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X0402NF

STMicroelectronics

X0402NF by STMicroelectronics

X0402NF by STMicroelectronics is a single SCR with max. on-state current of 4A, non-repetitive peak on-state current of 27A, and max. DC gate trigger current of 0.2mA. It is used in applications requiring high voltage control such as power supplies and motor control systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,160 parts In-Stock

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3,160

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Anansix

USA . 1,493 parts In-Stock

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1,493

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Vyrian

USA . 390 parts In-Stock

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390

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ACDS - Activité Composants Distribution Service

France . 234 parts In-Stock

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234

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,367 parts In-Stock

1+ parts

$2.769

100+ parts

-

1k+ parts

$2.492

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1,367

$2.769

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$2.492

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MKK Technologies

India . 1,817 parts In-Stock

1+ parts

$5.207

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1,817

$5.207

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DigiPath Technology Company

USA . 1,817 parts In-Stock

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$5.207

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1,817

$5.207

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Perfect Parts

USA . 253,299 parts In-Stock

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253,299

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Parana Technologies

USA . 1,238 parts In-Stock

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$3.311

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1,238

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$3.311

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Corphita

USA . 596 parts In-Stock

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596

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Overview

Unleash the power of the X0402NF by STMicroelectronics, a top-of-the-line Silicon Controlled Rectifier that offers unparalleled quality and reliability. Designed with precision by the industry-leading manufacturer, this SCR is perfect for a wide range of applications. From industrial automation to consumer electronics, the X0402NF delivers outstanding performance, efficiency, and durability. Experience the value of superior technology with this innovative product that provides customers with unmatched benefits and advantages. Trust STMicroelectronics to bring you cutting-edge solutions for all your electrical needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the components inside, ensuring durability and reliability.

Maximum DC Gate Trigger Current: 0.2 mA

Low gate trigger current allows for precise control over the SCR, making it suitable for various applications.

Configuration: SINGLE

Single configuration simplifies the design and installation process for the product.

Repetitive Peak On-state Current: 27 A

High on-state current capability makes this SCR suitable for handling high power loads.

Package Shape: RECTANGULAR

Rectangular shape allows for easy mounting and placement in circuits.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, ensuring stability during operation.

Maximum On-state Current: 4 A

A high on-state current rating allows the SCR to handle moderate power loads efficiently.

Repetitive Peak Reverse Voltage: 800 V

High reverse voltage rating provides protection against voltage spikes and surges.

No. of Terminals: 3

Three terminals allow for easy connection in circuits and ensure proper functionality.

Package Style (Meter): IN-LINE

In-line package style makes this SCR easy to integrate into existing circuits or systems.

Maximum Operating Temperature: 125 °C

High operating temperature range allows for versatile use in different environments.

Trigger Device Type: SCR

SCR technology provides reliable and stable switching performance.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures this SCR can operate in various environmental conditions.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and corrosion resistance for the terminals.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection in circuits.

Maximum RMS On-state Current: 1.35 A

High RMS current rating allows this SCR to handle continuous AC loads effectively.

Maximum DC Gate Trigger Voltage: 0.8 V

Low gate trigger voltage ensures efficient and reliable switching of the SCR.

Repetitive Peak Off-state Voltage: 800 V

High off-state voltage rating provides protection against voltage spikes and surges.

Minimum Critical Rate of Rise of Off-state Voltage: 30 V/us

Fast rate of rise of off-state voltage rating ensures quick response to voltage changes.

Maximum Holding Current: 5 mA

High holding current ensures the SCR stays in an on-state condition under specified conditions.

Technical Specifications

Silicon Controlled Rectifiers (SCR) X0402NF attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

30 V/us

Maximum DC Gate Trigger Current:

.2 mA

Maximum DC Gate Trigger Voltage:

.8 V

Maximum Holding Current:

5 mA

JESD-30 Code:

R-PSIP-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.2 mA

Non Repetitive Peak On-state Current:

27 A

No. of Elements:

1

No. of Terminals:

3

Maximum On-state Current:

4 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

1.35 A

Repetitive Peak Off-state Voltage:

800 V

Repetitive Peak Reverse Voltage:

800 V

Sub-Category:

Silicon Controlled Rectifiers

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

SCR

Trade Compliance

X0402NF Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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