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TS831-5IP

STMicroelectronics

TS831-5IP by STMicroelectronics

TS831-5IP by STMicroelectronics is a compact power management IC designed for automotive applications. It operates within a supply voltage range of 1V to 5.5V and withstands temperatures from -40 °C to 125°C. Its small outline package features 8 terminals with a thin profile, ideal for space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,562 parts In-Stock

1+ parts

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4,562

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Digiode

USA . 1,161 parts In-Stock

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1,161

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Anansix

USA . 405 parts In-Stock

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405

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,599 parts In-Stock

1+ parts

$11.241

100+ parts

-

1k+ parts

$10.117

10k+ parts

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1,599

$11.241

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$10.117

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MKK Technologies

India . 754 parts In-Stock

1+ parts

$21.139

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754

$21.139

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DigiPath Technology Company

USA . 754 parts In-Stock

1+ parts

$21.139

100+ parts

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754

$21.139

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-

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Parana Technologies

USA . 1,517 parts In-Stock

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-

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$13.441

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1,517

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$13.441

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Corphita

USA . 519 parts In-Stock

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519

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Overview

Elevate your power management solutions with the TS831-5IP from STMicroelectronics, a trusted leader in innovation. Designed for automotive applications, this compact IC ensures reliable performance across extreme temperatures, delivering exceptional efficiency and stability. Its sleek surface-mount design saves space while its robust quality guarantees longevity. Experience unmatched value and peace of mind, knowing you're backed by ST's renowned expertise in power supply technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides good thermal and moisture protection, making it suitable for various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easier and more compact assembly in electronic devices, leading to space-saving designs.

Package Shape: RECTANGULAR

The rectangular shape is optimized for efficient board space usage and facilitates simple layout design.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V is standard across many systems, ensuring compatibility and ease of integration.

No. of Terminals: 8

Having 8 terminals balances complexity and functionality, making the IC versatile for various applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style optimizes space and reduces the footprint on printed circuit boards, ideal for compact electronic designs.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this IC suitable for use in demanding applications, including automotive environments.

Minimum Operating Temperature: -40 °C

The ability to function in extreme low temperatures enhances the reliability of the IC in harsh conditions.

Terminal Position: DUAL

Dual terminal positioning provides flexibility in design and layout, making it easier to incorporate into various circuit boards.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a slim profile, ideal for modern electronics requiring low-profile components.

Width: 3 mm

A compact width enables easy integration into tightly designed circuits while maintaining performance.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Dedicated to power supply support, this IC reduces the complexity of power management in designs.

Minimum Supply Voltage (Vsup): 1 V

A low minimum supply voltage ensures compatibility with a wide range of power sources and battery-operated devices.

Length: 4.4 mm

A short length contributes to overall compact design, making this IC ideal for space-constrained applications.

Nominal Threshold Voltage (V): +4.33V

The specific threshold voltage ensures precision in applications requiring strict voltage regulation.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means this IC meets rigorous standards, making it reliable for use in vehicles.

Terminal Form: GULL WING

Gull wing terminals provide reliable soldering and are compatible with automated assembly processes.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for denser packaging of components, suitable for advanced electronic designs.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides flexibility for powering a variety of circuits while safeguarding against over-voltage damage.

Technical Specifications

Power Management ICs TS831-5IP attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.33V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.33V

Width (mm):

3 mm

Trade Compliance

TS831-5IP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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