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T1635H-600IRG

STMicroelectronics

T1635H-600IRG by STMicroelectronics

T1635H-600IRG by STMicroelectronics is a snubberless TRIAC designed for AC applications. It features a max RMS on-state current of 16 A, operates at up to 150 °C, and supports a repetitive peak off-state voltage of 600 V. Ideal for motor control and lighting systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,274 parts In-Stock

1+ parts

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7,274

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Digiode

USA . 4,210 parts In-Stock

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4,210

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Anansix

USA . 2,570 parts In-Stock

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2,570

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 534 parts In-Stock

1+ parts

$4.021

100+ parts

-

1k+ parts

$3.619

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534

$4.021

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$3.619

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MKK Technologies

India . 1,201 parts In-Stock

1+ parts

$7.562

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-

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1,201

$7.562

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DigiPath Technology Company

USA . 1,201 parts In-Stock

1+ parts

$7.562

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1,201

$7.562

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Ampacity Inc.

Singapore . 1,388 parts In-Stock

1+ parts

$15.100

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1,388

$15.100

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AZTECH Wire

Italy . 681 parts In-Stock

1+ parts

$16.010

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681

$16.010

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Component Stockers USA

USA . 438 parts In-Stock

1+ parts

$99.990

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438

$99.990

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Kepictronics

USA . 13,000 parts In-Stock

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13,000

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Corphita

USA . 858 parts In-Stock

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858

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Parana Technologies

USA . 811 parts In-Stock

1+ parts

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$4.808

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811

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$4.808

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Overview

Elevate your designs with the T1635H-600IRG from STMicroelectronics, a trusted leader in semiconductor solutions. This robust TRIAC ensures reliable performance in demanding environments, supporting applications from motor control to lighting systems. With its snubberless technology, it minimizes losses while enhancing efficiency. Choose STMicroelectronics for innovation and quality that transform your projects into success stories, delivering unparalleled value and durability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures robustness and resistance to environmental factors, making the TRIAC durable for various applications.

Maximum DC Gate Trigger Current: 35 mA

A high gate trigger current allows for reliable switching, making it suitable for applications requiring precise control.

Configuration: SINGLE

The single configuration allows for straightforward integration into circuits, simplifying design and implementation.

Package Shape: RECTANGULAR

The rectangular shape is compatible with many PCB layouts, offering flexibility in device placement.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical stability and are ideal for high-performance applications.

Maximum Leakage Current: 4.2 mA

Low leakage current contributes to energy efficiency, reducing power loss during operation.

No. of Terminals: 3

Having three terminals facilitates easier circuit designs and connections, enhancing usability.

Package Style (Meter): FLANGE MOUNT

Flange mount design allows for easy attachment and stability in industrial applications.

Maximum Operating Temperature: 150 °C

A high maximum operating temperature ensures reliable performance in demanding environments.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless design reduces the need for additional components, simplifying the circuit and minimizing costs.

Minimum Operating Temperature: -40 °C

A wide operating temperature range ensures functionality in extreme conditions, making it versatile for various applications.

Terminal Finish: MATTE TIN

Matte tin finish enhances solderability and provides protection against corrosion, ensuring long-term reliability.

Terminal Position: SINGLE

The single terminal position allows for straightforward wiring and installation in compact spaces.

Maximum RMS On-state Current: 16 A

The capability to handle high RMS on-state current makes this TRIAC suitable for high-power applications.

Maximum DC Gate Trigger Voltage: 1.3 V

A low gate trigger voltage simplifies the triggering process, improving overall energy efficiency in circuit designs.

Case Connection: ISOLATED

The isolated case connection minimizes the risk of short circuits, enhancing the safety of the device in operation.

Repetitive Peak Off-state Voltage: 600 V

High voltage capability allows this TRIAC to be used in high-voltage applications, providing versatile integration options.

Minimum Critical Rate of Rise of Off-state Voltage: 300 V/μs

A high critical rate of rise in off-state voltage ensures quick response times, beneficial for fast-switching applications.

Maximum Holding Current: 35 mA

With a manageable holding current, this TRIAC can operate effectively in various control applications without risk of latching.

Technical Specifications

Triode For Alternating Current (TRIAC) T1635H-600IRG attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

300 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

35 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

4.2 mA

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

16 A

Repetitive Peak Off-state Voltage:

600 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T1635H-600IRG Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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