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STM704DS6F

STMicroelectronics

STM704DS6F by STMicroelectronics

STM704DS6F by STMicroelectronics is a compact power management IC with a nominal voltage of 5V and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports applications requiring reliable power supply regulation. Ideal for industrial use, it ensures efficient performance in tight spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,649 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,649

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Anansix

USA . 2,305 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,305

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Digiode

USA . 1,576 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,576

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,241 parts In-Stock

1+ parts

$15.199

100+ parts

-

1k+ parts

$13.679

10k+ parts

-

2,241

$15.199

-

$13.679

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MKK Technologies

India . 474 parts In-Stock

1+ parts

$28.581

100+ parts

-

1k+ parts

-

10k+ parts

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474

$28.581

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DigiPath Technology Company

USA . 474 parts In-Stock

1+ parts

$28.581

100+ parts

-

1k+ parts

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10k+ parts

-

474

$28.581

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Corphita

USA . 2,367 parts In-Stock

1+ parts

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2,367

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Parana Technologies

USA . 1,761 parts In-Stock

1+ parts

-

100+ parts

$18.173

1k+ parts

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10k+ parts

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1,761

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$18.173

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Overview

Elevate your designs with the STM704DS6F from STMicroelectronics, a trusted leader in power management solutions. This compact and robust IC ensures reliable performance across temperatures, making it ideal for industrial applications. With its efficient energy use and superior build quality, you’ll enjoy enhanced stability and longevity in your projects. Choose STM704DS6F for unmatched reliability and elevate your product’s performance to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material provides robust protection against environmental factors, ensuring the longevity and reliability of the IC.

Surface Mount: YES

Surface mount technology enables compact designs and ease of integration into modern electronic circuits.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB space and facilitates proper heat dissipation.

Nominal Supply Voltage (Vsup): 5 V

A standard nominal supply voltage of 5V makes this IC compatible with widely used power supply systems, enhancing its usability.

Power Supplies (V): 5

Supports a consistent nominal power supply of 5V, ensuring reliable performance across various applications.

No. of Terminals: 8

With 8 terminals, the IC provides sufficient connectivity options for versatile circuit designs, improving installation flexibility.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A small outline and thin profile make this IC suitable for space-constrained applications, enabling compact and efficient device designs.

Maximum Operating Temperature: 85 °C

The IC operates reliably even at high temperatures, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Operational efficiency at low temperatures ensures it can function in harsh environments, thus expanding its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances corrosion resistance, ensuring stable electrical connections over time.

Terminal Position: DUAL

Dual terminal positioning aids in effective heat dissipation and improves ease of soldering during the assembly process.

Maximum Seated Height: 1.1 mm

A low seated height allows for integration into slim device designs, making it ideal for modern compact electronics.

Width: 3 mm

A small width supports high-density PCB layouts, facilitating compact architecture in electronic devices.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically as a power supply support circuit, it enhances efficiency and stability in power management applications.

Minimum Supply Voltage (Vsup): 1 V

A minimum supply voltage of 1V enables operation in low-power conditions, making it suitable for energy-efficient designs.

Length: 3 mm

The compact length is beneficial for space constraints in various applications while maintaining efficient performance.

Nominal Threshold Voltage (V): +4.4V

A nominal threshold voltage of +4.4V ensures precision in voltage level detection, enhancing overall circuit reliability.

Temperature Grade: INDUSTRIAL

Industrial-grade specifications guarantee extended operational lifespan and reliability under varying environmental conditions.

Maximum Supply Current (Isup): 0.06 mA

Low maximum supply current contributes to energy efficiency, making it ideal for battery-powered applications.

Terminal Form: GULL WING

Gull wing terminals are easy to solder and provide stable connections, minimizing assembly challenges.

Terminal Pitch: 0.65 mm

A controlled terminal pitch allows for high-density layout without sacrificing connectivity integrity.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides flexibility in power source options while maintaining safety margins.

Technical Specifications

Power Management ICs STM704DS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTGE IS 4.4V; MANUAL RESET INPUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+4.4V

Width (mm):

3 mm

Trade Compliance

STM704DS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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