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T1630-600W

STMicroelectronics

T1630-600W by STMicroelectronics

STMicroelectronics T1630-600W is a single TRIAC with 16A RMS on-state current, 600V repetitive peak off-state voltage, and 30mA max DC gate trigger current. It is used in applications requiring snubberless TRIACs for AC power control at temperatures ranging from -40 °C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,986 parts In-Stock

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6,986

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Digiode

USA . 3,096 parts In-Stock

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3,096

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Anansix

USA . 2,217 parts In-Stock

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2,217

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,784 parts In-Stock

1+ parts

$2.339

100+ parts

-

1k+ parts

$2.105

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1,784

$2.339

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$2.105

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MKK Technologies

India . 288 parts In-Stock

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$4.398

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288

$4.398

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DigiPath Technology Company

USA . 288 parts In-Stock

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$4.398

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288

$4.398

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AZTECH Wire

Italy . 378 parts In-Stock

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$11.980

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378

$11.980

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Component Stockers USA

USA . 553 parts In-Stock

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$99.990

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553

$99.990

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Kepictronics

USA . 15,000 parts In-Stock

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15,000

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A-Z Elektronik GmbH

Germany . 5,142 parts In-Stock

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5,142

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Corphita

USA . 780 parts In-Stock

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780

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Parana Technologies

USA . 509 parts In-Stock

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$2.796

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509

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$2.796

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Overview

Experience superior quality and reliability with the T1630-600W by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics offers a Triode For Alternating Current (TRIAC) that delivers exceptional performance and durability. This product is perfect for a wide range of applications, providing customers with value and efficiency. With its snubberless design and UL recognition, the T1630-600W ensures peace of mind and optimal functionality. Upgrade to STMicroelectronics for premium quality and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the TRIAC, making it suitable for various operating conditions.

Maximum DC Gate Trigger Current: 30 mA

Allows for reliable triggering of the TRIAC, ensuring efficient and accurate switching in alternating current applications.

Configuration: SINGLE

Simplified design with a single configuration, making it easier to install and integrate into circuits.

Package Shape: RECTANGULAR

Compact and space-saving design, suitable for applications where size constraints are a concern.

Terminal Form: THROUGH-HOLE

Provides secure and stable connections, reducing the risk of disconnection in high vibration environments.

Maximum Leakage Current: 0.01 mA

Low leakage current ensures energy efficiency and minimal power loss during operation.

No. of Terminals: 3

Simple and straightforward connection setup with a limited number of terminals, reducing complexity during installation.

Package Style (Meter): FLANGE MOUNT

Easy mounting and installation with a flange mount style, suitable for various applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows for reliable performance in diverse environmental conditions.

Trigger Device Type: SNUBBERLESS TRIAC

Efficient and reliable trigger device type, suitable for high-frequency switching applications.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures, making it suitable for use in cold environments.

Terminal Finish: MATTE TIN

Provides corrosion resistance and ensures a reliable connection for long-term performance.

Terminal Position: SINGLE

Simplified terminal setup with a single position, making it easier to connect in circuits.

Maximum RMS On-state Current: 16 A

Capable of handling high currents, suitable for applications requiring robust performance.

Maximum DC Gate Trigger Voltage: 1.5 V

Low triggering voltage ensures efficient operation and minimizes power consumption.

Case Connection: ISOLATED

Isolated case connection provides safety and protection for the user during operation.

Repetitive Peak Off-state Voltage: 600 V

High off-state voltage rating ensures reliable performance and protection against voltage surges.

Minimum Critical Rate of Rise of Commutation Voltage: 20 V/us

Fast rate of rise of commutation voltage allows for quick and efficient switching, reducing power loss.

Minimum Critical Rate of Rise of Off-state Voltage: 300 V/us

Fast rate of rise of off-state voltage ensures rapid turn-off and minimal energy dissipation.

Reference Standard: UL RECOGNIZED

Compliance with UL standards ensures high quality and safety standards met in the product.

Technical Specifications

Triode For Alternating Current (TRIAC) T1630-600W attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Commutation Voltage:

20 V/us

Minimum Critical Rate of Rise of Off-state Voltage:

300 V/us

Maximum DC Gate Trigger Current:

30 mA

Maximum DC Gate Trigger Voltage:

1.5 V

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.01 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

16 A

Reference Standard:

UL RECOGNIZED

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T1630-600W Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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