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T1635-800G

STMicroelectronics

T1635-800G by STMicroelectronics

T1635-800G by STMicroelectronics is a snubberless TRIAC designed for efficient AC control. It features a max RMS on-state current of 16 A, repetitive peak off-state voltage of 800 V, and operates b/w -40 °C to 125°C. Ideal for power switching applications in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,467 parts In-Stock

1+ parts

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2,467

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Digiode

USA . 2,198 parts In-Stock

1+ parts

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1k+ parts

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2,198

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Vyrian

USA . 210 parts In-Stock

1+ parts

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100+ parts

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210

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,057 parts In-Stock

1+ parts

$2.677

100+ parts

-

1k+ parts

$2.409

10k+ parts

-

2,057

$2.677

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$2.409

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MKK Technologies

India . 1,872 parts In-Stock

1+ parts

$5.034

100+ parts

-

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10k+ parts

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1,872

$5.034

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DigiPath Technology Company

USA . 1,872 parts In-Stock

1+ parts

$5.034

100+ parts

-

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1,872

$5.034

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Corphita

USA . 4,485 parts In-Stock

1+ parts

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4,485

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Parana Technologies

USA . 258 parts In-Stock

1+ parts

-

100+ parts

$3.201

1k+ parts

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258

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$3.201

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Overview

Elevate your projects with the T1635-800G TRIAC from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This robust component delivers unmatched reliability and performance for AC control applications, making it ideal for home automation, motor control, and lighting systems. With its compact design and snubberless features, the T1635-800G ensures seamless integration and energy efficiency, empowering you to create smarter, more efficient designs that stand the test of time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides excellent protection against environmental factors, ensuring reliability in various applications.

Maximum DC Gate Trigger Current: 35 mA

The relatively high gate trigger current allows for effective operation in a variety of circuits, contributing to robust performance.

Configuration: SINGLE

A single configuration simplifies circuit design and implementation, making it ideal for compact applications.

Surface Mount: YES

Surface mount capability enhances ease of installation and allows for higher density circuit designs, important in modern electronics.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on PCBs, which is crucial for compact electronic designs.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering, enhancing the reliability of connections.

Maximum Leakage Current: 2 mA

Low leakage current ensures minimal power loss in the off state, making the device energy-efficient.

No. of Terminals: 2

With two terminals, this TRIAC is straightforward in design and use, suitable for typical TRIAC applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for high-density placement on boards, catering to the needs of compact designs.

Maximum Operating Temperature: 125 °C

The ability to operate at temperatures up to 125 °C ensures reliability in high-temperature environments.

Trigger Device Type: SNUBBERLESS TRIAC

The snubberless design minimizes losses and enhances efficiency, which is particularly beneficial in applications where space is limited.

Minimum Operating Temperature: -40 °C

A wide temperature range ensures the TRIAC performs well in harsh conditions, making it versatile for diverse applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and corrosion resistance, improving overall longevity and performance.

Terminal Position: SINGLE

Single terminal position simplifies PCB layout, making assembly and repairs easier.

Maximum RMS On-state Current: 16 A

The capability to handle up to 16 A ensures it can manage substantial loads, making it suitable for a variety of high-power applications.

Maximum DC Gate Trigger Voltage: 1.3 V

A low gate trigger voltage promotes compatibility with less complex circuitry while still allowing reliable operation.

Case Connection: MAIN TERMINAL 2

Main terminal connection simplifies the interconnection process in circuits, enhancing usability.

Repetitive Peak Off-state Voltage: 800 V

High off-state voltage capability ensures reliable isolation and performance even under demanding conditions.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

A high rate of rise limits the necessity for additional snubbing circuits, enhancing overall system efficiency.

Maximum Holding Current: 35 mA

A low holding current allows for easier control and triggering, making the TRIAC more functional in diverse circuits.

Technical Specifications

Triode For Alternating Current (TRIAC) T1635-800G attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

35 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

35 mA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Maximum Leakage Current:

2 mA

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

16 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

Trigger Device Type:

Trade Compliance

T1635-800G Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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