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TS831-4IZ-AP

STMicroelectronics

TS831-4IZ-AP by STMicroelectronics

TS831-4IZ-AP by STMicroelectronics is a CMOS power management IC designed for automotive applications. It operates within a supply voltage range of 1V to 5.5V, with a nominal voltage of 5V and a max temp of 125 °C. This device features a compact cylindrical package with three terminals for efficient integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 3,061 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,000 parts In-Stock

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ComSIT USA

USA . 2,000 parts In-Stock

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Digiode

USA . 1,783 parts In-Stock

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Anansix

USA . 174 parts In-Stock

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Semi Source

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Microchip USA

USA . 461 parts In-Stock

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$4.935

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IDEA Electronic Components Group

UK . 480 parts In-Stock

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$13.453

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$12.108

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480

$13.453

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$12.108

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MKK Technologies

India . 747 parts In-Stock

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$25.298

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DigiPath Technology Company

USA . 747 parts In-Stock

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$25.298

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Assy Fe

Spain . 6,000 parts In-Stock

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Corphita

USA . 3,206 parts In-Stock

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Authorized Procurement Solutions

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Vigor

Singapore . 1,570 parts In-Stock

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Parana Technologies

USA . 257 parts In-Stock

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$16.085

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Overview

Elevate your designs with the TS831-4IZ-AP from STMicroelectronics, a leader in power management solutions. This robust IC ensures reliable performance across diverse applications, from automotive to consumer electronics, all while delivering energy efficiency and superior thermal stability. With its compact design and impressive operating range, the TS831-4IZ-AP empowers you to create innovative, long-lasting products that delight customers and drive success. Choose quality, choose STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and reliability, essential for automotive applications.

Package Shape: ROUND

The round package shape allows for efficient use of space and simplified placement in various applications.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5 V is standard in many circuits, making this IC compatible with a variety of systems.

Power Supplies (V): 1/5.5

Supports a wide range of supply voltages, enhancing flexibility in application design.

No. of Terminals: 3

Having three terminals simplifies integration into circuit designs, making it easier to prototype and produce.

Package Style (Meter): CYLINDRICAL

The cylindrical package style allows for efficient thermal management and can fit well in compact spaces.

Maximum Operating Temperature: 125 °C

A maximum operating temperature of 125 °C ensures reliability in high-temperature environments, suitable for automotive use.

Minimum Operating Temperature: -40 °C

A minimum operating temperature of -40 °C guarantees performance in extreme cold conditions, enhancing reliability.

Terminal Finish: TIN

Tin terminal finish provides good solderability and enhances long-term reliability in connections.

Terminal Position: BOTTOM

Bottom terminal positioning is ideal for efficient PCB layout and space-saving designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Being a power supply support circuit makes it inherently capable of managing power efficiently, a must for modern electronics.

Minimum Supply Voltage (Vsup): 1 V

Supports a low minimum supply voltage of 1 V, making it ideal for battery-operated devices.

Nominal Threshold Voltage (V): +4.5V

A nominal threshold voltage of +4.5V allows for reliable switching and operation in a variety of high-performance applications.

Temperature Grade: AUTOMOTIVE

Rated for automotive use, ensuring it meets stringent standards and reliability needed in vehicles.

Maximum Supply Current (Isup): 0.012 mA

Low maximum supply current helps conserve energy, making it suitable for energy-efficient designs.

Technology: CMOS

CMOS technology allows for low power consumption and high integration levels, enhancing overall performance.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical strength and is often easier to work with during prototyping.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is common, allowing for easy compatibility with standard PCB layouts.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides additional flexibility, allowing integration into systems with slightly higher voltage requirements.

Technical Specifications

Power Management ICs TS831-4IZ-AP attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 4.50V

Adjustable Threshold:

NO

JESD-30 Code:

O-PBCY-T3

JESD-609 Code:

e3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP3,.1,50

Package Shape:

Package Style (Meter):

CYLINDRICAL

Power Supplies (V):

1/5.5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.012 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+4.5V

Trade Compliance

TS831-4IZ-AP Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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