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Z0410NF

STMicroelectronics

Z0410NF by STMicroelectronics

STMicroelectronics Z0410NF is a TRIAC with 800V repetitive peak off-state voltage, 0.95A max RMS on-state current, and 25mA DC gate trigger current. Ideal for applications requiring precise AC power control in industrial equipment, lighting systems, and home appliances.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,632 parts In-Stock

1+ parts

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1,632

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Digiode

USA . 776 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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776

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Anansix

USA . 78 parts In-Stock

1+ parts

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78

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LittleDiode

UK . 6 parts In-Stock

1+ parts

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,905 parts In-Stock

1+ parts

$3.914

100+ parts

-

1k+ parts

$3.522

10k+ parts

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1,905

$3.914

-

$3.522

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MKK Technologies

India . 1,463 parts In-Stock

1+ parts

$7.359

100+ parts

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1,463

$7.359

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DigiPath Technology Company

USA . 1,463 parts In-Stock

1+ parts

$7.359

100+ parts

-

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10k+ parts

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1,463

$7.359

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Kepictronics

USA . 43,800 parts In-Stock

1+ parts

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43,800

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Corphita

USA . 3,015 parts In-Stock

1+ parts

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3,015

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Parana Technologies

USA . 1,346 parts In-Stock

1+ parts

-

100+ parts

$4.679

1k+ parts

-

10k+ parts

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1,346

-

$4.679

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Overview

Experience the superior quality and reliability of the Z0410NF by STMicroelectronics, a leading manufacturer in the industry. This TRIAC device offers unmatched performance and versatility for a wide range of applications. With a maximum RMS On-state Current of 0.95A and a Repetitive Peak Off-state Voltage of 800V, this product delivers exceptional value and benefits to customers seeking high-quality electronic components. Trust STMicroelectronics for cutting-edge technology that meets your needs efficiently and effectively.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to external elements, ensuring a longer lifespan.

Maximum DC Gate Trigger Current: 25 mA

The high maximum DC gate trigger current allows for reliable and consistent switching performance.

Configuration: SINGLE

The single configuration simplifies the setup and installation process, making it user-friendly.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and mounting in various applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides secure connections and ensures stability during operation.

Maximum Leakage Current: 0.2 mA

The low maximum leakage current helps in reducing power consumption and improving efficiency.

No. of Terminals: 3

The three terminals offer flexibility in wiring configurations and compatibility with different systems.

Package Style (Meter): IN-LINE

The in-line package style makes it easy to integrate the product into existing systems or circuits.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environments or high-temperature conditions.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

The 4 quadrant logic level TRIAC allows for precise control and switching of alternating current, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function effectively in cold environments without any performance issues.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides corrosion resistance and ensures reliable electrical connections.

Terminal Position: SINGLE

The single terminal position simplifies the wiring process and ensures proper alignment during installation.

Maximum RMS On-state Current: 0.95 A

The high maximum RMS on-state current allows for handling higher loads and ensures stable performance under heavy usage.

Maximum DC Gate Trigger Voltage: 2 V

The low maximum DC gate trigger voltage ensures efficient triggering and reliable operation in various control systems.

Repetitive Peak Off-state Voltage: 800 V

The high repetitive peak off-state voltage allows for handling high voltages and ensures the product's safety and performance under harsh conditions.

Minimum Critical Rate of Rise of Off-state Voltage: 30 V/us

The minimum critical rate of rise of off-state voltage helps in protecting the product from voltage spikes and ensures stable operation during transient conditions.

Maximum Holding Current: 50 mA

The high maximum holding current ensures the product remains in the on-state reliably, even under varying load conditions.

Technical Specifications

Triode For Alternating Current (TRIAC) Z0410NF attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

30 V/us

Maximum DC Gate Trigger Current:

25 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

50 mA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

.95 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

Z0410NF Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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