Loading...

STM704SDS6E

STMicroelectronics

STM704SDS6E by STMicroelectronics

STM704SDS6E by STMicroelectronics is a compact power management IC with a nominal voltage of 3.6V and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing package and supports voltages from 1.1V to 5.5V, ideal for industrial applications. Its small outline design ensures efficient space utilization in electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,028 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,028

-

-

-

-

Vyrian

USA . 1,440 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,440

-

-

-

-

Anansix

USA . 885 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

885

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,297 parts In-Stock

1+ parts

$9.608

100+ parts

-

1k+ parts

$8.647

10k+ parts

-

1,297

$9.608

-

$8.647

-

MKK Technologies

India . 1,837 parts In-Stock

1+ parts

$18.066

100+ parts

-

1k+ parts

-

10k+ parts

-

1,837

$18.066

-

-

-

DigiPath Technology Company

USA . 1,837 parts In-Stock

1+ parts

$18.066

100+ parts

-

1k+ parts

-

10k+ parts

-

1,837

$18.066

-

-

-

Corphita

USA . 4,314 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,314

-

-

-

-

Parana Technologies

USA . 1,036 parts In-Stock

1+ parts

-

100+ parts

$11.487

1k+ parts

-

10k+ parts

-

1,036

-

$11.487

-

-

Overview

Elevate your power management solutions with the STM704SDS6E from STMicroelectronics, a trusted leader in innovative semiconductor technologies. This compact, high-quality IC is designed for exceptional reliability and efficiency, operating seamlessly across various applications from industrial automation to consumer electronics. Experience the peace of mind that comes with ST's rigorous quality standards, ensuring optimal performance while saving space and power—perfect for your next project!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material enhances reliability and ensures good performance in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for compact design and easier placement in automated manufacturing processes.

Package Shape: SQUARE

The square package shape optimizes space on the PCB, facilitating efficient layout designs.

Nominal Supply Voltage (Vsup): 3.6 V

The 3.6 V nominal supply voltage is suitable for a wide range of applications, ensuring compatibility with common systems.

Power Supplies (V): 3.3/5

The dual supply voltage capability (3.3/5 V) accommodates diverse applications, enhancing design flexibility.

No. of Terminals: 8

Eight terminals provide ample connectivity options, allowing for effective integration into various circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile make it ideal for space-constrained designs, such as portable and handheld devices.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in demanding environments, perfect for industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate in temperatures as low as -40 °C makes it suitable for harsh climates and outdoor applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and provides corrosion resistance, ensuring long-term performance.

Terminal Position: DUAL

The dual terminal position enhances mounting stability and facilitates better connections on the PCB.

Maximum Seated Height: 1.1 mm

The low seated height allows for a compact design, making it ideal for slim devices.

Width (mm): 3 mm

A compact width of 3 mm contributes to space efficiency in modern electronic designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

As a power supply support circuit, it effectively manages voltage and current, ensuring stable operation of connected components.

Minimum Supply Voltage (Vsup): 1.1 V

The ability to operate down to 1.1 V expands its applicability to low-power systems and battery-operated devices.

Length: 3 mm

The compact length aids in small form factor designs, aligning with trends towards miniaturization in electronics.

Nominal Threshold Voltage (V): +2.925V

The threshold voltage of +2.925 V allows for precise control in power management applications.

Temperature Grade: INDUSTRIAL

A temperature grade of industrial signifies robust design for continuous operation in various industrial settings.

Maximum Supply Current (Isup): 0.06 mA

The low maximum supply current indicates a power-efficient design, ideal for low-energy applications.

Terminal Form: GULL WING

Gull wing terminal form enhances surface mount capability and simplifies PCB assembly.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm strikes a balance between compact design and ease of soldering.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5 V provides flexibility for higher voltage applications while maintaining safety.

Technical Specifications

Power Management ICs STM704SDS6E attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.925V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.925V

Width (mm):

3 mm

Trade Compliance

STM704SDS6E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19