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MAC218A10FP

Onsemi

MAC218A10FP by Onsemi

MAC218A10FP by Onsemi is a single TRIAC with 800V repetitive peak off-state voltage and 8A max RMS on-state current. It operates b/w -40 to 125 °C, suitable for 4 quadrant logic level applications. The package style is flange mount with through-hole terminals, UL recognized for various AC control systems.

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1k+

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Vyrian

USA . 2,472 parts In-Stock

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Digiode

USA . 132 parts In-Stock

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Component Electronics Inc.

Canada . 20 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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TANS Electronics

Latvia . 8,380 parts In-Stock

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Problanco Electronics

Mexico . 4,942 parts In-Stock

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Kulean Microsystems

USA . 4,918 parts In-Stock

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Corphita

USA . 1,932 parts In-Stock

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UHIMA Technologies

Türkiye . 338 parts In-Stock

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Corohmni

South Africa . 58 parts In-Stock

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SupplyDigital Components

Austria . 52 parts In-Stock

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Overview

Discover the power and reliability of the MAC218A10FP by Onsemi, a top-of-the-line TRIAC perfect for a wide range of applications. With a sturdy plastic/epoxy package body material and UL recognized standard, this single configuration device offers maximum RMS on-state current of 8 A and a repetitive peak off-state voltage of 800 V. From lighting control to motor speed regulation, this versatile TRIAC ensures smooth and efficient operation, giving you peace of mind and unmatched performance. Trust Onsemi for superior quality and value in every product they offer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the internal components of the TRIAC, making it a reliable choice for long-term use.

Maximum DC Gate Trigger Current: 50 mA

High gate trigger current ensures reliable switching performance, making the TRIAC suitable for a wide range of applications.

Configuration: SINGLE

Single configuration simplifies installation and operation of the TRIAC, making it user-friendly and easy to integrate into existing systems.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient PCB mounting and space-saving design, making the TRIAC ideal for compact applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering, ensuring reliable electrical connections for the TRIAC.

Maximum Leakage Current: 2 mA

Low leakage current helps minimize power loss and increases efficiency of the TRIAC, making it a cost-effective choice for energy-conscious applications.

No. of Terminals: 3

Three terminals provide versatile connectivity options for the TRIAC, allowing for flexible circuit design and compatibility with various systems.

Package Style (Meter): FLANGE MOUNT

Flange mount package style ensures secure mounting and efficient heat dissipation, enhancing the overall performance and reliability of the TRIAC.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance allows the TRIAC to withstand harsh environmental conditions, making it suitable for a wide range of industrial applications.

Trigger Device Type: 4 QUADRANT LOGIC LEVEL TRIAC

4 quadrant logic level TRIAC ensures precise and reliable switching performance, making the TRIAC suitable for demanding control applications with high accuracy requirements.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature tolerance enables the TRIAC to operate in cold environments without performance degradation, making it a versatile choice for varying temperature conditions.

Terminal Finish: TIN LEAD

Tin lead terminal finish ensures good conductivity and corrosion resistance, enhancing the overall durability and performance of the TRIAC.

Terminal Position: SINGLE

Single terminal position simplifies wiring and installation of the TRIAC, making it easy to integrate into different systems or circuit configurations.

Maximum RMS On-state Current: 8 A

High maximum RMS on-state current rating allows the TRIAC to handle heavy loads and high power applications, making it a reliable choice for demanding electrical setups.

Maximum DC Gate Trigger Voltage: 2 V

Low gate trigger voltage ensures efficient and reliable switching operation of the TRIAC, making it suitable for low-power control applications with precise triggering requirements.

Case Connection: ISOLATED

Isolated case connection enhances safety and protection for the TRIAC and surrounding components, making it a reliable choice for applications where electrical insulation is critical.

Repetitive Peak Off-state Voltage: 800 V

High repetitive peak off-state voltage rating ensures the TRIAC can withstand voltage fluctuations and surges, making it a reliable choice for applications with varying voltage conditions.

Maximum Holding Current: 50 mA

High maximum holding current ensures stable operation and prevents accidental turn-off of the TRIAC, making it a reliable choice for critical control applications where continuous conduction is required.

Reference Standard: UL RECOGNIZED

UL recognized reference standard certifies the quality and safety of the TRIAC, making it compliant with industry standards and suitable for use in a wide range of commercial and residential applications.

Technical Specifications

Triode For Alternating Current (TRIAC) MAC218A10FP attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from Onsemi

Specs

Case Connection:

Configuration:

Maximum DC Gate Trigger Current:

50 mA

Maximum DC Gate Trigger Voltage:

2 V

Maximum Holding Current:

50 mA

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e0

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

8 A

Reference Standard:

UL RECOGNIZED

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

MAC218A10FP Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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