$76.277

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Corphita

USA . 3,907 parts In-Stock

1+ parts

-

100+ parts

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3,907

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Parana Technologies

USA . 847 parts In-Stock

1+ parts

-

100+ parts

$35.288

1k+ parts

-

10k+ parts

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847

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$35.288

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Overview

Unlock the potential of your projects with the ZPSD301-15M from STMicroelectronics, a trusted leader in semiconductor innovation. This versatile parallel I/O port seamlessly integrates into various applications, ensuring robust performance and reliability. With its compact design and superior quality, it enhances efficiency across consumer electronics, industrial automation, and more. Experience the value and benefits of cutting-edge technology that drives success in your designs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material offers durability and resistance to environmental factors, ensuring longevity of the product.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of circuit board space, making it suitable for modern electronics.

Maximum Supply Voltage: 5.5 V

This voltage range provides flexibility in integration with various power supply systems, enhancing compatibility with different devices.

Package Shape: SQUARE

The square shape allows for uniform layout options on PCB, facilitating easier assembly and routing.

No. of Terminals: 44

A higher number of terminals contributes to greater connectivity options, accommodating a range of applications.

Package Style (Meter): FLATPACK

The flatpack style supports low-profile installations, which is vital in space-constrained environments.

Minimum Supply Voltage: 4.5 V

Lower minimum supply voltage enables operation in a wider range of scenarios, improving device versatility.

Maximum Operating Temperature: 70 °C

Withstanding up to 70 °C allows for operation in warmer environments, broadening its application scope.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures reliable functionality even in cooler climatic conditions.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, enhancing reliability in connections.

Terminal Position: QUAD

Quad terminal arrangement aids in simplified routing and better space management on printed circuit boards.

No. of Ports: 3

Offering three ports maximizes data handling potential, making it effective for multi-tasking applications.

Maximum Seated Height: 2.35 mm

A low maximum seated height is ideal for compact devices where space is a critical factor.

Width: 10 mm

Compact width allows efficient placement on small PCBs and contributes to overall device miniaturization.

Length: 10 mm

Similar to the width, this length complements compact design requirements in modern electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade makes it suitable for a variety of everyday applications without extreme environmental constraints.

Peripheral IC Type: PARALLEL IO PORT, GENERAL PURPOSE

Being a general-purpose IO port means it can be adapted for various applications, enhancing its usability.

Technology: CMOS

CMOS technology offers low power consumption and high speed, making it efficient for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering during the assembly process, improving manufacturing efficiency.

Nominal Supply Voltage: 5 V

A nominal supply voltage of 5V is standard for many electronics, ensuring compatibility with existing systems.

Terminal Pitch: 0.8 mm

A 0.8 mm terminal pitch allows for a tight layout on PCBs, accommodating high-density designs.

No. of I/O Lines: 19

Having 19 I/O lines expands the data transfer capability, suitable for demanding applications.

Technical Specifications

Parallel I/O Ports ZPSD301-15M attributes and parameters. Explore more Parallel I/O Ports devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQFP-G44

JESD-609 Code:

e3

Length:

10 mm

No. of I/O Lines:

19

No. of Ports:

3

No. of Terminals:

44

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Shape:

Package Style (Meter):

FLATPACK

Qualification:

Not Qualified

Maximum Seated Height:

2.35 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

10 mm

Peripheral IC Type:

Trade Compliance

ZPSD301-15M Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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