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TS831-5ID

STMicroelectronics

TS831-5ID by STMicroelectronics

STMicroelectronics' TS831-5ID is a Power Management IC with 8 terminals, operating at -40 to 125 °C. It has a supply voltage range of 1-5.5 V and supports automotive applications. The small outline package is surface mountable, making it suitable for compact designs in various electronic systems.

Median Price

$0.275

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 4,000 parts In-Stock

1+ parts

-

100+ parts

$0.275

1k+ parts

$0.260

10k+ parts

$0.250

4,000

-

$0.275

$0.260

$0.250

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 1,800 parts In-Stock

1+ parts

$1.080

100+ parts

-

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1,800

$1.080

-

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Vyrian

USA . 6,396 parts In-Stock

1+ parts

-

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6,396

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Digiode

USA . 1,678 parts In-Stock

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1,678

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-

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Anansix

USA . 830 parts In-Stock

1+ parts

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830

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A2Z Electronics, Inc.

USA . 8 parts In-Stock

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8

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LWI Electronics Inc

India . 5 parts In-Stock

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5

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Distributors (Availability)

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Microchip USA

USA . 396 parts In-Stock

1+ parts

$1.059

100+ parts

-

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396

$1.059

-

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IDEA Electronic Components Group

UK . 1,580 parts In-Stock

1+ parts

$11.461

100+ parts

-

1k+ parts

$10.315

10k+ parts

-

1,580

$11.461

-

$10.315

-

AZTECH Wire

Italy . 353 parts In-Stock

1+ parts

$20.160

100+ parts

-

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353

$20.160

-

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MKK Technologies

India . 1,858 parts In-Stock

1+ parts

$21.552

100+ parts

-

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1,858

$21.552

-

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DigiPath Technology Company

USA . 1,858 parts In-Stock

1+ parts

$21.552

100+ parts

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1,858

$21.552

-

-

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A-Z Elektronik GmbH

Germany . 6,023 parts In-Stock

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6,023

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Vigor

Singapore . 4,911 parts In-Stock

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4,911

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Corphita

USA . 4,624 parts In-Stock

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4,624

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Perfect Parts

USA . 4,480 parts In-Stock

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4,480

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Component Stockers USA

USA . 4,415 parts In-Stock

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4,415

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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-

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Parana Technologies

USA . 1,413 parts In-Stock

1+ parts

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100+ parts

$13.704

1k+ parts

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1,413

-

$13.704

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Assy Fe

Spain . 28 parts In-Stock

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28

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Overview

Unlock the power of efficient and reliable power management with the TS831-5ID by STMicroelectronics. As a trusted manufacturer in the industry, STMicroelectronics delivers top-quality Power Management ICs that cater to a wide range of applications. With a small outline package style and a wide operating temperature range, this IC is perfect for automotive applications where reliability is key. Trust STMicroelectronics to provide you with the value and benefits you need to power your devices seamlessly. Choose the TS831-5ID for superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material offers good insulation properties and helps in reducing the overall weight of the package, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and labor costs during production.

Nominal Supply Voltage (Vsup): 5 V

Standard 5V supply voltage ensures compatibility with a wide range of devices and systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance even in harsh environments or under heavy loads.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable for power management applications.

Technical Specifications

Power Management ICs TS831-5ID attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.33V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.012 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.33V

Width (mm):

3.9 mm

Trade Compliance

TS831-5ID Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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