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X0402BF

STMicroelectronics

X0402BF by STMicroelectronics

X0402BF by STMicroelectronics is a single SCR in a rectangular plastic/epoxy package, ideal for controlling high currents. It supports a max on-state current of 4 A and operates up to 125 °C, making it suitable for various power applications. With a peak reverse voltage of 200 V, it's perfect for robust circuit designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,444 parts In-Stock

1+ parts

-

100+ parts

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2,444

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-

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Anansix

USA . 2,418 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,418

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Vyrian

USA . 1,351 parts In-Stock

1+ parts

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100+ parts

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10k+ parts

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1,351

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 708 parts In-Stock

1+ parts

$3.785

100+ parts

-

1k+ parts

$3.406

10k+ parts

-

708

$3.785

-

$3.406

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MKK Technologies

India . 1,040 parts In-Stock

1+ parts

$7.117

100+ parts

-

1k+ parts

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10k+ parts

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1,040

$7.117

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DigiPath Technology Company

USA . 1,040 parts In-Stock

1+ parts

$7.117

100+ parts

-

1k+ parts

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10k+ parts

-

1,040

$7.117

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Corphita

USA . 2,749 parts In-Stock

1+ parts

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2,749

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Parana Technologies

USA . 2,254 parts In-Stock

1+ parts

-

100+ parts

$4.525

1k+ parts

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10k+ parts

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2,254

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$4.525

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Overview

Elevate your electronic designs with the X0402BF from STMicroelectronics, a top-tier Silicon Controlled Rectifier (SCR) renowned for its unparalleled reliability and performance. Engineered to thrive in demanding environments, this robust component delivers exceptional efficiency for a wide range of applications, from industrial control systems to consumer electronics. Trust in STMicroelectronics’ legacy of quality to power your innovations, ensuring peace of mind with every circuit. Experience the advantage today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making this SCR suitable for a variety of applications.

Maximum DC Gate Trigger Current: 0.2 mA

A low gate trigger current makes this SCR energy-efficient and allows for easy interfacing with low-power control circuits.

Configuration: SINGLE

The single configuration allows for straightforward integration into circuits, making it easier to design and implement solutions.

Non-Repetitive Peak On-state Current: 27 A

High peak on-state current capability makes this SCR suitable for applications that require handling high load conditions briefly.

Package Shape: RECTANGULAR

The rectangular shape facilitates compact PCB designs, optimizing space utilization in electronic assemblies.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and reliable electrical connections, ideal for high-stress environments.

Maximum On-state Current: 4 A

The ability to handle 4 A on-state current makes this SCR versatile for many power control applications.

Maximum Leakage Current: 0.2 mA

Low leakage current improves overall system efficiency and helps to reduce energy consumption in idle states.

Repetitive Peak Reverse Voltage: 200 V

A high reverse voltage rating allows the SCR to operate safely in applications with substantial voltage fluctuations.

No. of Terminals: 3

Three terminals simplify the circuit connections and offer flexibility in design for various applications.

Package Style (Meter): IN-LINE

The in-line package style is ideal for efficient assembly and integration into electronic systems.

Maximum Operating Temperature: 125 °C

The high operating temperature rating enhances reliability and widens the scope of applications in harsher environments.

Trigger Device Type: SCR

As an SCR, this device allows for efficient control of high-power AC loads, making it essential for power electronics.

Minimum Operating Temperature: -45 °C

The low minimum operating temperature ensures functionality in extreme cold environments, increasing application versatility.

Terminal Position: SINGLE

Single terminal positioning simplifies circuit layout and reduces complexity in PCB design.

Maximum RMS On-state Current: 4 A

This current capability allows for efficient conduction during on-state conditions, enhancing system performance.

Maximum DC Gate Trigger Voltage: 0.8 V

A low gate trigger voltage improves compatibility with a wide range of control circuits, promoting efficient circuit design.

Repetitive Peak Off-state Voltage: 200 V

High off-state voltage handling capability ensures reliable performance under high-voltage conditions.

Minimum Critical Rate of Rise of Off-state Voltage: 30 V/μs

A high critical rate of rise allows for quick turn-off, enhancing performance in fast-switching applications.

Maximum Holding Current: 5 mA

The low holding current requirement aids in improving circuit efficiency and reduces the risk of unintentional triggering.

Technical Specifications

Silicon Controlled Rectifiers (SCR) X0402BF attributes and parameters. Explore more Silicon Controlled Rectifiers (SCR) devices from STMicroelectronics

Specs

Additional Features:

SENSITIVE GATE

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

30 V/us

Maximum DC Gate Trigger Current:

.2 mA

Maximum DC Gate Trigger Voltage:

.8 V

Maximum Holding Current:

5 mA

JESD-30 Code:

R-PSIP-T3

Maximum Leakage Current:

.2 mA

Non Repetitive Peak On-state Current:

27 A

No. of Elements:

1

No. of Terminals:

3

Maximum On-state Current:

4 A

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-45 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Maximum RMS On-state Current:

4 A

Repetitive Peak Off-state Voltage:

200 V

Repetitive Peak Reverse Voltage:

200 V

Sub-Category:

Silicon Controlled Rectifiers

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Device Type:

SCR

Trade Compliance

X0402BF Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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