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TS834-5ID

STMicroelectronics

TS834-5ID by STMicroelectronics

TS834-5ID by STMicroelectronics is a CMOS power management IC with a nominal voltage of 5V and operates b/w -40 °C to 85°C. It features an 8-terminal gull-wing package and supports applications requiring efficient power supply regulation. Ideal for industrial use, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,351 parts In-Stock

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5,351

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Digiode

USA . 2,753 parts In-Stock

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2,753

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Anansix

USA . 1,112 parts In-Stock

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LWI Electronics Inc

India . 4 parts In-Stock

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Microchip USA

USA . 199 parts In-Stock

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$2.702

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199

$2.702

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IDEA Electronic Components Group

UK . 588 parts In-Stock

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$11.955

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-

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$10.760

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588

$11.955

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$10.760

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AZTECH Wire

Italy . 761 parts In-Stock

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$16.710

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761

$16.710

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MKK Technologies

India . 679 parts In-Stock

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$22.481

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679

$22.481

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DigiPath Technology Company

USA . 679 parts In-Stock

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$22.481

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679

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Component Stockers USA

USA . 488 parts In-Stock

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$99.990

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 10,747 parts In-Stock

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Vigor

Singapore . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,036 parts In-Stock

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Parana Technologies

USA . 2,308 parts In-Stock

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$14.294

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Corphita

USA . 758 parts In-Stock

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Metaverse IC Inc.

Canada . 305 parts In-Stock

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Kepictronics

USA . 205 parts In-Stock

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Overview

Elevate your designs with the TS834-5ID from STMicroelectronics, a trusted leader in power management solutions. This compact and efficient IC delivers reliable performance for various applications, ensuring optimal power supply stability across industrial environments. With exceptional temperature resilience and minimal power consumption, it empowers your projects with both efficiency and longevity. Trust STMicroelectronics to provide quality that enhances your innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enables robust encapsulation, providing protection against environmental factors while minimizing weight, making it suitable for a variety of applications.

Surface Mount: YES

Being surface mount compatible allows for easier and more efficient PCB design and assembly, dramatically reducing space and enabling high-density circuit layouts.

Package Shape: RECTANGULAR

The rectangular shape enhances layout flexibility on PCBs, permitting better space optimization and routing of electrical pathways.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V is commonly used in various applications, providing compatibility with a wide range of existing systems.

Power Supplies (V): 1/5.5

This wide input voltage range (1 to 5.5 V) allows the IC to be utilized in diverse applications, accommodating various electronic devices.

No. of Terminals: 8

With 8 terminals, this IC allows for sufficient connectivity while maintaining a compact design, making it ideal for a range of power management applications.

Package Style (Meter): SMALL OUTLINE

The small outline design minimizes PCB real estate consumption, facilitating the development of compact circuits in space-constrained applications.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures the IC can perform reliably in high-temperature conditions, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C guarantees functionality in extreme conditions, enhancing its reliability in outdoor and harsh environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold plating offers excellent corrosion resistance and ensures a reliable electrical connection, contributing to the durability and longevity of the device.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options, simplifying PCB design and layout for manufacturers.

Maximum Seated Height: 1.75 mm

A low maximum seated height of 1.75 mm helps keep the overall profile of the assembly low, which is crucial for compact electronic designs.

Width (mm): 3.9 mm

With a width of 3.9 mm, this IC occupies minimal board space, enabling more components to be placed in tighter configurations.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it enhances system efficiency and stability, making it an essential component for power management in electronic devices.

Minimum Supply Voltage (Vsup): 1.5 V

A minimum supply voltage of 1.5 V extends compatibility with low-voltage systems, catering to modern low-power applications.

Length: 4.9 mm

At a length of 4.9 mm, this compact size allows for more efficient board designs, particularly in portable or space-constrained settings.

Nominal Threshold Voltage (V): +4.33V

A nominal threshold voltage of +4.33V allows for reliable triggering and stability in power management applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade signifies that this IC can endure challenging conditions, ensuring reliability across various industrial applications.

Maximum Supply Current (Isup): 0.012 mA

A maximum supply current of only 0.012 mA signifies low power consumption, essential for battery-operated and energy-efficient designs.

Technology: CMOS

Utilizing CMOS technology enhances energy efficiency and speed, making it suitable for high-performance applications while consuming minimal power.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and improves electrical performance, making fabrication and assembly processes simpler.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact arrangements on PCBs while maintaining a reliable connection integrity.

Maximum Supply Voltage (Vsup): 5.5 V

With a maximum supply voltage of 5.5 V, this IC accommodates a variety of higher voltage applications while ensuring safe operation.

Technical Specifications

Power Management ICs TS834-5ID attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.33V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.012 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.33V

Width (mm):

3.9 mm

Trade Compliance

TS834-5ID Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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