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STM704RDS6E

STMicroelectronics

STM704RDS6E by STMicroelectronics

STM704RDS6E by STMicroelectronics is a compact power management IC with a nominal voltage of 3.6V and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages from 1.1V to 5.5V, ideal for industrial applications. Its small outline design ensures efficient space utilization in electronic devices.

Median Price

$2.940

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,602 parts In-Stock

1+ parts

$2.940

100+ parts

$2.166

1k+ parts

$1.844

10k+ parts

-

1,602

$2.940

$2.166

$1.844

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 763 parts In-Stock

1+ parts

$2.793

100+ parts

-

1k+ parts

-

10k+ parts

-

763

$2.793

-

-

-

Vyrian

USA . 2,647 parts In-Stock

1+ parts

$2.940

100+ parts

-

1k+ parts

-

10k+ parts

-

2,647

$2.940

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-

-

Anansix

USA . 831 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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831

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,297 parts In-Stock

1+ parts

$2.500

100+ parts

-

1k+ parts

-

10k+ parts

-

1,297

$2.500

-

-

-

Corphita

USA . 2,422 parts In-Stock

1+ parts

$2.646

100+ parts

-

1k+ parts

-

10k+ parts

-

2,422

$2.646

-

-

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Vigor

Singapore . 2,282 parts In-Stock

1+ parts

$2.920

100+ parts

-

1k+ parts

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10k+ parts

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2,282

$2.920

-

-

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IDEA Electronic Components Group

UK . 292 parts In-Stock

1+ parts

$15.097

100+ parts

-

1k+ parts

$13.587

10k+ parts

-

292

$15.097

-

$13.587

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MKK Technologies

India . 480 parts In-Stock

1+ parts

$28.389

100+ parts

-

1k+ parts

-

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480

$28.389

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-

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DigiPath Technology Company

USA . 480 parts In-Stock

1+ parts

$28.389

100+ parts

-

1k+ parts

-

10k+ parts

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480

$28.389

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-

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Parana Technologies

USA . 2,336 parts In-Stock

1+ parts

-

100+ parts

$18.051

1k+ parts

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10k+ parts

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2,336

-

$18.051

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Perfect Parts

USA . 2,120 parts In-Stock

1+ parts

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2,120

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Overview

Unlock superior performance with the STM704RDS6E from STMicroelectronics, a leader in power management solutions. This compact, high-quality IC ensures reliable operation across diverse industries, from industrial automation to telecommunications. Its robust design handles extreme temperatures, delivering efficiency and stability you can trust. Elevate your projects with enhanced power reliability and experience how STMicroelectronics sets the standard in innovation and quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and protection against environmental factors, making it suitable for a wide range of applications.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into automated assembly processes, saving space on the PCB.

Package Shape: SQUARE

The square package shape facilitates efficient layout on circuit boards, allowing for more effective use of space.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6 V allows for compatibility with common digital systems, enhancing versatility in various applications.

Power Supplies (V): 3/5

Supports both 3V and 5V power supplies, making it flexible for different design requirements and reducing the need for additional components.

No. of Terminals: 8

With 8 terminals, the IC offers sufficient connectivity options while keeping the design compact and manageable.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile enhance space efficiency, making it ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliability in moderately high-temperature environments, suitable for industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning down to -40 °C allows use in demanding environments, such as automotive and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish promotes superior electrical performance and corrosion resistance, ensuring longevity and reliability.

Terminal Position: DUAL

Dual terminal position enhances the design flexibility and simplifies routing on the PCB.

Maximum Seated Height: 1.1 mm

A maximum seated height of just 1.1 mm supports compact designs, allowing for more efficient use of vertical space.

Width: 3 mm

With a width of 3 mm, this IC can fit into tight spaces while still providing robust functionality.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it effectively manages power needs, ensuring stable operation and performance.

Minimum Supply Voltage (Vsup): 1.1 V

A low minimum supply voltage of 1.1 V allows use in battery-powered devices, extending battery life.

Length: 3 mm

A length of 3 mm complements the compact design, making it ideal for applications with limited board space.

Nominal Threshold Voltage (V): +2.625V

The nominal threshold voltage of +2.625V provides reliable operation within typical digital logic levels.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures robustness and reliability in tough operating conditions, suitable for a wide range of industries.

Maximum Supply Current (Isup): 0.06 mA

A very low maximum supply current of 0.06 mA makes this product energy-efficient, perfect for low-power applications.

Terminal Form: GULL WING

Gull wing terminal form allows for easy soldering and increases the reliability of connections in surface mount configurations.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for compact placement on the PCB while maintaining ease of soldering and assembly.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V enables compatibility with a variety of systems, providing flexibility in design.

Technical Specifications

Power Management ICs STM704RDS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.625V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.625V

Width (mm):

3 mm

Trade Compliance

STM704RDS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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