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VND830LSP13TR

STMicroelectronics

VND830LSP13TR by STMicroelectronics

VND830LSP13TR by STMicroelectronics is a robust peripheral driver with a max supply voltage of 36V and built-in protections against overcurrent, overvoltage, and undervoltage. It features a compact rectangular package with 10 terminals and supports output currents up to 23A. Ideal for automotive applications, it ensures reliable performance in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,624

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-

-

-

Digiode

USA . 1,222 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,222

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-

-

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Anansix

USA . 936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

936

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 368 parts In-Stock

1+ parts

$1.950

100+ parts

-

1k+ parts

$1.755

10k+ parts

-

368

$1.950

-

$1.755

-

MKK Technologies

India . 1,822 parts In-Stock

1+ parts

$3.668

100+ parts

-

1k+ parts

-

10k+ parts

-

1,822

$3.668

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DigiPath Technology Company

USA . 1,822 parts In-Stock

1+ parts

$3.668

100+ parts

-

1k+ parts

-

10k+ parts

-

1,822

$3.668

-

-

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AZTECH Wire

Italy . 367 parts In-Stock

1+ parts

$20.800

100+ parts

-

1k+ parts

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10k+ parts

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367

$20.800

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Microchip USA

USA . 133 parts In-Stock

1+ parts

$42.931

100+ parts

-

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10k+ parts

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133

$42.931

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-

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Parana Technologies

USA . 676 parts In-Stock

1+ parts

-

100+ parts

$2.332

1k+ parts

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10k+ parts

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676

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$2.332

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Corphita

USA . 213 parts In-Stock

1+ parts

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213

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Overview

Elevate your design with the VND830LSP13TR from STMicroelectronics, a top-tier peripheral driver that ensures reliability and exceptional performance. Engineered for superior durability, it features built-in protections against overcurrent, undervoltage, and overvoltage, making it ideal for automotive and industrial applications. Enjoy peace of mind with ST's renowned quality and innovation, enhancing your project’s efficiency while minimizing downtime.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures reliability and robustness in various operating environments.

Surface Mount: YES

Surface mount capability allows for easier integration into modern circuit boards, optimizing space and performance.

Maximum Supply Voltage: 36 V

A high maximum supply voltage provides flexibility and compatibility with a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on PCBs and facilitates organized component placement.

Built-in Protections: OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE

Integrated protections enhance safety and reliability, preventing damage in case of electrical faults.

Power Supplies (V): 13

Optimized for a nominal supply voltage of 13V, ensuring efficient operation in typical applications.

No. of Terminals: 10

Ten terminals allow for versatile connections, supporting complex circuit designs and functionalities.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline design with heat sink capability improves thermal management and device performance.

Minimum Supply Voltage: 5.5 V

A low minimum supply voltage ensures compatibility with various low-voltage applications.

Terminal Finish: MATTE TIN

Matte tin finishing improves solderability and ensures reliable connections during PCB assembly.

Terminal Position: DUAL

Dual terminal positioning simplifies PCB layout and enhances connection options.

Maximum Seated Height: 3.75 mm

A compact seated height allows for low-profile designs, suitable for space-constrained applications.

Width: 7.5 mm

A moderate width enables fitting into various chassis and enclosures without compromising functionality.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow times ensure efficient manufacturing processes while maintaining device integrity.

Peak Reflow Temperature °C: 250

A high reflow temperature allows compatibility with robust soldering technologies, ensuring reliable assembly.

Length: 9.4 mm

Compact length aids in design flexibility, fitting snugly in more confined electronic assemblies.

Terminal Form: GULL WING

Gull wing terminals promote ease of handling and soldering, enhancing manufacturing efficiency.

Nominal Supply Voltage: 13 V

A stable nominal supply voltage ensures consistent performance in various applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is industry standard, allowing for compatibility with existing PCB designs.

Driver No. of Bits: 2

With two bits, this driver can manage basic control tasks efficiently, perfect for simpler applications.

Moisture Sensitivity Level (MSL): 3

MSL 3 designation signifies suitable handling requirements, making it easier for manufacturers to manage.

Nominal Output Peak Current Limit: 23 A

A high peak current limit allows for robust performance in demanding applications, ensuring reliability.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Designed for versatile operation, making it suitable for a wide range of interfacing applications.

Output Current Flow Direction: SINK

The sink current direction is common in various applications, making it an adaptable choice for designers.

Technical Specifications

Peripheral Drivers VND830LSP13TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; OVER VOLTAGE; UNDER VOLTAGE

Driver No. of Bits:

2

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e3

Length:

9.4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

23 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.55FL

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

250

Power Supplies (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

3.75 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VND830LSP13TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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