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TS831-3IZ-AP

STMicroelectronics

TS831-3IZ-AP by STMicroelectronics

TS831-3IZ-AP by STMicroelectronics is a CMOS power management IC designed for automotive applications. It operates within a supply voltage range of 1V to 5.5V, with a nominal threshold of +2.71V and supports temperatures from -40 °C to 125 °C. This compact, cylindrical device features three terminals and ensures efficient power supply support.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,031 parts In-Stock

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4,031

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Digiode

USA . 3,417 parts In-Stock

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3,417

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Pegasus Components GmbH

Germany . 1,753 parts In-Stock

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1,753

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Anansix

USA . 1,598 parts In-Stock

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1,598

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Distributors (Availability)

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$1.186

100+ parts

$1.079

1k+ parts

$0.973

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-

500

$1.186

$1.079

$0.973

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IDEA Electronic Components Group

UK . 566 parts In-Stock

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$1.923

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-

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$1.731

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566

$1.923

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$1.731

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Microchip USA

USA . 345 parts In-Stock

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$2.993

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345

$2.993

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MKK Technologies

India . 202 parts In-Stock

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$3.616

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202

$3.616

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DigiPath Technology Company

USA . 202 parts In-Stock

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$3.616

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202

$3.616

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Component Stockers USA

USA . 626 parts In-Stock

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$99.990

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626

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 3,299 parts In-Stock

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3,299

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Corphita

USA . 2,747 parts In-Stock

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Parana Technologies

USA . 1,134 parts In-Stock

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$2.299

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1,134

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$2.299

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Overview

Elevate your power management solutions with the TS831-3IZ-AP from STMicroelectronics, a leader in innovation and quality. This versatile IC is designed for reliability across demanding automotive applications, ensuring optimal performance even in extreme temperatures. Enjoy the benefits of minimal power consumption and robust design, empowering your projects with efficiency and longevity. Trust in STMicroelectronics for cutting-edge technology that drives success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Utilizing durable plastic/epoxy materials ensures reliability and longevity of the IC under various environmental conditions.

Package Shape: ROUND

The round package shape allows for easier integration in compact spaces and enhances thermal performance.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V makes this IC compatible with common electronic systems, simplifying design requirements.

Power Supplies (V): 1/5.5

Operating within a range of 1 to 5.5 V provides flexibility in applications, accommodating a variety of power supply configurations.

No. of Terminals: 3

The 3-terminal design streamlines circuit layouts while still providing essential functionality.

Package Style (Meter): CYLINDRICAL

The cylindrical package style enhances manufacturability and ease of handling during assembly.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures the IC can function reliably in high-temperature environments, making it suitable for automotive applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is ideal for harsh environments, ensuring consistent performance across temperature extremes.

Terminal Finish: TIN

TIN terminal finish improves solderability and enhances corrosion resistance, leading to decreased failure rates in assembly.

Terminal Position: BOTTOM

Bottom terminal positioning optimizes space usage on PCBs, facilitating denser designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed as a power supply support circuit, this IC can effectively manage voltage supply, adding value to power management solutions.

Minimum Supply Voltage (Vsup): 1 V

The capability to operate down to 1 V enhances versatility, allowing deployment in low-power applications.

Nominal Threshold Voltage (V): +2.71 V

A nominal threshold voltage of +2.71 V ensures reliable switching and operation of the IC under varying load conditions.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, this IC is designed to withstand the demands of automotive environments, providing added assurance of quality and reliability.

Maximum Supply Current (Isup): 0.012 mA

A maximum supply current of only 0.012 mA indicates high efficiency, making this IC suitable for battery-powered applications.

Technology: CMOS

Utilizing CMOS technology provides lower power consumption and higher integration density, essential for modern electronic designs.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for sturdier connections, improving durability in demanding applications.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for PCB layouts, enabling easy integration into existing designs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V offers a safe operating range for various applications, preventing potential damage to the IC.

Technical Specifications

Power Management ICs TS831-3IZ-AP attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.71V

Adjustable Threshold:

NO

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP3,.1,50

Package Shape:

Package Style (Meter):

CYLINDRICAL

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.012 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+2.71V

Trade Compliance

TS831-3IZ-AP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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