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STM704SM6E

STMicroelectronics

STM704SM6E by STMicroelectronics

STM704SM6E by STMicroelectronics is a versatile power management IC with a nominal voltage of 3.6V, operating in temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports power supplies of 3.3/5V. Ideal for industrial applications, it ensures reliable performance in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,104 parts In-Stock

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Digiode

USA . 4,041 parts In-Stock

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4,041

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Anansix

USA . 326 parts In-Stock

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326

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Distributors (Availability)

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Microchip USA

USA . 313 parts In-Stock

1+ parts

$3.359

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313

$3.359

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AZTECH Wire

Italy . 204 parts In-Stock

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$8.400

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204

$8.400

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IDEA Electronic Components Group

UK . 1,106 parts In-Stock

1+ parts

$22.857

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$20.572

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1,106

$22.857

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$20.572

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MKK Technologies

India . 934 parts In-Stock

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$42.982

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934

$42.982

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DigiPath Technology Company

USA . 934 parts In-Stock

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$42.982

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934

$42.982

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Component Stockers USA

USA . 775 parts In-Stock

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$99.990

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775

$99.990

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Vigor

Singapore . 4,593 parts In-Stock

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Corphita

USA . 3,215 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 543 parts In-Stock

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$27.330

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$27.330

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Overview

Unlock the power of efficiency with the STM704SM6E from STMicroelectronics—a leader in cutting-edge technology. This versatile Power Management IC ensures reliable performance in demanding environments, boasting superior quality and durability. Perfect for industrial applications, it offers exceptional energy savings and thermal resilience. Experience the benefits of precision and innovation that only STMicroelectronics can deliver, optimizing your designs while minimizing costs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Using plastic/epoxy materials ensures durability and resistance to environmental factors, enhancing reliability in various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and easier integration into modern PCB layouts, making it suitable for space-constrained applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates efficient use of board space and makes it easier to arrange and solder components on the PCB.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6 V provides a balance between performance and power efficiency, making it suitable for various electronic devices.

Power Supplies (V): 3.3/5

Supports multiple power supply voltages (3.3V and 5V), enhancing versatility across different applications.

No. of Terminals: 8

With 8 terminals, this IC offers sufficient connectivity for various applications while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board and is ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of operating in temperatures as low as -40 °C, it is suitable for harsh environments and applications requiring extended temperature ranges.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish offers excellent conductivity and corrosion resistance, ensuring long-term performance and reliability.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout design, allowing for better placement in mixed component environments.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm contributes to a low-profile design, ideal for space-constrained applications.

Width (mm): 3.9 mm

A compact width of 3.9 mm enhances design flexibility, allowing for the integration of more components in smaller PCBs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit IC, it is essential for maintaining stable voltage levels, crucial for reliable circuit operation.

Minimum Supply Voltage (Vsup): 1.1 V

A low minimum supply voltage of 1.1 V allows for operational efficiency in low-power applications.

Maximum Time At Peak Reflow Temperature (s): 40

A peak reflow time of 40 seconds ensures optimal soldering without damaging the IC, improving manufacturing yield.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability (260 °C) ensures compatibility with lead-free soldering processes, essential for modern manufacturing.

Length: 4.9 mm

A compact length of 4.9 mm helps optimize board space, making it easier to design small form-factor devices.

Nominal Threshold Voltage (V): +2.925V

A nominal threshold voltage of +2.925V is well-suited for various digital applications requiring stable voltage levels.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature compatibility ensures reliability in demanding environments, ideal for industrial and automotive applications.

Maximum Supply Current (Isup): 0.06 mA

A maximum supply current of 0.06 mA signifies low power consumption, which is key for battery-powered devices and energy-efficient systems.

Terminal Form: GULL WING

Gull wing terminals provide ease of mounting and soldering, allowing for efficient manufacturing processes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is a standard dimension that supports compatibility with various PCB designs and manufacturing techniques.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V allows it to support a wide range of applications, enhancing its versatility.

Technical Specifications

Power Management ICs STM704SM6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.925V

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.925V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM704SM6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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