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TS831-3ID

STMicroelectronics

TS831-3ID by STMicroelectronics

TS831-3ID by STMicroelectronics is a compact power management IC designed for automotive applications, operating b/w -40 °C to 125°C. It features a nominal voltage of 3V, supports voltages from 1V to 5.5V, and has an ultra-low supply current of just 12µA. Its small outline package ensures efficient space utilization in electronic designs.

Median Price

$0.770

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Electronics Inc.

Canada . 470 parts In-Stock

1+ parts

$0.770

100+ parts

$0.580

1k+ parts

$0.500

10k+ parts

-

470

$0.770

$0.580

$0.500

-

Vyrian

USA . 6,514 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,514

-

-

-

-

Digiode

USA . 4,718 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,718

-

-

-

-

Anansix

USA . 1,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,424

-

-

-

-

ComSIT Distribution GmbH

Germany . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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200

-

-

-

-

LWI Electronics Inc

India . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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5

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,319 parts In-Stock

1+ parts

$2.497

100+ parts

-

1k+ parts

$2.247

10k+ parts

-

1,319

$2.497

-

$2.247

-

MKK Technologies

India . 1,731 parts In-Stock

1+ parts

$4.695

100+ parts

-

1k+ parts

-

10k+ parts

-

1,731

$4.695

-

-

-

DigiPath Technology Company

USA . 1,731 parts In-Stock

1+ parts

$4.695

100+ parts

-

1k+ parts

-

10k+ parts

-

1,731

$4.695

-

-

-

Microchip USA

USA . 139 parts In-Stock

1+ parts

$6.854

100+ parts

-

1k+ parts

-

10k+ parts

-

139

$6.854

-

-

-

AZTECH Wire

Italy . 667 parts In-Stock

1+ parts

$10.390

100+ parts

-

1k+ parts

-

10k+ parts

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667

$10.390

-

-

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Component Stockers USA

USA . 277 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

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277

$99.990

-

-

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A-Z Elektronik GmbH

Germany . 6,789 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,789

-

-

-

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Vigor

Singapore . 2,273 parts In-Stock

1+ parts

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2,273

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Corphita

USA . 403 parts In-Stock

1+ parts

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1k+ parts

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403

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Parana Technologies

USA . 382 parts In-Stock

1+ parts

-

100+ parts

$2.985

1k+ parts

-

10k+ parts

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382

-

$2.985

-

-

Overview

Unlock the potential of your projects with the TS831-3ID from STMicroelectronics, a leader in power management solutions. This compact IC delivers exceptional performance across automotive and industrial applications, ensuring reliability even in extreme temperatures. With its advanced CMOS technology, enjoy low power consumption and efficient voltage regulation, empowering your designs with quality and precision that STMicroelectronics is renowned for. Elevate your innovations today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for efficient, automated assembly, saving time and reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the PCB, allowing for a compact design and enhancing layout flexibility.

Nominal Supply Voltage (Vsup): 3 V

This nominal supply voltage aligns with standard low-voltage systems, making it compatible with many devices.

Power Supplies (V): 1/5.5

The wide operating voltage range (1 V to 5.5 V) allows for versatile usage across various applications.

No. of Terminals: 8

Having 8 terminals helps facilitate integration while maintaining a compact form factor, ideal for space-constrained designs.

Package Style (Meter): SMALL OUTLINE

A small outline package reduces the footprint on the PCB, allowing more components to fit in limited space.

Maximum Operating Temperature: 125 °C

Designed to operate at higher temperatures, this IC can withstand harsh automotive environments effectively.

Minimum Operating Temperature: -40 °C

The ability to function at low temperatures ensures reliability in extreme cold conditions, crucial for automotive applications.

Terminal Position: DUAL

Dual terminal positioning provides better electrical performance and layout flexibility for circuit designs.

Maximum Seated Height: 1.75 mm

A low profile design allows for slim applications and reduces the overall height on the PCB.

Width: 3.9 mm

Compact width contributes to space efficiency, allowing for higher density in PCB layouts.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This classification indicates its dedicated function in power management, crucial for maintaining system stability.

Minimum Supply Voltage (Vsup): 1 V

With a low minimum supply voltage, this IC is suitable for battery-operated or energy-efficient designs.

Length: 4.9 mm

The short length helps in minimizing the area needed on the PCB, enhancing design efficiency.

Nominal Threshold Voltage (V): +2.71V

The specific threshold voltage enables precise control in switching applications, improving performance.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures reliability and performance in demanding automotive environments.

Maximum Supply Current (Isup): 0.012 mA

A low supply current enhances energy efficiency, making it ideal for low-power applications.

Technology: CMOS

CMOS technology provides low power consumption and high integration levels, benefiting overall system efficiency.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliability in surface mount applications.

Terminal Pitch: 1.27 mm

The standardized pitch enables compatibility with existing PCB designs and equipment, improving layout flexibility.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage allows for compatibility with a wide range of electronic components, enhancing versatility.

Technical Specifications

Power Management ICs TS831-3ID attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.71V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.012 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.71V

Width (mm):

3.9 mm

Trade Compliance

TS831-3ID Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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