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STM703M6E

STMicroelectronics

STM703M6E by STMicroelectronics

STM703M6E by STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 1V to 5.5V, with a max temp of 85 °C and features an 8-terminal gull-wing package. Ideal for efficient power supply support in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,180 parts In-Stock

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7,180

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Digiode

USA . 2,076 parts In-Stock

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2,076

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Anansix

USA . 1,388 parts In-Stock

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1,388

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Bristol Electronics

USA . 1,210 parts In-Stock

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1,210

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Dan-Mar Components

USA . 1,210 parts In-Stock

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1,210

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ComSIT Distribution GmbH

Germany . 600 parts In-Stock

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600

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IDEA Electronic Components Group

UK . 267 parts In-Stock

1+ parts

$2.794

100+ parts

-

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$2.515

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267

$2.794

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$2.515

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Ampacity Inc.

Singapore . 684 parts In-Stock

1+ parts

$4.500

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684

$4.500

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MKK Technologies

India . 284 parts In-Stock

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$5.254

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284

$5.254

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DigiPath Technology Company

USA . 284 parts In-Stock

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$5.254

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284

$5.254

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AZTECH Wire

Italy . 1,191 parts In-Stock

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$20.940

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$20.940

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Microchip USA

USA . 267 parts In-Stock

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$30.384

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267

$30.384

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Component Stockers USA

USA . 497 parts In-Stock

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$99.990

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497

$99.990

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Parana Technologies

USA . 2,116 parts In-Stock

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$3.341

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$3.341

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Vigor

Singapore . 1,179 parts In-Stock

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Corphita

USA . 422 parts In-Stock

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Overview

Empower your designs with the STM703M6E from STMicroelectronics, a leader in reliable power management solutions. Engineered for unparalleled performance in demanding environments, this compact IC delivers exceptional efficiency and stability across a wide temperature range. With its robust design and minimal footprint, it’s perfect for industrial applications, providing you with peace of mind and unmatched value to elevate your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction ensures durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount capability facilitates easy integration into modern circuit designs, ensuring efficient use of board space.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout and allows for efficient placement on PCBs, contributing to a compact design.

Nominal Supply Voltage (Vsup): 5 V

A nominal supply voltage of 5V is standard for a wide range of electronic applications, making this IC versatile.

Power Supplies (V): 5

Compatible with common power supplies, enhancing the reliability and integration into existing designs.

No. of Terminals: 8

The 8-terminal configuration provides sufficient connections for functionality while maintaining a compact footprint.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, balancing performance and size.

Maximum Operating Temperature: 85 °C

An operating temperature up to 85 °C ensures stable performance in moderately harsh environments.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this IC is suitable for applications in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances solderability and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position aids in efficient pin distribution and placement on circuit boards, ideal for flexibility in designs.

Maximum Seated Height: 1.75 mm

A low maximum seated height of 1.75 mm contributes to a slimmer profile for compact device designs.

Width: 3.9 mm

A narrow width of 3.9 mm is conducive for high-density layouts while allowing effective thermal management.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC is specifically designed for power supply support, making it an optimal choice for power management tasks.

Minimum Supply Voltage (Vsup): 1 V

A low minimum supply voltage of 1V allows compatibility with various battery-operated and low-power devices.

Maximum Time At Peak Reflow Temperature (s): 40

A peak reflow time allowance of 40 seconds provides flexibility in the soldering process, reducing the risk of damage.

Peak Reflow Temperature (°C): 260

A peak reflow temperature of 260 °C supports various reflow soldering processes, ensuring strong solder joints.

Length: 4.9 mm

The compact length of 4.9 mm makes it ideal for applications with size constraints while maintaining functionality.

Nominal Threshold Voltage (V): +4.65V

A threshold voltage of +4.65V allows precise voltage regulation, enhancing the performance of connected components.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures the IC's reliability in demanding environments, suitable for a wide range of applications.

Maximum Supply Current (Isup): 0.06 mA

A low maximum supply current of 0.06 mA contributes to energy efficiency, making it ideal for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals facilitate easier handling and soldering, enhancing assembly efficiency on production lines.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm strikes a balance between ease of manufacturing and compact design, improving layout flexibility.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides a safe headroom for the IC, ensuring operation within specified limits.

Technical Specifications

Power Management ICs STM703M6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTGE IS 4.65V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.65V

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

STM703M6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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