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Z0410SE

STMicroelectronics

Z0410SE by STMicroelectronics

Z0410SE by STMicroelectronics is a single TRIAC designed for AC applications, featuring a max RMS on-state current of 4 A and a repetitive peak off-state voltage of 700 V. It operates b/w -40 °C to 125°C with a gate trigger current of 25 mA. Ideal for controlling power in lighting and motor circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,956 parts In-Stock

1+ parts

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2,956

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Anansix

USA . 2,463 parts In-Stock

1+ parts

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2,463

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Vyrian

USA . 2,249 parts In-Stock

1+ parts

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2,249

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,482 parts In-Stock

1+ parts

$2.159

100+ parts

-

1k+ parts

$1.943

10k+ parts

-

1,482

$2.159

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$1.943

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MKK Technologies

India . 2,196 parts In-Stock

1+ parts

$4.060

100+ parts

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2,196

$4.060

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DigiPath Technology Company

USA . 2,196 parts In-Stock

1+ parts

$4.060

100+ parts

-

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2,196

$4.060

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Corphita

USA . 1,656 parts In-Stock

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1,656

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Parana Technologies

USA . 109 parts In-Stock

1+ parts

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100+ parts

$2.582

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109

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$2.582

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Overview

Unlock superior performance with the Z0410SE TRIAC from STMicroelectronics, a trusted leader in semiconductor innovation. This robust component excels in AC control applications, delivering reliability and efficiency in demanding environments. With its wide temperature range and low leakage current, it ensures optimal operation for your systems. Elevate your designs and experience the advantages of proven quality—choose Z0410SE for unparalleled value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides excellent insulation and durability, making this TRIAC suitable for various environmental conditions.

Maximum DC Gate Trigger Current: 25 mA

With a maximum gate trigger current of 25 mA, this TRIAC can be easily driven by low-power control circuits, enhancing its versatility.

Configuration: SINGLE

Single configuration simplifies design requirements, making it perfect for applications where space and complexity must be minimized.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of PCB space, facilitating easier integration into compact designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure mechanical attachment and are suitable for high-performance applications, ensuring reliable connections.

Maximum Leakage Current: 0.2 mA

A low leakage current of 0.2 mA minimizes power loss, contributing to energy efficiency in applications requiring long-term reliability.

Number of Terminals: 3

The three-terminal configuration enables easier control and integration in circuits, particularly for switching and regulating applications.

Package Style (Meter): FLANGE MOUNT

Flange mount style allows for secure installation and good thermal management, which is critical in high-current environments.

Maximum Operating Temperature: 125 °C

An operating temperature of up to 125 °C ensures that this TRIAC can function in a wider range of conditions without thermal issues.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

As a 4 quadrant logic level TRIAC, it supports various control signals and makes it compatible with a wide range of electronic devices.

Minimum Operating Temperature: -40 °C

The capability to operate down to -40 °C allows for use in extreme environments, such as refrigeration and outdoor applications.

Terminal Finish: MATTE TIN

The matte tin finish offers good solderability and corrosion resistance, ensuring long-term reliability in various applications.

Terminal Position: SINGLE

With a single terminal position, it simplifies layout design on printed circuit boards, making the assembly process easier.

Maximum RMS On-state Current: 4 A

A maximum on-state current of 4 A allows for controlling significant power loads, suitable for a wide range of applications.

Maximum DC Gate Trigger Voltage: 1.5 V

The low trigger voltage of 1.5 V makes this TRIAC easily compatible with common low-voltage control circuits.

Repetitive Peak Off-state Voltage: 700 V

The high off-state voltage rating of 700 V provides robust performance in various high-voltage applications.

Minimum Critical Rate of Rise of Commutation Voltage: 5 V/μs

A minimum critical rate of rise in commutation voltage allows for effective switching, enhancing efficiency in dynamic applications.

Maximum Holding Current: 25 mA

A low maximum holding current of 25 mA aids in preventing false triggering, improving the reliability of the switching operation.

Technical Specifications

Triode For Alternating Current (TRIAC) Z0410SE attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

5 V/us

Maximum DC Gate Trigger Current:

25 mA

Maximum DC Gate Trigger Voltage:

1.5 V

Maximum Holding Current:

25 mA

JEDEC-95 Code:

TO-202

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

700 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

Z0410SE Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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