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TIC246N

Texas Instruments

TIC246N by Texas Instruments

TIC246N by Texas Instruments is a TRIAC with 16A RMS on-state current, 800V repetitive peak off-state voltage, and 110°C max operating temp. Ideal for AC power control in applications like lighting dimmers, motor speed controllers, and heating control systems.

Median Price

$3.946

Lifecycle Status

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9

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1k+

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Distrelec

Netherlands . 167 parts In-Stock

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$2.970

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Digiode

USA . 984 parts In-Stock

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Vyrian

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Halfin

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LIBRA Elektronik GmbH

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Huijzer Components

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Holdelec - ElecDif-Pro

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GES GmbH

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Parana Technologies

USA . 2,198 parts In-Stock

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$2.156

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$200.178

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$1.940

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DigiPath Technology Company

USA . 719 parts In-Stock

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$2.374

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$2.184

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ChromeModa Solutions

Germany . 5,478 parts In-Stock

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$1.986

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IDEA Electronic Components Group

UK . 1,951 parts In-Stock

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Corphita

USA . 4,767 parts In-Stock

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Component Stockers USA

USA . 756 parts In-Stock

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$99.990

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Perfect Parts

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Cyclops Electronics Ltd (Excess)

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Assy Fe

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Overview

Experience the superior quality and reliability of the TIC246N TRIAC by Texas Instruments. Manufactured by a trusted industry leader, this device offers unparalleled performance and efficiency in a wide range of applications. From controlling power in appliances to regulating lighting systems, the TIC246N provides precise and dependable operation. Say goodbye to worries about overheating or malfunctioning, as this TRIAC is designed to withstand even the toughest conditions. Trust Texas Instruments to deliver cutting-edge technology that exceeds your expectations. Choose the TIC246N for unmatched value and peace of mind.

Feature Benefit Bullets

Maximum DC Gate Trigger Current: 50 mA

The high maximum DC gate trigger current allows for reliable and consistent triggering of the TRIAC.

Maximum Leakage Current: 2 mA

The low maximum leakage current ensures minimal power loss and efficient performance of the TRIAC.

Maximum Operating Temperature: 110 °C

With a maximum operating temperature of 110 °C, this TRIAC can withstand high temperatures, making it suitable for various environments.

Trigger Device Type: TRIAC

Being a TRIAC, this device is suitable for alternating current applications and provides bidirectional control.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows for reliable performance even in cold environments.

Maximum RMS On-state Current: 16 A

The high maximum RMS on-state current of 16 A allows for handling of larger loads and ensures efficient power control.

Maximum DC Gate Trigger Voltage: 2.5 V

The low maximum DC gate trigger voltage of 2.5 V ensures efficient triggering and control of the TRIAC.

Repetitive Peak Off-state Voltage: 800 V

The high repetitive peak off-state voltage of 800 V ensures safe operation and protection against voltage spikes.

Maximum Holding Current: 50 mA

The high maximum holding current of 50 mA ensures reliable latching of the TRIAC and prevents unintended turn-off.

Technical Specifications

Triode For Alternating Current (TRIAC) TIC246N attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Texas Instruments

Specs

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2.5 V

Maximum Holding Current:

50 mA

Maximum Leakage Current:

2 mA

Maximum Operating Temperature:

110 Cel

Minimum Operating Temperature:

-40 Cel

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum RMS On-state Current:

16 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

Trade Compliance

TIC246N Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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