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Z0410DE

STMicroelectronics

Z0410DE by STMicroelectronics

Z0410DE by STMicroelectronics is a single TRIAC designed for AC applications, featuring a max RMS on-state current of 4 A and a repetitive peak off-state voltage of 400 V. It operates b/w -40 °C to 125°C with a gate trigger current of 25 mA. Ideal for controlling power in lighting and motor circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,381 parts In-Stock

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4,381

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Digiode

USA . 4,290 parts In-Stock

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4,290

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Anansix

USA . 2,762 parts In-Stock

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2,762

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ICP Electronique

France . 65 parts In-Stock

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65

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ECAB

Sweden . 52 parts In-Stock

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52

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 297 parts In-Stock

1+ parts

$1.901

100+ parts

-

1k+ parts

$1.711

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297

$1.901

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$1.711

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MKK Technologies

India . 326 parts In-Stock

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$3.574

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326

$3.574

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DigiPath Technology Company

USA . 326 parts In-Stock

1+ parts

$3.574

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326

$3.574

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Corphita

USA . 2,307 parts In-Stock

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2,307

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Parana Technologies

USA . 1,362 parts In-Stock

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$2.273

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1,362

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$2.273

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Overview

Unlock the power of reliable performance with the Z0410DE from STMicroelectronics, a leader in semiconductor innovation. This TRIAC excels in controlling AC loads, making it ideal for home automation, lighting control, and motor management. With its robust design and exceptional thermal stability, it ensures longevity and efficiency in any application. Trust in STMicroelectronics' legacy of quality to enhance your projects and elevate your designs. Maximize value, minimize risk!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, making it suitable for various applications.

Maximum DC Gate Trigger Current: 25 mA

A relatively low gate trigger current allows for reduced power consumption in the control circuit, enhancing energy efficiency.

Configuration: SINGLE

The single configuration simplifies design and integration into existing circuits, making it easy to use.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy mounting and compact design, optimizing space in electronic assemblies.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical strength and are ideal for soldering in various PCB designs.

Maximum Leakage Current: 0.2 mA

Low leakage current enhances energy efficiency and reduces heat generation, making it safer for prolonged use.

Number of Terminals: 3

The 3-terminal configuration streamlines the design for controlling AC loads, improving simplicity and reliability.

Package Style (Meter): FLANGE MOUNT

Flange mount style offers easy installation and better mechanical stability in circuit boards or housing.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature expands the range of environments in which the TRIAC can perform reliably.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant capability allows for versatile applications including positive and negative polarity operations with logic level control.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures reliable performance even in extreme conditions, enhancing durability in outdoor or industrial applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections over time.

Terminal Position: SINGLE

Single terminal position simplifies layout design and reduces complexity when integrating into existing circuits.

Maximum RMS On-state Current: 4 A

Capable of handling 4A RMS allows this TRIAC to be used in various lighting and motor control applications, providing strong performance.

Maximum DC Gate Trigger Voltage: 2 V

A low gate trigger voltage increases compatibility with low-voltage control signals, making it ideal for modern electronics.

Repetitive Peak Off-state Voltage: 400 V

High off-state voltage tolerance allows this TRIAC to be used in applications with significant voltage spikes, ensuring reliability.

Minimum Critical Rate of Rise of Off-state Voltage: 30 V/μs

A high rate of rise means the TRIAC can withstand sudden voltage changes, improving its performance in rapid switching applications.

Maximum Holding Current: 50 mA

A low holding current allows for efficient control and operation, which is particularly beneficial in low-power applications.

Technical Specifications

Triode For Alternating Current (TRIAC) Z0410DE attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

30 V/us

Maximum DC Gate Trigger Current:

25 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

50 mA

JEDEC-95 Code:

TO-202

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

400 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

Z0410DE Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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