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TS831-4IP

STMicroelectronics

TS831-4IP by STMicroelectronics

TS831-4IP by STMicroelectronics is a power management IC designed for automotive applications, featuring a nominal voltage of 5V and operating temperature range from -40 °C to 125°C. It comes in an 8-terminal, thin profile package with gull-wing terminals. This versatile IC supports supply voltages b/w 1V and 5.5V, ensuring reliable performance in various conditions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,548 parts In-Stock

1+ parts

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2,548

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Anansix

USA . 1,646 parts In-Stock

1+ parts

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1,646

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Vyrian

USA . 1,471 parts In-Stock

1+ parts

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1,471

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,053 parts In-Stock

1+ parts

$22.874

100+ parts

-

1k+ parts

$20.587

10k+ parts

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1,053

$22.874

-

$20.587

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MKK Technologies

India . 39 parts In-Stock

1+ parts

$43.013

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39

$43.013

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DigiPath Technology Company

USA . 39 parts In-Stock

1+ parts

$43.013

100+ parts

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39

$43.013

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Corphita

USA . 3,982 parts In-Stock

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3,982

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Parana Technologies

USA . 2,322 parts In-Stock

1+ parts

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100+ parts

$27.349

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2,322

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$27.349

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Overview

Unlock the potential of your designs with the TS831-4IP from STMicroelectronics, a trusted leader in power management solutions. This compact and robust IC is engineered for versatility across automotive and industrial applications, ensuring reliable performance even in extreme temperatures. With exceptional efficiency and a sleek surface-mount design, the TS831-4IP empowers you to create innovative products that stand out in the market, delivering unmatched quality and value to your customers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being a surface mount device allows for compact design and reduced board space, enhancing the overall efficiency of the circuit.

Package Shape: RECTANGULAR

The rectangular package shape optimizes layout for tighter spaces and efficient thermal and electrical performance.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V is standard for many applications, ensuring compatibility and ease of integration into existing systems.

No. of Terminals: 8

With 8 terminals, the product offers a balance between complexity and functionality, fitting a range of applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design facilitate high-density circuit board layouts, making it an excellent choice for space-constrained applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature allows the IC to function reliably in demanding thermal environments, crucial for automotive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures reliable operation in extreme conditions, essential for automotive and industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent corrosion resistance and improves solderability, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility on PCB, allowing for easier routing of traces.

Maximum Seated Height: 1.2 mm

The low seated height facilitates integration into compact circuits, ideal for portable devices.

Width: 3 mm

A narrow width helps save space on the PCB, accommodating more components and complex designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC type signifies a focus on power management, making it suitable for applications requiring efficient power regulation.

Minimum Supply Voltage (Vsup): 1 V

A minimum supply voltage of 1V allows it to operate in low-power situations, making it versatile for various applications.

Maximum Time At Peak Reflow Temperature: 40 s

A maximum time of 40 seconds at peak reflow temperature ensures effective solder bonding without damaging the IC.

Peak Reflow Temperature: 260 °C

This high peak reflow temperature compatibility allows for modern assembly processes, making it suitable for high-volume production.

Length: 4.4 mm

A compact length enhances PCB layout options, allowing for efficient design strategies in space-limited environments.

Nominal Threshold Voltage (V): +4.5V

A nominal threshold voltage of +4.5V indicates the IC can effectively manage and regulate voltage levels relevant to common electronic circuits.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, this IC is built to withstand the rigorous demands and reliability standards required in automotive applications.

Terminal Form: GULL WING

The gull wing terminal design optimizes soldering, improving assembly reliability and overall performance.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for efficient routing and soldering, making it suitable for high-density PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V ensures compatibility with a wide range of power supplies, enhancing design flexibility.

Technical Specifications

Power Management ICs TS831-4IP attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.50V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.5V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3 mm

Trade Compliance

TS831-4IP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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