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TPS2051BDGNRG4

Texas Instruments

TPS2051BDGNRG4 by Texas Instruments

TPS2051BDGNRG4 by Texas Instruments is a Power Management IC with 8 terminals, operating at temperatures from -40 to 85°C. It supports a supply voltage range of 2.7V to 5.5V and has a max supply current of 0.07mA. This IC is ideal for industrial applications requiring power supply support circuits in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 26,250 parts In-Stock

1+ parts

-

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26,250

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Digiode

USA . 3,083 parts In-Stock

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3,083

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Vyrian

USA . 2,811 parts In-Stock

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2,811

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Nova Conductors

Japan . 69 parts In-Stock

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69

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 179 parts In-Stock

1+ parts

$1.729

100+ parts

-

1k+ parts

$2.312

10k+ parts

-

179

$1.729

-

$2.312

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ChromeModa Solutions

Germany . 4,298 parts In-Stock

1+ parts

$1.943

100+ parts

$1.593

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-

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4,298

$1.943

$1.593

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IDEA Electronic Components Group

UK . 1,288 parts In-Stock

1+ parts

$1.943

100+ parts

-

1k+ parts

$1.749

10k+ parts

-

1,288

$1.943

-

$1.749

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One Stop Electronics

USA . 537 parts In-Stock

1+ parts

$2.500

100+ parts

-

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537

$2.500

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Semicontronic

India . 722 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

10k+ parts

-

722

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 641 parts In-Stock

1+ parts

$5.500

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-

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641

$5.500

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AZTECH Wire

Italy . 750 parts In-Stock

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$8.716

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750

$8.716

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Corohmni

South Africa . 642 parts In-Stock

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$20.538

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642

$20.538

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Advanced Electronics

New Zealand . 16 parts In-Stock

1+ parts

$23.375

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$22.206

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$22.206

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16

$23.375

$22.206

$22.206

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Kepictronics

USA . 6,000 parts In-Stock

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Corphita

USA . 4,221 parts In-Stock

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Microchip USA

USA . 3,267 parts In-Stock

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Continental Prestige Electronics

USA . 2,851 parts In-Stock

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Argo Parts USA

USA . 2,548 parts In-Stock

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2,548

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DigiPath Technology Company

USA . 1,426 parts In-Stock

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$1.752

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1,426

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$1.752

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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$0.153

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$0.153

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$0.153

500

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$0.153

$0.153

$0.153

Perfect Parts

USA . 410 parts In-Stock

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410

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Bastille Electronics

Australia . 92 parts In-Stock

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Modulus Dynamics

Lithuania . 50 parts In-Stock

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50

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Overview

Power up your devices with the TPS2051BDGNRG4 by Texas Instruments, a leading manufacturer in the Power Management ICs category. This innovative product offers exceptional quality and reliability, making it the perfect choice for a wide range of applications. From industrial to consumer electronics, this power supply support circuit provides the optimal performance and efficiency you need. Trust Texas Instruments to deliver cutting-edge technology that meets your requirements and exceeds your expectations. Choose the TPS2051BDGNRG4 for superior power management solutions that enhance the value of your products.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Enables easy and efficient installation on circuit boards, saving time during assembly.

Nominal Supply Voltage (Vsup): 3.3 V

Suitable for a wide range of applications and compatible with many devices that require this voltage.

No. of Terminals: 8

Sufficient number of terminals for connecting various components, offering flexibility in circuit design.

Maximum Operating Temperature: 85 °C

Allows the product to operate efficiently in high-temperature environments without compromising performance.

Minimum Operating Temperature: -40 °C

Ensures the product can function reliably even in extremely cold conditions.

Terminal Finish: Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Provides good conductivity and corrosion resistance, enhancing the overall reliability of the product.

Maximum Seated Height: 1.1 mm

Compact design allows for space-saving installation in electronic devices.

Width (mm): 3 mm

Small form factor makes it suitable for applications where space is limited.

Minimum Supply Voltage (Vsup): 2.7 V

Offers a range of supply voltage options for different applications, increasing versatility.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliable performance in demanding conditions.

Maximum Supply Current (Isup): 0.07 mA

Efficient power management with low supply current consumption, reducing energy usage.

Terminal Form: GULL WING

Facilitates easy soldering and connection to circuit boards, simplifying the assembly process.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a wide range of supply voltages, making it compatible with various devices and systems.

Technical Specifications

Power Management ICs TPS2051BDGNRG4 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

UNDERVOLTAGE LOCKOUT

Adjustable Threshold:

NO

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Current (Isup):

.07 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

3 mm

Trade Compliance

TPS2051BDGNRG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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