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STM703DS6F

STMicroelectronics

STM703DS6F by STMicroelectronics

STM703DS6F by STMicroelectronics is a compact power management IC designed for industrial applications. It operates within a supply voltage range of 1V to 5.5V, with a max temp of 85 °C and features an 8-terminal gull-wing package. Ideal for efficient power supply support in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,414 parts In-Stock

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2,414

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Digiode

USA . 235 parts In-Stock

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235

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Anansix

USA . 166 parts In-Stock

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166

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 921 parts In-Stock

1+ parts

$11.054

100+ parts

-

1k+ parts

$9.948

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921

$11.054

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$9.948

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MKK Technologies

India . 863 parts In-Stock

1+ parts

$20.786

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863

$20.786

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DigiPath Technology Company

USA . 863 parts In-Stock

1+ parts

$20.786

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863

$20.786

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Corphita

USA . 4,912 parts In-Stock

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4,912

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Parana Technologies

USA . 1,410 parts In-Stock

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$13.216

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1,410

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$13.216

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Overview

Elevate your designs with the STM703DS6F from STMicroelectronics, a leader in power management solutions. This compact and reliable IC ensures optimal performance across a temperature range of -40 °C to 85 °C, making it perfect for industrial applications. With its robust construction and dual terminal design, you gain efficiency and durability, driving innovation in your projects. Trust in STMicroelectronics' expertise for quality and reliability that enhances your products’ value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures enhanced reliability and protection for the internal components.

Surface Mount: YES

Surface mount technology allows for efficient space utilization on PCBs, making it suitable for compact designs.

Package Shape: SQUARE

The square shape simplifies layout and component placement on the circuit board, promoting ease of assembly.

Nominal Supply Voltage (Vsup): 5 V

Operates at a standard 5V supply voltage, making it compatible with a wide range of applications.

Power Supplies (V): 5

Designed to work efficiently with 5V power supplies, confirming its utility in typical electronic applications.

No. of Terminals: 8

With 8 terminals, this IC provides a balance between functionality and simplicity, easy integration into designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile enable high-density mounting on PCBs, ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

Capable of operating at temperatures up to 85 °C makes it suitable for both commercial and industrial environments.

Minimum Operating Temperature: -40 °C

Functioning down to -40 °C ensures reliability in harsh environments, perfect for industrial applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The premium terminal finish provides excellent conductivity and resistance to corrosion, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positions offer more design flexibility, facilitating better layout options on the PCB.

Maximum Seated Height: 1.1 mm

The low seated height contributes to a thinner profile on the board, maintaining a sleek design.

Width (mm): 3 mm

Compact width makes it compatible with other small components, ideal for miniaturized electronic designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Specialized as a power supply support circuit, it is tailored for efficient power management in various applications.

Minimum Supply Voltage (Vsup): 1 V

Supports operations down to 1V, allowing flexibility in various low-voltage applications.

Length: 3 mm

The short length offers optimized space usage, further enhancing the capability for compact design.

Nominal Threshold Voltage (V): +4.65V

A nominal threshold voltage that allows reliable operation in a range of electronic circuits.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability for demanding environments, making it suitable for critical applications.

Maximum Supply Current (Isup): 0.06 mA

Low supply current minimizes energy consumption, making it an eco-friendly choice for power management.

Terminal Form: GULL WING

Gull wing terminal design enhances solderability and reduces stress on the joints during assembly.

Terminal Pitch: 0.65 mm

The terminal pitch allows for fine-pitch layouts, improving compactness in board design and arrangements.

Maximum Supply Voltage (Vsup): 5.5 V

Supporting a maximum supply voltage of 5.5V ensures compatibility with a range of power supply systems.

Technical Specifications

Power Management ICs STM703DS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTGE IS 4.65V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.65V

Width (mm):

3 mm

Trade Compliance

STM703DS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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