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TS831-3IP

STMicroelectronics

TS831-3IP by STMicroelectronics

TS831-3IP by STMicroelectronics is a compact power management IC designed for automotive applications. It operates within a supply voltage range of 1V to 5.5V and withstands temperatures from -40 °C to 125°C. Its small outline package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,345 parts In-Stock

1+ parts

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4,345

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Digiode

USA . 4,107 parts In-Stock

1+ parts

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4,107

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Anansix

USA . 2,463 parts In-Stock

1+ parts

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2,463

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 476 parts In-Stock

1+ parts

$12.485

100+ parts

-

1k+ parts

$11.237

10k+ parts

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476

$12.485

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$11.237

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MKK Technologies

India . 1,799 parts In-Stock

1+ parts

$23.478

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1,799

$23.478

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DigiPath Technology Company

USA . 1,799 parts In-Stock

1+ parts

$23.478

100+ parts

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1,799

$23.478

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Corphita

USA . 4,766 parts In-Stock

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4,766

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Parana Technologies

USA . 936 parts In-Stock

1+ parts

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100+ parts

$14.928

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936

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$14.928

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Overview

Unlock unparalleled efficiency with the TS831-3IP from STMicroelectronics, a leader in innovative power management solutions. This compact IC ensures reliable performance across diverse applications—from automotive to consumer electronics—boasting a robust operational range and exceptional thermal stability. With its surface mount design, it’s easy to integrate, offering you reduced space and enhanced reliability. Elevate your projects with the trusted quality of STMicroelectronics and experience significant energy savings and superior functionality today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into modern circuit boards, optimizing space and improving assembly efficiencies.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient PCB layout and design while ensuring a compact footprint.

Nominal Supply Voltage (Vsup): 3 V

A nominal supply voltage of 3 V is ideal for low-power applications, contributing to energy efficiency in power management systems.

No. of Terminals: 8

Eight terminals offer multiple connection points, enhancing flexibility for various circuit configurations and designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This style is designed for space-constrained applications, allowing for more compact designs while maintaining performance.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature of 125 °C allows for reliable performance in demanding environments, making it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The minimum operating temperature of -40 °C ensures reliable operation in cold environments, enhancing its applicability in various climates.

Terminal Position: DUAL

Dual terminal positions provide flexibility in layout and assembly, simplifying integration into diverse PCB designs.

Maximum Seated Height: 1.2 mm

A low seated height of 1.2 mm contributes to space savings on PCB, making it an ideal choice for thin-profile applications.

Width: 3 mm

A narrow width of 3 mm allows for high-density designs, making it suitable for compact electronic devices.

Other IC Type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply support, this IC is optimized for efficiency, ensuring stable performance in various applications.

Minimum Supply Voltage (Vsup): 1 V

With a minimum supply voltage of 1 V, this product is compatible with a wide range of low-voltage applications, enhancing its versatility.

Length: 4.4 mm

The compact length of 4.4 mm contributes to space-efficient designs, making it suitable for modern, smaller devices.

Nominal Threshold Voltage (V): +2.71V

A nominal threshold voltage of +2.71V allows for effective voltage regulation, ensuring reliable operation for power-sensitive applications.

Temperature Grade: AUTOMOTIVE

Automotive-grade temperature classification ensures reliability and durability in harsh automotive environments, meeting industry standards.

Terminal Form: GULL WING

Gull wing terminal form enhances the solderability and provides stable mechanical connections to the PCB.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for high-density packaging, facilitating modern circuit design trends and saving PCB space.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V ensures compatibility with a variety of power sources, providing flexibility across diverse applications.

Technical Specifications

Power Management ICs TS831-3IP attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.71V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.71V

Width (mm):

3 mm

Trade Compliance

TS831-3IP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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