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T1630-800W

STMicroelectronics

T1630-800W by STMicroelectronics

T1630-800W by STMicroelectronics is a snubberless TRIAC designed for AC control applications. It features a max RMS on-state current of 16 A, repetitive peak off-state voltage of 800 V, and operates b/w -40 °C to 125 °C. Ideal for efficient power management in various electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,037 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,037

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-

-

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Anansix

USA . 2,720 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,720

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Digiode

USA . 1,026 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,026

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 516 parts In-Stock

1+ parts

$2.007

100+ parts

-

1k+ parts

$1.806

10k+ parts

-

516

$2.007

-

$1.806

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MKK Technologies

India . 300 parts In-Stock

1+ parts

$3.773

100+ parts

-

1k+ parts

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10k+ parts

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300

$3.773

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DigiPath Technology Company

USA . 300 parts In-Stock

1+ parts

$3.773

100+ parts

-

1k+ parts

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300

$3.773

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-

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Parana Technologies

USA . 690 parts In-Stock

1+ parts

-

100+ parts

$2.399

1k+ parts

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690

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$2.399

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Corphita

USA . 242 parts In-Stock

1+ parts

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242

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Overview

Elevate your projects with the T1630-800W TRIAC from STMicroelectronics, a leader in semiconductor innovation. Renowned for exceptional reliability and durability, this snubberless TRIAC ensures efficient performance in a variety of applications, from motor control to lighting dimming. With its robust design and superior quality standards, customers gain peace of mind and enhanced functionality, making it an invaluable addition to any electronic circuit. Discover the difference with STMicroelectronics!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures lightweight, durable construction while providing excellent insulation properties, making the TRIAC suitable for diverse applications.

Maximum DC Gate Trigger Current: 30 mA

A DC gate trigger current of 30 mA allows for efficient control of the TRIAC in various circuits, ensuring effective switching capabilities without requiring excessive current.

Configuration: SINGLE

The single configuration simplifies integration into circuits, making it easier to design and implement in various applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easy mounting and efficient use of space on printed circuit boards (PCBs).

Terminal Form: THROUGH-HOLE

Through-hole terminals ensure reliable mechanical and electrical connections, particularly important for high-power applications.

Maximum Leakage Current: 0.005 mA

A low maximum leakage current of 0.005 mA indicates minimal power loss and enhanced efficiency, making this TRIAC suitable for energy-sensitive applications.

No. of Terminals: 3

Having 3 terminals provides the necessary connections for operation while allowing for easier circuitry design.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure mounting in various applications and environments, contributing to overall reliability.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this TRIAC can function effectively in high-temperature environments, expanding its range of applications.

Trigger Device Type: SNUBBERLESS TRIAC

Being a snubberless type TRIAC improves performance by minimizing the risk of false triggering and enhancing reliability in noisy electrical environments.

Minimum Operating Temperature: -40 °C

The ability to operate at a minimum temperature of -40 °C ensures functionality in extreme cold environments, making the TRIAC versatile for various applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides excellent solderability and resistance to corrosion, enhancing long-term durability and reliability.

Terminal Position: SINGLE

A single terminal position simplifies circuit design and layout, making it easier to integrate into existing systems.

Maximum RMS On-state Current: 16 A

The high maximum RMS on-state current of 16 A indicates this TRIAC's capability of handling significant power loads, suitable for industrial applications.

Maximum DC Gate Trigger Voltage: 1.3 V

A low gate trigger voltage of 1.3 V allows for easy activation using standard control voltages, increasing compatibility with various control systems.

Case Connection: ISOLATED

An isolated case connection improves safety by preventing accidental short circuits and protecting sensitive components.

Repetitive Peak Off-state Voltage: 800 V

A high repetitive peak off-state voltage of 800 V enhances suitability for high-voltage applications, broadening the range of devices that can use this TRIAC.

Minimum Critical Rate of Rise of Off-state Voltage: 500 V/us

A minimum critical rate of rise of off-state voltage of 500 V/us allows for effective handling of high-speed switching without resulting in false triggering.

Maximum Holding Current: 50 mA

The maximum holding current of 50 mA provides efficient operation during steady-state conditions, allowing the TRIAC to maintain conduction under low load conditions.

Technical Specifications

Triode For Alternating Current (TRIAC) T1630-800W attributes and parameters. Explore more Triode For Alternating Current (TRIAC) devices from STMicroelectronics

Specs

Case Connection:

Configuration:

Minimum Critical Rate of Rise of Off-state Voltage:

500 V/us

Maximum DC Gate Trigger Current:

30 mA

Maximum DC Gate Trigger Voltage:

1.3 V

Maximum Holding Current:

50 mA

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

Maximum Leakage Current:

.005 mA

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

Qualification:

Not Qualified

Maximum RMS On-state Current:

16 A

Repetitive Peak Off-state Voltage:

800 V

Sub-Category:

TRIACs

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

Trigger Device Type:

Trade Compliance

T1630-800W Triggering Devices trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.30.00.80

SB

8541.30.00.80

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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