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X0402MF

STMicroelectronics

X0402MF by STMicroelectronics

X0402MF by STMicroelectronics is a SCR with max DC gate trigger current of 0.2 mA, non-repetitive peak on-state current of 27 A, and max on-state current of 4 A. It is used in applications requiring high voltage control such as power supplies and motor control systems.

Median Price

$0.535

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,373 parts In-Stock

1+ parts

$0.535

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-

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2,373

$0.535

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Digiode

USA . 4,553 parts In-Stock

1+ parts

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4,553

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Anansix

USA . 2,156 parts In-Stock

1+ parts

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2,156

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LittleDiode

UK . 13 parts In-Stock

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13

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,396 parts In-Stock

1+ parts

$3.609

100+ parts

-

1k+ parts

$3.248

10k+ parts

-

1,396

$3.609

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$3.248

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MKK Technologies

India . 2,176 parts In-Stock

1+ parts

$6.787

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2,176

$6.787

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DigiPath Technology Company

USA . 2,176 parts In-Stock

1+ parts

$6.787

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2,176

$6.787

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Perfect Parts

USA . 26,535 parts In-Stock

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26,535

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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A-Z Elektronik GmbH

Germany . 4,838 parts In-Stock

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4,838

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Corphita

USA . 2,024 parts In-Stock

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2,024

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Parana Technologies

USA . 2,004 parts In-Stock

1+ parts

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100+ parts

$4.315

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2,004

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$4.315

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Cyclops Electronics Ltd (Excess)

UK . 121 parts In-Stock

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121

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Assy Fe

Spain . 5 parts In-Stock

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5

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Overview

Unleash the power of the X0402MF Silicon Controlled Rectifier by STMicroelectronics, a top-tier manufacturer known for high-quality components. This SCR offers unparalleled performance and reliability for a wide range of applications. From industrial automation to consumer electronics, this product delivers value, efficiency, and precision. Trust STMicroelectronics to provide cutting-edge technology that exceeds expectations. Elevate your projects with the X0402MF and experience the difference that quality makes.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the SCR, making it suitable for a variety of environments.

Maximum DC Gate Trigger Current: 0.2 mA

Low gate trigger current allows for efficient and controlled switching of the SCR.

Configuration: SINGLE

Simplifies installation and usage of the SCR in circuits.

Non Repetitive Peak On-state Current: 27 A

Allows for handling high current peaks during operation without damage.

Package Shape: RECTANGULAR

Enables easy integration and mounting of the SCR in electronic systems.

Terminal Form: THROUGH-HOLE

Facilitates secure and reliable connections with other components on a circuit board.

Maximum On-state Current: 4 A

Capable of handling moderate current loads effectively.

Maximum Leakage Current: 0.2 mA

Low leakage current ensures minimal power loss when the SCR is in the off-state.

Repetitive Peak Reverse Voltage: 600 V

Provides a high reverse voltage rating for operation in various applications.

No. of Terminals: 3

Simplifies circuit design and connection with other components.

Package Style (Meter): IN-LINE

Convenient form factor for easy handling and placement in circuits.

Maximum Operating Temperature: 125 °C

Allows the SCR to operate efficiently in a wide range of temperature conditions.

Trigger Device Type: SCR

SCR type trigger device provides reliable performance and control over the switching process.

Minimum Operating Temperature: -40 °C

Capable of functioning in low-temperature environments without issues.

Terminal Finish: MATTE TIN

Provides good conductivity and corrosion resistance for long-term reliability.

Terminal Position: SINGLE

Simplifies installation and connection, reducing chances of errors in wiring.

Maximum RMS On-state Current: 1.35 A

Can handle continuous current flow at a moderate level without overheating.

Maximum DC Gate Trigger Voltage: 0.8 V

Low gate trigger voltage ensures efficient and accurate switching of the SCR.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage rating for reliable performance in various circuit conditions.

Minimum Critical Rate of Rise of Off-state Voltage: 30 V/us

Ensures stable off-state operation under rapidly changing voltage conditions.

Maximum Holding Current: 5 mA

Allows for maintaining a stable on-state condition without accidental turn-off.

Technical Specifications

Silicon Controlled Rectifiers (SCR) X0402MF attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

30 V/us

Maximum DC Gate Trigger Current:

.2 mA

Maximum DC Gate Trigger Voltage:

.8 V

Maximum Holding Current:

5 mA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.2 mA

Moisture Sensitivity Level (MSL):

1

Non Repetitive Peak On-state Current:

27 A

No. of Elements:

1

No. of Terminals:

3

Maximum On-state Current:

4 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

1.35 A

Repetitive Peak Off-state Voltage:

600 V

Repetitive Peak Reverse Voltage:

600 V

Sub-Category:

Silicon Controlled Rectifiers

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

SCR

Trade Compliance

X0402MF Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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