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STM704RDS6F

STMicroelectronics

STM704RDS6F by STMicroelectronics

STM704RDS6F by STMicroelectronics is a compact power management IC with a nominal voltage of 3.6V and operates in extreme temperatures from -40 °C to 85 °C. It features an 8-terminal gull-wing package, ideal for space-constrained applications. This device supports both 3V and 5V power supplies, making it versatile for industrial use.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,151 parts In-Stock

1+ parts

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7,151

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Digiode

USA . 2,488 parts In-Stock

1+ parts

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2,488

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Anansix

USA . 1,206 parts In-Stock

1+ parts

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1,206

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,188 parts In-Stock

1+ parts

$11.625

100+ parts

-

1k+ parts

$10.463

10k+ parts

-

1,188

$11.625

-

$10.463

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AZTECH Wire

Italy . 953 parts In-Stock

1+ parts

$20.470

100+ parts

-

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-

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953

$20.470

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MKK Technologies

India . 1,830 parts In-Stock

1+ parts

$21.860

100+ parts

-

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1,830

$21.860

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DigiPath Technology Company

USA . 1,830 parts In-Stock

1+ parts

$21.860

100+ parts

-

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-

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-

1,830

$21.860

-

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Advanced Electronics

New Zealand . 870 parts In-Stock

1+ parts

$28.686

100+ parts

$26.104

1k+ parts

$23.523

10k+ parts

-

870

$28.686

$26.104

$23.523

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Microchip USA

USA . 433 parts In-Stock

1+ parts

$30.005

100+ parts

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433

$30.005

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Vigor

Singapore . 6,592 parts In-Stock

1+ parts

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6,592

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Corphita

USA . 1,593 parts In-Stock

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1,593

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Parana Technologies

USA . 323 parts In-Stock

1+ parts

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$13.900

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323

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$13.900

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Overview

Unlock the power of efficiency with the STM704RDS6F from STMicroelectronics! Designed for robust performance in demanding applications, this reliable Power Management IC ensures seamless operation in a variety of environments. With its compact package and exceptional thermal characteristics, it delivers unmatched value for your projects. Trust STMicroelectronics’ commitment to quality and innovation, and elevate your designs with a component built for success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy offers good durability and performance, making this IC suitable for various applications.

Surface Mount: YES

Surface mount capability ensures compatibility with modern PCB designs, allowing for efficient and compact layouts.

Package Shape: SQUARE

The square shape facilitates better space utilization on PCBs, contributing to compact design.

Nominal Supply Voltage (Vsup): 3.6 V

A nominal supply voltage of 3.6 V fits well within the common voltage operating range, ensuring reliable performance.

Power Supplies (V): 3/5

Versatility with support for 3V and 5V power supplies makes this IC flexible for various applications.

No. of Terminals: 8

Having 8 terminals allows for multiple functionalities and easy integration into circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile and small outline are perfect for compact electronic designs, saving valuable board space.

Maximum Operating Temperature: 85 °C

Support for up to 85 °C operational temperature ensures reliability in moderately high-temperature environments.

Minimum Operating Temperature: -40 °C

The -40 °C minimum operating temperature makes this IC ideal for industrial and outdoor applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish offers good solderability and corrosion resistance, enhancing the IC's reliability.

Terminal Position: DUAL

Dual terminal position enhances flexibility in PCB layout and assembly processes.

Maximum Seated Height: 1.1 mm

A low maximum seated height allows for better integration in low-profile designs.

Width: 3 mm

Compact width contributes to space-efficient designs, essential for portable electronics.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, this IC is crucial for managing voltage and current for sensitive electronics.

Minimum Supply Voltage (Vsup): 1.1 V

The ability to operate at a minimum of 1.1 V allows for low-power applications, extending battery life.

Maximum Time At Peak Reflow Temperature (s): 30

30 seconds at peak reflow temperature ensures compatibility with modern manufacturing processes.

Peak Reflow Temperature °C: 260

At a peak reflow temperature of 260 °C, this IC can withstand high-heat soldering processes without damage.

Length: 3 mm

The 3 mm length complements the small form factor, suitable for compact devices.

Nominal Threshold Voltage (V): +2.625V

A nominal threshold voltage of +2.625V optimizes performance for typical digital logic levels.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature grade applications, ensuring consistent performance in demanding environments.

Maximum Supply Current (Isup): 0.06 mA

A maximum supply current of 0.06 mA supports energy-efficient designs, ideal for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections on PCBs.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm provides a balance between compact design and ease of manufacturing.

Maximum Supply Voltage (Vsup): 5.5 V

The ability to operate at a maximum of 5.5 V increases compatibility with a range of power systems.

Technical Specifications

Power Management ICs STM704RDS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.625V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.625V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

STM704RDS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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