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TPS2051BDR

Texas Instruments

TPS2051BDR by Texas Instruments

TPS2051BDR by Texas Instruments is a Power Management IC with 8 terminals, operating voltage range of 2.7V to 5.5V, and small outline package style. It has a temperature range of -40°C to 85°C, making it suitable for industrial applications requiring power supply support circuits in compact designs.

Median Price

$0.767

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 55,217 parts In-Stock

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$0.662

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$0.509

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$0.268

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Arrow

USA . 2,450 parts In-Stock

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$0.872

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$0.576

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$0.344

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$0.872

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DigiKey

USA . 3,740 parts In-Stock

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$0.980

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$0.558

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$0.482

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$0.446

3,740

$0.980

$0.558

$0.482

$0.446

Verical

USA . 2,450 parts In-Stock

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-

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$0.576

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$0.344

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2,450

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$0.576

$0.344

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Distributors (In-Stock)

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Nova Conductors

Japan . 150 parts In-Stock

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$0.427

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$0.427

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TME

Poland . 20 parts In-Stock

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$0.480

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$0.395

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20

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Digiode

USA . 1,051 parts In-Stock

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$0.629

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$0.629

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Maritex

Poland . 12,997 parts In-Stock

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$0.759

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$0.385

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$0.332

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$0.291

12,997

$0.759

$0.385

$0.332

$0.291

Zilex Electronics Inc.

Canada . 15,000 parts In-Stock

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Vyrian

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Cyclops Electronics Ltd

UK . 4,911 parts In-Stock

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Chip Stock

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Dan-Mar Components

USA . 4,092 parts In-Stock

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Bristol Electronics

USA . 2,614 parts In-Stock

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Atlantic Semiconductor

USA . 2,614 parts In-Stock

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Sensible Micro Corp

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Pegasus Components GmbH

Germany . 970 parts In-Stock

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Holdelec - ElecDif-Pro

France . 544 parts In-Stock

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Sunrise Surplus Inc.

USA . 251 parts In-Stock

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Prism Electronics

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Avant Electronics Limited

UK . 65 parts In-Stock

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Connector Distribution Corp

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Right Parts Inc.

USA . 16 parts In-Stock

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Semtec, LLC

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Semi Source

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Distributors (Availability)

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Continental Prestige Electronics

USA . 4,110 parts In-Stock

1+ parts

$0.427

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$0.418

4,110

$0.427

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$0.418

Netroflash

USA . 1,000 parts In-Stock

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$0.427

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$0.406

10k+ parts

$0.397

1,000

$0.427

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$0.406

$0.397

Argo Parts USA

USA . 626 parts In-Stock

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$0.427

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$0.414

626

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$0.414

Ampacity Inc.

Singapore . 13,034 parts In-Stock

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$0.490

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Corphita

USA . 2,090 parts In-Stock

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$0.596

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Semicontronic

India . 13,271 parts In-Stock

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$1.070

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$1.043

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$1.038

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Corohmni

South Africa . 343 parts In-Stock

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$2.444

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$2.444

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Advanced Electronics

New Zealand . 450 parts In-Stock

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$4.105

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$3.899

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$3.899

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$4.105

$3.899

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Parana Technologies

USA . 868 parts In-Stock

1+ parts

$8.698

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$9.378

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868

$8.698

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DigiPath Technology Company

USA . 2,052 parts In-Stock

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$9.578

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$8.811

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$9.578

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ChromeModa Solutions

Germany . 4,158 parts In-Stock

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$9.773

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$8.014

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IDEA Electronic Components Group

UK . 610 parts In-Stock

1+ parts

$9.773

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$9.284

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$8.796

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610

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$8.796

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Perfect Parts

USA . 164,269 parts In-Stock

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Epart123

USA . 45,000 parts In-Stock

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$0.350

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Kepictronics

USA . 25,000 parts In-Stock

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GreenTree Electronics

Israel . 7,500 parts In-Stock

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Infinite Electronics LLP (Excess)

. 7,210 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,804 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2,500 parts In-Stock

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Formix International (Excess)

India . 2,200 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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S.R.D Solutions

India . 1,000 parts In-Stock

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Computer Components Inc. - USA

USA . 85 parts In-Stock

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Overview

Discover the power of the TPS2051BDR from Texas Instruments, a leading manufacturer in Power Management ICs. This versatile device offers reliable and efficient performance for a wide range of applications. With its compact design and high-quality materials, this product ensures maximum durability and seamless integration into your projects. Experience the unmatched value and benefits that the TPS2051BDR brings to your power supply support circuits. Elevate your designs with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and ensures the protection of internal components, making this product ideal for long-term use.

Surface Mount: YES

Surface mount capability allows for easy installation and space-saving on PCBs, increasing efficiency in the assembly process.

Nominal Supply Voltage (Vsup): 3.3 V

Operates at a commonly used voltage level, making it compatible with a wide range of devices and power sources.

Maximum Operating Temperature: 85 °C

Can operate at high temperatures without compromising performance, suitable for industrial applications where heat dissipation is a concern.

Minimum Operating Temperature: -40 °C

Functions reliably in extreme cold conditions, ensuring consistent performance in various environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides excellent conductivity, corrosion resistance, and solderability, ensuring a reliable electrical connection.

No. of Terminals: 8

With a sufficient number of terminals, this product can handle multiple connections, enhancing its versatility in power management applications.

Minimum Supply Voltage (Vsup): 2.7 V

Accepts a lower supply voltage, allowing for flexibility in power input sources and compatibility with various devices.

Technical Specifications

Power Management ICs TPS2051BDR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current (Isup):

.07 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3.9 mm

Trade Compliance

TPS2051BDR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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