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X0402DE

STMicroelectronics

X0402DE by STMicroelectronics

X0402DE by STMicroelectronics is a single SCR in a rectangular plastic/epoxy package, ideal for power control applications. It features a max on-state current of 4 A, non-repetitive peak on-state current of 33 A, and operates b/w -45 °C to 125°C. With a repetitive peak reverse voltage of 400 V, it's perfect for high-voltage circuits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Lantek

USA . 3,745 parts In-Stock

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3,745

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Vyrian

USA . 3,283 parts In-Stock

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3,283

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Anansix

USA . 1,682 parts In-Stock

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1,682

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Digiode

USA . 1,678 parts In-Stock

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1,678

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ABC Electronics Ltd.

UK . 990 parts In-Stock

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990

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,128 parts In-Stock

1+ parts

$4.376

100+ parts

-

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$3.939

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1,128

$4.376

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$3.939

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MKK Technologies

India . 867 parts In-Stock

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$8.230

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867

$8.230

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DigiPath Technology Company

USA . 867 parts In-Stock

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$8.230

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867

$8.230

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GreenTree Electronics

Israel . 2,745 parts In-Stock

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Corphita

USA . 604 parts In-Stock

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Parana Technologies

USA . 494 parts In-Stock

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$5.233

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494

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$5.233

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Authorized Procurement Solutions

USA . 90 parts In-Stock

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90

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Overview

Elevate your designs with the X0402DE from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This robust Silicon Controlled Rectifier (SCR) offers unmatched reliability and performance for a variety of applications, including power management and motor control. With its superior thermal stability and efficiency, the X0402DE ensures long-lasting operation while minimizing energy loss. Choose STMicroelectronics for quality you can depend on!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures reliability and resistance to environmental factors, making it suitable for various applications.

Maximum DC Gate Trigger Current: 0.2 mA

Low gate trigger current requirement minimizes energy consumption and allows for efficient control in circuit designs.

Configuration: SINGLE

Single configuration simplifies circuit design and integration into existing systems.

Non Repetitive Peak On-state Current: 33 A

High non-repetitive peak on-state current capability provides robustness against unexpected current surges in applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy mounting and efficient use of PCB space.

Terminal Form: THROUGH-HOLE

Through-hole technology provides strong mechanical connections and is suitable for high-power applications.

Maximum On-state Current: 4 A

Adequate on-state current rating enables versatile use in various power handling applications.

Maximum Leakage Current: 0.2 mA

Low leakage current enhances the efficiency of the device, reducing power loss during operation.

Repetitive Peak Reverse Voltage: 400 V

High repetitive peak reverse voltage rating ensures reliability in high-voltage applications.

Number of Terminals: 3

Three terminals provide simple integration into circuits, facilitating easier connections and reliable performance.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for secure installation and improved heat dissipation in various applications.

Maximum Operating Temperature: 125 °C

High operating temperature rating improves the reliability of the device in demanding thermal environments.

Trigger Device Type: SCR

SCR type ensures excellent switching capabilities and controlled rectification for effective power management.

Minimum Operating Temperature: -45 °C

Wide temperature range enables operation in extreme conditions, making it suitable for various climates.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and corrosion resistance, ensuring a long-lasting connection.

Terminal Position: SINGLE

Single terminal position enhances layout simplicity and compatibility with standard assemblies.

Maximum RMS On-state Current: 4 A

RMS on-state current rating gives confidence in performance during continuous operation.

Maximum DC Gate Trigger Voltage: 0.8 V

Low gate trigger voltage requirement ensures energy-efficient operation and compatibility with low-voltage control signals.

Repetitive Peak Off-state Voltage: 400 V

High off-state voltage rating allows for reliable blocking of high voltages, which is crucial for safety in power systems.

Minimum Critical Rate of Rise of Off-state Voltage: 30 V/us

High rate of rise threshold improves stability during operation, preventing false triggering in fluctuating conditions.

Maximum Holding Current: 5 mA

Low holding current enables better control over the device, enhancing system responsiveness.

Technical Specifications

Silicon Controlled Rectifiers (SCR) X0402DE attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

30 V/us

Maximum DC Gate Trigger Current:

.2 mA

Maximum DC Gate Trigger Voltage:

.8 V

Maximum Holding Current:

5 mA

JEDEC-95 Code:

TO-202

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.2 mA

Non Repetitive Peak On-state Current:

33 A

No. of Elements:

1

No. of Terminals:

3

Maximum On-state Current:

4 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-45 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

400 V

Repetitive Peak Reverse Voltage:

400 V

Sub-Category:

Silicon Controlled Rectifiers

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

SCR

Trade Compliance

X0402DE Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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