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STM703LM6F

STMicroelectronics

STM703LM6F by STMicroelectronics

STM703LM6F by STMicroelectronics is a Power Management IC with 5V nominal voltage. It features 8 terminals, operates in industrial temperature range (-40 to 85 °C), and has a max supply current of 0.06 mA. Ideal for applications requiring surface mount rectangular package style with small outline design.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,909 parts In-Stock

1+ parts

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2,909

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Anansix

USA . 2,848 parts In-Stock

1+ parts

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2,848

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Digiode

USA . 2,284 parts In-Stock

1+ parts

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2,284

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 497 parts In-Stock

1+ parts

$1.581

100+ parts

-

1k+ parts

$1.423

10k+ parts

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497

$1.581

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$1.423

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MKK Technologies

India . 1,647 parts In-Stock

1+ parts

$2.974

100+ parts

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1,647

$2.974

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DigiPath Technology Company

USA . 1,647 parts In-Stock

1+ parts

$2.974

100+ parts

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10k+ parts

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1,647

$2.974

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Parana Technologies

USA . 1,006 parts In-Stock

1+ parts

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100+ parts

$1.891

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1,006

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$1.891

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Corphita

USA . 373 parts In-Stock

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373

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Overview

Upgrade your power management capabilities with the STM703LM6F by STMicroelectronics. Designed with quality and precision, this Power Management IC offers reliable performance and efficiency for a wide range of applications. With its durable plastic/epoxy package body material and industrial-grade temperature grade, you can trust in the durability and longevity of this product. Whether you're working on consumer electronics or industrial systems, the STM703LM6F provides a seamless power solution with its small outline package style and dual terminal position. Say goodbye to power supply issues and hello to enhanced functionality with this versatile and high-performing Power Management IC from STMicroelectronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and durable package, making it suitable for various applications while keeping the overall weight of the device low.

Surface Mount: YES

Being surface mountable allows for easy and efficient assembly onto circuit boards, saving time and space in manufacturing processes.

Nominal Supply Voltage (Vsup): 5 V

Operating at a 5V nominal supply voltage provides compatibility with a wide range of electronic devices and systems.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85 °C, this power management IC can withstand elevated temperatures without compromising performance, making it suitable for various environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures reliable operation even in cold environments, increasing the versatility of this product.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold terminal finish improves conductivity and corrosion resistance, ensuring reliable connections and longevity of the product.

Maximum Supply Current (Isup): 0.06 mA

With a maximum supply current of 0.06 mA, this power management IC offers efficient power consumption, contributing to energy savings and longer battery life in portable devices.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for precise and secure connections on circuit boards, enhancing the reliability and performance of the device.

Technical Specifications

Power Management ICs STM703LM6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

STM703LM6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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