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BQ79616PAPRQ1

Texas Instruments

BQ79616PAPRQ1 by Texas Instruments

BQ79616PAPRQ1 by Texas Instruments is a Power Management IC with 64 terminals in a square package. It operates b/w -40 to 125°C, suitable for automotive applications. With a max supply voltage of 80V, it features gull wing terminals and is surface mountable.

Median Price

$13.440

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,934 parts In-Stock

1+ parts

$9.770

100+ parts

$7.965

1k+ parts

$5.310

10k+ parts

-

8,934

$9.770

$7.965

$5.310

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Mouser Electronics

USA . 1,933 parts In-Stock

1+ parts

$13.440

100+ parts

$9.100

1k+ parts

$8.310

10k+ parts

-

1,933

$13.440

$9.100

$8.310

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DigiKey

USA . 678 parts In-Stock

1+ parts

$13.440

100+ parts

$9.094

1k+ parts

$8.311

10k+ parts

-

678

$13.440

$9.094

$8.311

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,164 parts In-Stock

1+ parts

$9.282

100+ parts

-

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3,164

$9.282

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$9.555

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10

$9.555

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Chip Stock

USA . 36,350 parts In-Stock

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36,350

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Cyclops Electronics Ltd

UK . 7,000 parts In-Stock

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VNN

France . 3,829 parts In-Stock

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Vyrian

USA . 3,687 parts In-Stock

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3,687

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 7,350 parts In-Stock

1+ parts

$8.300

100+ parts

$8.092

1k+ parts

$8.051

10k+ parts

-

7,350

$8.300

$8.092

$8.051

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Ampacity Inc.

Singapore . 3,978 parts In-Stock

1+ parts

$8.300

100+ parts

-

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3,978

$8.300

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Corohmni

South Africa . 911 parts In-Stock

1+ parts

$8.571

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911

$8.571

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Corphita

USA . 2,202 parts In-Stock

1+ parts

$8.793

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-

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2,202

$8.793

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Continental Prestige Electronics

USA . 5,536 parts In-Stock

1+ parts

$9.555

100+ parts

-

1k+ parts

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10k+ parts

$9.364

5,536

$9.555

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$9.364

Netroflash

USA . 50 parts In-Stock

1+ parts

$9.555

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50

$9.555

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$13.449

100+ parts

$12.776

1k+ parts

$12.776

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1,000

$13.449

$12.776

$12.776

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Parana Technologies

USA . 711 parts In-Stock

1+ parts

$18.650

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$18.742

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711

$18.650

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$18.742

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DigiPath Technology Company

USA . 439 parts In-Stock

1+ parts

$20.536

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439

$20.536

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ChromeModa Solutions

Germany . 5,256 parts In-Stock

1+ parts

$20.955

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$17.183

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5,256

$20.955

$17.183

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IDEA Electronic Components Group

UK . 1,550 parts In-Stock

1+ parts

$20.955

100+ parts

$19.907

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$18.860

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1,550

$20.955

$19.907

$18.860

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Lixinc

USA . 9,510 parts In-Stock

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Argo Parts USA

USA . 4,908 parts In-Stock

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GreenTree Electronics

Israel . 3,000 parts In-Stock

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Formix International (Excess)

India . 2,000 parts In-Stock

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Robosynatics

Brazil . 450 parts In-Stock

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$0.021

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$0.021

450

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$0.021

$0.021

$0.021

Lucentia Tech

USA . 400 parts In-Stock

1+ parts

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$4.122

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$4.122

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$4.122

400

-

$4.122

$4.122

$4.122

iodParts Technologies Inc.

India . 137 parts In-Stock

1+ parts

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$6.557

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137

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$6.557

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Overview

Elevate your power management solutions with the BQ79616PAPRQ1 by Texas Instruments. As a trusted manufacturer in the industry, Texas Instruments delivers top-quality Power Management ICs designed for various applications. This square-shaped IC boasts a package body material of PLASTIC/EPOXY, ensuring durability and reliability. With a wide operating temperature range and high maximum supply voltage, this IC is perfect for automotive use. Experience the value and benefits of this product, offering superior performance and efficiency to meet all your power management needs. Upgrade your system today with Texas Instruments BQ79616PAPRQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Being surface mountable, this IC is easy to install and saves space on the PCB, making it suitable for compact designs.

Package Shape: SQUARE

The square package shape allows for efficient use of PCB real estate, contributing to a more streamlined layout for the overall system.

No. of Terminals: 64

With 64 terminals, this IC offers ample connectivity options for interfacing with various external components and peripherals.

Package Style: FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The combination of flatpack, heat sink/slug, thin profile, and fine pitch package styles enhances thermal performance and overall reliability of the IC.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the IC can withstand harsh environmental conditions and extended operation without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables this IC to function reliably in cold environments, expanding its application range.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability and stable performance.

Terminal Position: QUAD

The quad terminal position facilitates easy soldering and assembly, enhancing the overall manufacturability of the product.

Maximum Seated Height: 1.2 mm

With a low maximum seated height, this IC can be integrated into space-constrained designs while maintaining a compact form factor.

Width (mm): 10 mm

The 10mm width of this IC allows for easy integration into standard PCB layouts, making it compatible with a wide range of system designs.

Other IC type: POWER SUPPLY SUPPORT CIRCUIT

This IC's power supply support circuit ensures efficient power delivery and management, enhancing the overall performance and reliability of the system.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and assembly during manufacturing, leading to a high-quality end product.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability of 260°C makes this IC suitable for lead-free soldering processes, aligning with modern environmental standards.

Length: 10 mm

The 10mm length of this IC contributes to its compact form factor, enabling space-efficient integration into various electronic devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets stringent temperature requirements and reliability standards, making it an ideal choice for automotive electronics.

Terminal Form: GULL WING

The gull-wing terminal form offers strong mechanical stability during assembly and operation, enhancing the overall durability of the IC.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5mm, this IC allows for high-density mounting on the PCB, enabling efficient use of space and improved signal routing.

Moisture Sensitivity Level (MSL): 3

The MSL 3 rating indicates that this IC has moderate sensitivity to moisture, making it suitable for a wide range of environments and storage conditions.

Maximum Supply Voltage (Vsup): 80 V

With a maximum supply voltage of 80V, this IC can handle a wide range of input voltages, making it versatile for different power supply configurations.

Technical Specifications

Power Management ICs BQ79616PAPRQ1 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

HQFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

80 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

10 mm

Trade Compliance

BQ79616PAPRQ1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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