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STM704SDS6F

STMicroelectronics

STM704SDS6F by STMicroelectronics

STM704SDS6F by STMicroelectronics is a compact power management IC with a nominal voltage of 3.6V and operates b/w -40 °C to 85 °C. It features an 8-terminal gull-wing design, supporting voltages from 1.1V to 5.5V. Ideal for industrial applications, it ensures efficient power supply support in space-constrained environments.

Median Price

$1.683

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3,965 parts In-Stock

1+ parts

$1.606

100+ parts

$1.533

1k+ parts

$1.460

10k+ parts

$1.435

3,965

$1.606

$1.533

$1.460

$1.435

Chip1Stop

Japan . 4,000 parts In-Stock

1+ parts

$1.760

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

$1.760

-

-

-

Mouser Electronics

USA . 3,660 parts In-Stock

1+ parts

$4.700

100+ parts

$2.410

1k+ parts

$1.750

10k+ parts

$1.520

3,660

$4.700

$2.410

$1.750

$1.520

Avnet

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Verical

USA . 3,965 parts In-Stock

1+ parts

-

100+ parts

$1.533

1k+ parts

$1.460

10k+ parts

$1.435

3,965

-

$1.533

$1.460

$1.435

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,610 parts In-Stock

1+ parts

$1.027

100+ parts

-

1k+ parts

-

10k+ parts

-

4,610

$1.027

-

-

-

Vyrian

USA . 910 parts In-Stock

1+ parts

$1.028

100+ parts

-

1k+ parts

-

10k+ parts

-

910

$1.028

-

-

-

Chip Stock

USA . 5,490 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,490

-

-

-

-

Anansix

USA . 2,430 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,430

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,666 parts In-Stock

1+ parts

$0.973

100+ parts

-

1k+ parts

-

10k+ parts

-

3,666

$0.973

-

-

-

Vigor

Singapore . 4,147 parts In-Stock

1+ parts

$1.930

100+ parts

-

1k+ parts

-

10k+ parts

-

4,147

$1.930

-

-

-

IDEA Electronic Components Group

UK . 1,902 parts In-Stock

1+ parts

$9.890

100+ parts

-

1k+ parts

$8.901

10k+ parts

-

1,902

$9.890

-

$8.901

-

MKK Technologies

India . 413 parts In-Stock

1+ parts

$18.598

100+ parts

-

1k+ parts

-

10k+ parts

-

413

$18.598

-

-

-

DigiPath Technology Company

USA . 413 parts In-Stock

1+ parts

$18.598

100+ parts

-

1k+ parts

-

10k+ parts

-

413

$18.598

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 27,920 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

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27,920

-

-

-

-

Kepictronics

USA . 12,364 parts In-Stock

1+ parts

-

100+ parts

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12,364

-

-

-

-

Perfect Parts

USA . 11,731 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

-

11,731

-

-

-

-

Microchip USA

USA . 9,443 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,443

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,351

-

-

-

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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3,500

-

-

-

-

Parana Technologies

USA . 2,141 parts In-Stock

1+ parts

-

100+ parts

$11.825

1k+ parts

-

10k+ parts

-

2,141

-

$11.825

-

-

Metaverse IC Inc.

Canada . 1,017 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,017

-

-

-

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Overview

Elevate your designs with the STM704SDS6F from STMicroelectronics, a leader in cutting-edge power management solutions. This compact and reliable IC is engineered to ensure optimal performance across diverse applications, from industrial automation to consumer electronics. With its robust temperature range and energy efficiency, it enhances system reliability while minimizing power consumption. Trust in STMicroelectronics' legacy of innovation to empower your projects with exceptional quality and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easier integration into compact PCB designs, enhancing overall performance and efficiency.

Package Shape: SQUARE

A square package shape optimizes space utilization on circuit boards and improves thermal performance.

Nominal Supply Voltage (Vsup): 3.6 V

With a nominal supply voltage of 3.6 V, this IC is ideal for a wide range of power management applications.

Power Supplies (V): 3.3/5

Compatibility with both 3.3V and 5V supplies makes this IC versatile for different system requirements.

No. of Terminals: 8

The 8-terminal configuration allows for multiple connections within a compact design, facilitating efficient circuit layout.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

A thin profile and small outline package ensure minimal space consumption and compatibility with high-density designs.

Maximum Operating Temperature: 85 °C

Rated for operation up to 85 °C, this IC can function reliably in a variety of environments, including industrial applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this product is suitable for harsh conditions, ensuring consistent performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and prevents oxidation, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility on PCBs, allowing for optimal design configurations.

Maximum Seated Height: 1.1 mm

A low seated height of 1.1 mm is advantageous for space-constrained applications, allowing for a compact device profile.

Width: 3 mm

The 3 mm width makes it ideal for applications where space is at a premium, contributing to miniaturized designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

Designed specifically for power supply support, this IC excels in efficiency and stability, enhancing overall system performance.

Minimum Supply Voltage (Vsup): 1.1 V

Operating down to 1.1 V allows integration in low-voltage systems, broadening the range of potential applications.

Maximum Time At Peak Reflow Temperature (s): 30

A peak reflow time of 30 seconds supports flexible manufacturing processes, accommodating various soldering methods.

Peak Reflow Temperature °C: 260

Withstanding peak temperatures of 260 °C ensures reliability during assembly and compatibility with lead-free soldering.

Length: 3 mm

The 3 mm length complements its width for a compact form factor, making it versatile for small devices.

Nominal Threshold Voltage (V): +2.925V

A nominal threshold voltage of +2.925V provides a stable operating point for precise power management.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this IC guarantees reliability in demanding environments and long-term performance.

Maximum Supply Current (Isup): 0.06 mA

A maximum supply current of only 0.06 mA indicates low power consumption, making it ideal for energy-sensitive applications.

Terminal Form: GULL WING

Gull wing terminal form enhances solder joint reliability, reducing the risk of mechanical failure in PCB assemblies.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm allows for closer terminal placement, contributing to space-efficient designs.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides robustness against voltage fluctuations, ensuring stable operation across applications.

Technical Specifications

Power Management ICs STM704SDS6F attributes and parameters. Explore more Power Management ICs devices from STMicroelectronics

Specs

Additional Features:

RESET THRESHOLD VOLTAGE IS 2.925V

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Power Management Circuits

Maximum Supply Current (Isup):

.06 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.1 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Nominal Threshold Voltage (V):

+2.925V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

3 mm

Trade Compliance

STM704SDS6F Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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