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Z0410ME

STMicroelectronics

Z0410ME by STMicroelectronics

Z0410ME by STMicroelectronics is a single TRIAC designed for AC applications, featuring a max RMS on-state current of 4 A and a repetitive peak off-state voltage of 600 V. It operates b/w -40 °C to 125°C with a gate trigger current of 25 mA. Ideal for controlling power in lighting and motor circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,535 parts In-Stock

1+ parts

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4,535

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Vyrian

USA . 3,469 parts In-Stock

1+ parts

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3,469

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Anansix

USA . 2,863 parts In-Stock

1+ parts

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2,863

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ECAB

Sweden . 700 parts In-Stock

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700

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LittleDiode

UK . 8 parts In-Stock

1+ parts

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,121 parts In-Stock

1+ parts

$2.507

100+ parts

-

1k+ parts

$2.256

10k+ parts

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2,121

$2.507

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$2.256

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MKK Technologies

India . 1,341 parts In-Stock

1+ parts

$4.714

100+ parts

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1,341

$4.714

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DigiPath Technology Company

USA . 1,341 parts In-Stock

1+ parts

$4.714

100+ parts

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1,341

$4.714

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Kepictronics

USA . 13,000 parts In-Stock

1+ parts

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13,000

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Corphita

USA . 2,742 parts In-Stock

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2,742

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Parana Technologies

USA . 1,728 parts In-Stock

1+ parts

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100+ parts

$2.998

1k+ parts

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10k+ parts

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1,728

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$2.998

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Overview

Elevate your projects with the Z0410ME TRIAC from STMicroelectronics, a trusted leader in semiconductor innovation. This versatile component excels in managing AC power control with remarkable efficiency, ensuring durability across diverse applications—from home appliances to industrial systems. With its robust design and outstanding performance in challenging environments, the Z0410ME delivers reliability that empowers engineers and manufacturers alike, enhancing product quality while optimizing energy usage. Choose STMicroelectronics for unparalleled expertise and commitment to excellence—experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Maximum DC Gate Trigger Current: 25 mA

A maximum gate trigger current of 25 mA allows for efficient switching with low power requirements, enhancing overall circuit performance.

Configuration: SINGLE

The single configuration simplifies circuit design and implementation, making it ideal for straightforward applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy layout in printed circuits, allowing for compact design and assembly.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical stability and reliable connections, reducing the risk of damage during handling.

Maximum Leakage Current: 0.2 mA

A low maximum leakage current of 0.2 mA minimizes wasted energy and ensures system efficiency, making it suitable for energy-sensitive applications.

No. of Terminals: 3

Having three terminals offers flexibility in circuit configurations while maintaining a compact form factor.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides easy integration into various mounting systems, enhancing installation versatility.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliability and stability in demanding thermal environments.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

As a 4 quadrant logic level TRIAC, it is suitable for controlling AC loads in various applications, enhancing its usability in automation systems.

Minimum Operating Temperature: -40 °C

Withstanding temperatures as low as -40 °C makes this product ideal for outdoor and extreme environment applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability, ensuring strong electrical connections and reliability over time.

Terminal Position: SINGLE

The single terminal position simplifies the connection process, making it easier to install in various electronic projects.

Maximum RMS On-state Current: 4 A

A maximum RMS on-state current rating of 4 A ensures that this TRIAC can handle substantial load currents, suitable for a wide range of applications.

Maximum DC Gate Trigger Voltage: 2 V

A low gate trigger voltage of 2 V enhances compatibility with many logic circuits, reducing the complexity of the triggering circuitry.

Repetitive Peak Off-state Voltage: 600 V

A high repetitive peak off-state voltage of 600 V gives confidence in using this component for high voltage applications.

Minimum Critical Rate of Rise of Off-state Voltage: 30 V/us

This feature indicates the component's ability to handle rapid voltage changes, which is crucial for dynamic AC control applications.

Maximum Holding Current: 50 mA

A low maximum holding current of 50 mA makes it suitable for sensitive applications where low power dissipation is critical.

Technical Specifications

Triode For Alternating Current (TRIAC) Z0410ME attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

30 V/us

Maximum DC Gate Trigger Current:

25 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

50 mA

JEDEC-95 Code:

TO-202

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

Z0410ME Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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