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STM706TDS6E

STMicroelectronics

STM706TDS6E by STMicroelectronics

STM706TDS6E by STMicroelectronics is a compact power management IC with a nominal voltage of 3.3V and operates in -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports supply voltages from 1.2V to 5.5V, ideal for industrial applications. Its thin profile design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,930 parts In-Stock

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3,930

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Digiode

USA . 3,098 parts In-Stock

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3,098

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Anansix

USA . 2,697 parts In-Stock

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2,697

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 191 parts In-Stock

1+ parts

$1.743

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191

$1.743

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IDEA Electronic Components Group

UK . 1,893 parts In-Stock

1+ parts

$9.153

100+ parts

-

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$8.238

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1,893

$9.153

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$8.238

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MKK Technologies

India . 596 parts In-Stock

1+ parts

$17.212

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596

$17.212

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DigiPath Technology Company

USA . 596 parts In-Stock

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$17.212

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596

$17.212

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AZTECH Wire

Italy . 280 parts In-Stock

1+ parts

$19.830

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280

$19.830

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Component Stockers USA

USA . 690 parts In-Stock

1+ parts

$99.990

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690

$99.990

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Vigor

Singapore . 2,367 parts In-Stock

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2,367

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Parana Technologies

USA . 1,332 parts In-Stock

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$10.944

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1,332

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$10.944

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Corphita

USA . 1,073 parts In-Stock

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1,073

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Overview

Elevate your designs with the STM706TDS6E from STMicroelectronics, a leader in innovative power management solutions. This compact and reliable IC ensures optimal energy efficiency, making it perfect for industrial applications that demand precision and durability. With its robust temperature range and exceptional build quality, you can trust it to enhance performance in various devices. Experience the benefits of cutting-edge technology that keeps your projects running smoothly and efficiently.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product reliable in various settings.

Surface Mount: YES

Surface mount compatibility allows for easier assembly and integration into modern PCB designs, enabling efficient space utilization.

Package Shape: SQUARE

The square package shape facilitates easy placement on PCBs, optimizing layout and potentially reducing production costs.

Nominal Supply Voltage (Vsup): 3.3 V

The 3.3V nominal supply voltage is standard in many applications, making this IC versatile for a wide range of electronic devices.

Power Supplies (V): 3.3/5

Dual supply voltage capability (3.3V and 5V) enhances flexibility, allowing it to operate in various environments and applications.

No. of Terminals: 8

Having 8 terminals allows for a compact design while still providing sufficient connectivity for functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile design save space on PCBs, making it ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

An operating temperature limit of 85 °C makes this IC suitable for industrial applications, where temperature conditions can be challenging.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C ensures reliability in extremely low-temperature environments, such as outdoor or industrial settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish enhances corrosion resistance and improves solderability for a more reliable connection.

Terminal Position: DUAL

Dual terminal positioning allows for easier soldering and better performance in high-density applications.

Maximum Seated Height: 1.1 mm

A maximum seated height of 1.1 mm is beneficial for low-profile applications, helping to maintain thin designs.

Width: 3 mm

The compact width of 3 mm aids in saving space on PCBs, ideal for miniaturized electronic devices.

Other IC type: POWER SUPPLY MANAGEMENT CIRCUIT

As a power supply management IC, it improves efficiency and stability in total power management in an electronic system.

Minimum Supply Voltage (Vsup): 1.2 V

A minimum supply voltage of 1.2 V broadens its application range, particularly for low-power devices.

Length: 3 mm

The compact length of 3 mm enables it to fit in tight spaces, making it suitable for various compact electronic designs.

Nominal Threshold Voltage (V): +3.08V

The threshold voltage of 3.08V ensures reliable operation and switching in the designated voltage range.

Temperature Grade: INDUSTRIAL

Being classified as industrial grade indicates suitability for harsh environments, ensuring robustness and longevity.

Maximum Supply Current (Isup): 0.06 mA

A maximum supply current of just 0.06 mA means lower power consumption, which is critical for battery-operated or energy-efficient applications.

Terminal Form: GULL WING

Gull wing terminal form allows for easy visual inspection and is widely used in surface mount technology for reliable connections.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for compatibility with a wide range of PCBs, offering flexibility in design.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V provides a safe operational margin for systems requiring higher voltage inputs, offering increased design flexibility.

Technical Specifications

Power Management ICs STM706TDS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 3.08V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.2 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+3.08V

Width (mm):

3 mm

Trade Compliance

STM706TDS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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